Abstract: Disclosed are a sound virtualization method and apparatus. The sound virtualization method includes generating virtual sound devices, generating virtual audio devices on the basis of an audio device, acquiring a mapping relation between sounds created by the virtual sound device and sounds output by the virtual audio device, acquiring the sounds from memories on the basis of the mapping relation, and outputting the sounds through the virtual audio devices according to the mapping relation. Accordingly, it is possible to provide sound to a plurality of users.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: The present invention relates to a heat-shrinkable polyester film, which has a heat-shrinkage of 20% or more in both the longitudinal and transverse directions when treated with 80° C. water for 30 seconds and a bidirectional balance parameter in the range of 0.25 to 2.5 and exhibits an excellent properties in die-cutting and removing from a container such as a glass bottle for recycling by washing with hot water.

Abstract: Disclosed is a system for servicing game streaming, including: a server for servicing streaming game configured to receive game input data and hardware performance information from a user terminal device and service video streaming or merging streaming coupling the video streaming and graphics streaming according to the received performance of the user terminal device; and a database configured to store a background screen and characters for a game streaming service of the server for servicing streaming game.

Abstract: Disclosed herein is an apparatus and method for providing an agent-based game service. The apparatus for providing an agent-based game service includes an input data management unit for collecting pieces of input data from a terminal device of at least one user. A data mining unit analyzes patterns of the pieces of input data and then generates and updates mined data according to the result of the pattern analysis. A game agent processing unit creates, using the mined data, a game agent which will replace the user and play a game instead of the user, and evolves the game agent to correspond to the updated mined data.

Abstract: Disclosed herein are a method of reusing physics simulation results and a game service apparatus using the method. The game service apparatus includes a game service management server, a physics simulation index server, a physics computation cluster, and a rendering server. The game service management server manages physics simulation data corresponding to a game service. The physics simulation index server creates a spatial index structure corresponding to the physics simulation data, and performs spatial indexing for a user area using the spatial index structure. The physics computation cluster performs initial global simulation on the physics simulation data, manages initial global simulation results as reuse data, and performs local simulation on spatial indexing results for the user area. The rendering server merges the reuse data with local simulation results, renders merging results, and provides a game image to a user.

Abstract: A back sheet for a solar cell, consisting of a polyester comprising at least one repeating unit of trimethylene naphthalate and trimethylene terephthalate in an amount of 85% by weight or more, has improved hydrolysis-resistance and is useful in the field requiring weatherability.

Abstract: Disclosed is a biosensor coated with an electroactive polymer layer demonstrating a bending behavior, more specifically a biosensor including an electroactive polymer layer coated on the surface of a bioreceptor and an electrode connected to the electroactive polymer layer. When an electrical stimulation is applied to the electrode, the electroactive polymer layer shows a bending behavior and thus the surface of the bioreceptor can be exposed to an analyte to allow a concentration analysis of the analyte. When used as an implantable biosensor, the disclosed biosensor may have a substantially increased life span since the bioreceptor can be selectively exposed to the analyte.

Abstract: Disclosed is a biosensor to which an electroactive polymer layer is attached, more specifically, a biosensor including an electroactive polymer layer attached to the surface of a bioreceptor and electrodes connected to the electroactive polymer layer, which allows reversible deformation of the electroactive polymer layer when an electrical stimulation is applied to the electrode and can thereby analyze the concentration of an analyte when the surface of the bioreceptor is exposed to the analyte. When used as an implantable biosensor, the disclosed biosensor is advantageous in that the time period for which and the frequency with which the bioreceptor is exposed to the analyte can be adjusted, and thus the lifespan of the biosensor is considerably extended.

Abstract: A method of manufacturing a thin film transistor array panel is provided, which includes: forming a semiconductor layer of polysilicon on an insulating substrate; forming a gate insulating layer on the semiconductor layer; forming a gate electrode on the gate insulating layer; forming a source region and a drain region by doping conductive impurities in the semiconductor layer; forming an interlayer insulating layer covering the gate electrode; forming a source electrode and a drain electrode respectively connected to the source and the drain regions; forming a passivation layer covering the source and the drain electrodes; forming a pixel electrode connected to the drain electrode; and forming a first alignment key when forming one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode, wherein one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode is at least formed by photol

Abstract: A method of interconnecting semiconductor devices by using capillary motion, thereby simplifying fabricating operations, reducing fabricating costs, and simultaneously filling of through-silicon-vias (TSVs) and interconnecting semiconductor devices. The method includes preparing a first semiconductor device in which first TSVs are formed, positioning solder balls respectively on the first TSVs, performing a back-lap operation on the first semiconductor device, positioning a second semiconductor device, in which second TSVs are formed, above the first semiconductor device on which the solder balls are positioned, and performing a reflow operation such that the solder balls fill the first and second TSVs due to capillary motion.

Abstract: A method of manufacturing a thin film transistor array panel is provided, which includes: forming a semiconductor layer of polysilicon on an insulating substrate; forming a gate insulating layer on the semiconductor layer; forming a gate electrode on the gate insulating layer; forming a source region and a drain region by doping conductive impurities in the semiconductor layer; forming an interlayer insulating layer covering the gate electrode; forming a source electrode and a drain electrode respectively connected to the source and the drain regions; forming a passivation layer covering the source and the drain electrodes; forming a pixel electrode connected to the drain electrode; and forming a first alignment key when forming one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode, wherein one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode is at least formed by photol

Abstract: Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a plurality of magazines is stored in the input stacker. The magazines stored in the input stacker are moved to the input module and are introduced into the heating unit by the moving unit. Solder balls provided on the processing objects within the heating unit are quickly processed using an induction heating method. The processing objects that have undergone a reflow process are loaded in a magazine on an output module of the unloader unit and are then stored in an output stacker.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: A method of manufacturing a thin film transistor array panel is provided, which includes: forming a semiconductor layer of polysilicon on an insulating substrate; forming a gate insulating layer on the semiconductor layer; forming a gate electrode on the gate insulating layer; forming a source region and a drain region by doping conductive impurities in the semiconductor layer; forming an interlayer insulating layer covering the gate electrode; forming a source electrode and a drain electrode respectively connected to the source and the drain regions; forming a passivation layer covering the source and the drain electrodes; forming a pixel electrode connected to the drain electrode; and forming a first alignment key when forming one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode, wherein one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode is at least formed by photol

Abstract: Provided are a method and apparatus for determining a block mode using bit-generation probability estimation in motion picture coding. In H.264 video coding for Internet protocol (IP)-television (TV), the method and apparatus first determine whether or not a current block mode is a skip mode or a direct-prediction mode using bit-generation probability estimation, thereby reducing the amount of computation. By minimizing the amount of computation for determining a block mode, it is possible to increase an encoding rate and also minimize deterioration in image quality.

Abstract: The present invention relates to a hearing aid having feedback signal reduction function.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.