Abstract: The technology generally relates to disaggregating memory from an application specific integrated circuit (“ASIC”) package. For example, a high-bandwidth memory (“HBM”) optics module package may be connected to an ASIC package via one or more optical links. The HBM optics module package may include HBM dies(s), HBM chiplet(s) and an optical chiplet. The optical chiplet may be configured to connect the HBM optics module to one or more optical fibers that form an optical link with one or more other components of the ASIC package. By including an optical chiplet in the HBM optics module package, the HBM optics module package may be disaggregated from an ASIC package.

Abstract: A memory architecture and a processing unit that incorporates the memory architecture and a systolic array. The memory architecture includes: memory array(s) with multi-port (MP) memory cells; first wordlines connected to the cells in each row; and, depending upon the embodiment, second wordlines connected to diagonals of cells or diagonals of sets of cells. Data from a data input matrix is written to the memory cells during first port write operations using the first wordlines and read out from the memory cells during second port read operations using the second wordlines. Due to the diagonal orientation of the second wordlines and due to additional features (e.g., additional rows of memory cells that store static zero data values or read data mask generators that generate read data masks), data read from the memory architecture and input directly into a systolic array is in the proper order, as specified by a data setup matrix.

Abstract: A memory device includes a memory array of memory cells, wordlines and bitlines connected to the memory cells, a first read multiplexor and a second read multiplexor connected to the bitlines, a first sense amplifier connected to the first read multiplexor, a second sense amplifier connected to the second read multiplexor, a first data path connected to the first sense amplifier, and a second data path connected to the second sense amplifier. Each of the memory cells is connected to only one pair of the bitlines and only one of the wordlines. The first read multiplexor is adapted to connect the first sense amplifier to the bitlines during a first portion of a clock cycle and the second read multiplexor is adapted to connect the second sense amplifier to the bitlines during a second portion of a clock cycle that is different from the first portion of the clock cycle.

Abstract: Systems and methods are provided for implementing customer-transparent logic redundancy in scan chains for improved yield of integrated circuits. More specifically, an integrated circuit structure is provided for that includes a plurality of combined latch structures. Each of the combined latch structures includes an original latch and a redundant latch. The integrated circuit structure further includes a plurality of combined logic structures. Each of the combined logic structures includes an original logic structure a redundant logic structure. Each redundant latch is a duplicate of each respective original latch within a combined latch structure and each redundant logic structure is a duplicate of each respective original logic structure within a combined logic structure such that a two-fold library of latches and logic is provided for one or more scan chains of the integrated circuit structure.

Abstract: A memory device includes a memory array of memory cells, wordlines and bitlines connected to the memory cells, a first read multiplexor and a second read multiplexor connected to the bitlines, a first sense amplifier connected to the first read multiplexor, a second sense amplifier connected to the second read multiplexor, a first data path connected to the first sense amplifier, and a second data path connected to the second sense amplifier. Each of the memory cells is connected to only one pair of the bitlines and only one of the wordlines. The first read multiplexor is adapted to connect the first sense amplifier to the bitlines during a first portion of a clock cycle and the second read multiplexor is adapted to connect the second sense amplifier to the bitlines during a second portion of a clock cycle that is different from the first portion of the clock cycle.

Abstract: The present disclosure relates to a structure including a read controller configured to receive a burst enable signal and a word line pulse signal, identify consecutive read operations from storage cells accessed via a word line, precharge bit lines once during consecutive, sequential reads, and hold the word line active through N?1 of the consecutive read operations, and N is an integer number of the consecutive read operations.

Abstract: The present disclosure relates to a structure including a first delay path circuit which is configured to receive an input signal and is connected to a complement transistor of a twin cell transistor pair through a complement bitline signal, a second delay path circuit which is configured to receive the input signal and is connected to a true transistor of the twin cell transistor pair through a true bitline signal, and a logic circuit which is configured to receive a first output of the first delay path circuit and a second output of the second delay path circuit and output a data output signal.

Abstract: A barrier or “crackstop” that is configured to conduct electrical signals. These configurations may form a wall around integrated, active circuitry of a semiconductor die. This wall may include a conductor that follows a three-dimensional pathway from one side to the other side of the wall. This pathway may have sections that overlap, or double-back, so that portions of the conductor overlap along their individual length. These sections prevent crack propagation internal to the wall.

Abstract: A memory device includes a memory array of memory cells, wordlines and bitlines connected to the memory cells, a first read multiplexor and a second read multiplexor connected to the bitlines, a first sense amplifier connected to the first read multiplexor, a second sense amplifier connected to the second read multiplexor, a first data path connected to the first sense amplifier, and a second data path connected to the second sense amplifier. Each of the memory cells is connected to only one pair of the bitlines and only one of the wordlines. The first read multiplexor is adapted to connect the first sense amplifier to the bitlines during a first portion of a clock cycle and the second read multiplexor is adapted to connect the second sense amplifier to the bitlines during a second portion of a clock cycle that is different from the first portion of the clock cycle.

