Abstract: A semiconductor device is provided, which comprises a semiconductor layer over an insulating surface, and an insulating layer over the semiconductor layer. The semiconductor layer includes at least two element regions, and an element separation region. The element separation region is disposed between the two element regions. The element separation region includes at least one impurity element selected from the group consisting of oxygen, nitrogen, and carbon. The element separation region has higher resistance than a first source and drain regions included in one of the two element regions and a second source and drain regions included in the other of the two element regions.

Abstract: To provide a highly reliable semiconductor device and a method for manufacturing the semiconductor device, where defects such as a short between a gate electrode layer and a semiconductor layer and a leakage current, which would otherwise be caused due to a coverage defect of the semiconductor layer with an insulating layer, can be prevented. In order to form a plurality of semiconductor elements over an insulating surface, a semiconductor layer is not separated into a plurality of island-shape semiconductor layers, but instead, element isolation regions, which electrically insulate a plurality of element regions functioning as semiconductor elements, are formed in one semiconductor layer, i.e., a first element isolation region with high resistance and a second element isolation region which has a contact with the element region and has a conductivity type opposite to that of the source and drain regions of the element region.

Abstract: The present invention provides a method for manufacturing a display device having a TFT that can be operated at high speed while using a small number of photomasks and improving the utilization efficiency of materials, where the threshold value is difficult to be varied. In the invention, a catalytic element is applied to an amorphous semiconductor film and the amorphous semiconductor film is heated to form a crystalline semiconductor film. After removing the catalytic element from the crystalline semiconductor film, a top-gate type thin film transistor with a planar structure is manufactured. Moreover, by using the droplet discharging method where an element of a display device is formed selectively, the process can be simplified, and loss of materials can be reduced.

Abstract: The present invention provides a game machine in which the decoration is highly effective. In the present invention, a display screen through which the player can see a game board is provided in front of the game board. The player can see the game board behind the display screen while enjoying an image on the display screen. A plurality of display screens may be provided to overlap each other and a display screen can be also mounted to the game board. Therefore, a various complicated image can be displayed. In addition, an input means can be provided to the display screen with which a player can change a game state.

Abstract: [Object] The invention provides a method of fabricating a semiconductor device having an inversely staggered TFT capable of high-speed operation, which has few variations of the threshold. In addition, the invention provides a method of fabricating a semiconductor device with high throughput where the cost reduction is achieved with few materials.

Abstract: Conductive layers having knots are adjacently formed with uniform distance therebetween. Droplets of the conductive layers are discharged to stagger centers of the droplets in a length direction of wirings so that the centers of the discharged droplets are not on the same line in a line width direction between the adjacent conductive layers. Since the centers of the droplets are staggered, parts of the conductive layers each having a widest line width (the widest width of knot) are not connected to each other, and the conductive layers can be formed adjacently with a shorter distance therebetween.

Abstract: To provide a semiconductor device and a display device which can be manufactured through a simplified process and the manufacturing technique. Another object is to provide a technique by which a pattern of wirings or the like which is partially constitutes a semiconductor device or a display device can be formed with a desired shape with controllability.

Abstract: The present invention provides a method for manufacturing a display device having a TFT that can be operated at high speed while using a small number of photomasks and improving the utilization efficiency of materials, where the threshold value is difficult to be varied. In the invention, a catalytic element is applied to an amorphous semiconductor film and the amorphous semiconductor film is heated to form a crystalline semiconductor film. After removing the catalytic element from the crystalline semiconductor film, a top-gate type thin film transistor with a planar structure is manufactured. Moreover, by using the droplet discharging method where an element of a display device is formed selectively, the process can be simplified, and loss of materials can be reduced.

Abstract: A manufacturing method of a display device having TFTs capable of high-speed operation with few variations of threshold voltage is provided, in which materials are used with high efficiency and a small number of photomasks is required.