Abstract: An adder includes a primary carry bit generation circuit and a summing circuit. The primary carry bit generation circuit is configured to generate first carry bits for a first number of pairs of bits from first and second operands, and to generate second carry bits for a second number of pairs of bits from the first and second operands. The second number of pairs being different than the first number of pairs. The summing circuit is configured to generate first sums by adding bits of pairs from the first and second number of pairs and the first and second carry bits. The summing circuit is configured to generate second sums by adding bits of other pairs of the bits from first and second operands than the pairs in the first and second number of pairs and additional carry bits generated when adding the bits of the other pairs.

Abstract: Ternary content addressable memory (TCAM) structures and methods of use are disclosed. The memory architecture includes one or more ternary content addressable memory (TCAM) fields, and control logic that applies progressively discriminating data-masking and scores a closeness of a match based on matched and mismatched bits.

Abstract: A memory device includes a memory array of memory cells, wordlines and bitlines connected to the memory cells, a first read multiplexor and a second read multiplexor connected to the bitlines, a first sense amplifier connected to the first read multiplexor, a second sense amplifier connected to the second read multiplexor, a first data path connected to the first sense amplifier, and a second data path connected to the second sense amplifier. Each of the memory cells is connected to only one pair of the bitlines and only one of the wordlines. The first read multiplexor is adapted to connect the first sense amplifier to the bitlines during a first portion of a clock cycle and the second read multiplexor is adapted to connect the second sense amplifier to the bitlines during a second portion of a clock cycle that is different from the first portion of the clock cycle.

Abstract: Systems and methods are provided for implementing customer-transparent logic redundancy in scan chains for improved yield of integrated circuits. More specifically, an integrated circuit structure is provided for that includes a plurality of combined latch structures. Each of the combined latch structures includes an original latch and a redundant latch. The integrated circuit structure further includes a plurality of combined logic structures. Each of the combined logic structures includes an original logic structure a redundant logic structure. Each redundant latch is a duplicate of each respective original latch within a combined latch structure and each redundant logic structure is a duplicate of each respective original logic structure within a combined logic structure such that a two-fold library of latches and logic is provided for one or more scan chains of the integrated circuit structure.

Abstract: A structure includes a multi-port memory including a multiple transistor bitcell single ended read port and a write port, a read circuit which is connected to a multiple transistor bitcell circuit and is also configured to evaluate the multiple transistor bitcell single ended read port, and a timer circuit for the single ended read port and which is configured to generate two successive read pulses in one clock cycle for the multi-port memory.

Abstract: Systems and methods are provided for implementing customer-transparent logic redundancy in scan chains for improved yield of integrated circuits. More specifically, an integrated circuit structure is provided for that includes a plurality of combined latch structures. Each of the combined latch structures includes an original latch and a redundant latch. The integrated circuit structure further includes a plurality of combined logic structures. Each of the combined logic structures includes an original logic structure a redundant logic structure. Each redundant latch is a duplicate of each respective original latch within a combined latch structure and each redundant logic structure is a duplicate of each respective original logic structure within a combined logic structure such that a two-fold library of latches and logic is provided for one or more scan chains of the integrated circuit structure.

Abstract: The present disclosure relates to a structure including a first delay path circuit which is configured to receive an input signal and is connected to a complement transistor of a twin cell transistor pair through a complement bitline signal, a second delay path circuit which is configured to receive the input signal and is connected to a true transistor of the twin cell transistor pair through a true bitline signal, and a logic circuit which is configured to receive a first output of the first delay path circuit and a second output of the second delay path circuit and output a data output signal.

Abstract: The present disclosure relates to a structure including a memory built-in self test (MBIST) circuit which is configured to repair a multi-cell failure for a plurality of patterns in a single wordline of a sliding window of a memory.

Abstract: A structure includes a multi-port memory including a multiple transistor bitcell single ended read port and a write port, a read circuit which is connected to a multiple transistor bitcell circuit and is also configured to evaluate the multiple transistor bitcell single ended read port, and a timer circuit for the single ended read port and which is configured to generate two successive read pulses in one clock cycle for the multi-port memory.

Abstract: A memory architecture and a processing unit that incorporates the memory architecture and a systolic array. The memory architecture includes: memory array(s) with multi-port (MP) memory cells; first wordlines connected to the cells in each row; and, depending upon the embodiment, second wordlines connected to diagonals of cells or diagonals of sets of cells. Data from a data input matrix is written to the memory cells during first port write operations using the first wordlines and read out from the memory cells during second port read operations using the second wordlines. Due to the diagonal orientation of the second wordlines and due to additional features (e.g., additional rows of memory cells that store static zero data values or read data mask generators that generate read data masks), data read from the memory architecture and input directly into a systolic array is in the proper order, as specified by a data setup matrix.

Abstract: A barrier or “crackstop” that is configured to conduct electrical signals. These configurations may form a wall around integrated, active circuitry of a semiconductor die. This wall may include a conductor that follows a three-dimensional pathway from one side to the other side of the wall. This pathway may have sections that overlap, or double-back, so that portions of the conductor overlap along their individual length. These sections prevent crack propagation internal to the wall.