Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: In an embodiment of the invention, a device for manufacturing a wafer-level package includes a wafer sawing unit, a sorting unit, a pickup unit, and a placing unit. The wafer sawing unit cuts a wafer into wafer-level packages. The sorting unit performs a sorting process on the wafer-level packages to judge whether each of the wafer-level packages is normal or not. The pickup unit picks up the normal wafer-level packages. The placing unit stores the normal wafer-level packages in a storage case. The sawing process, the sorting process, and the placing process for the wafer-level package can be automatically performed within one device, thus a processing time reduction, a processing accuracy increase, and manpower reduction are achieved compared with the case where the processes are performed manually.

Abstract: Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is positioned in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.

Abstract: A method of manufacturing a thin film transistor array panel is provided, which includes: forming a semiconductor layer of polysilicon on an insulating substrate; forming a gate insulating layer on the semiconductor layer; forming a gate electrode on the gate insulating layer; forming a source region and a drain region by doping conductive impurities in the semiconductor layer; forming an interlayer insulating layer covering the gate electrode; forming a source electrode and a drain electrode respectively connected to the source and the drain regions; forming a passivation layer covering the source and the drain electrodes; forming a pixel electrode connected to the drain electrode; and forming a first alignment key when forming one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode, wherein one selected from the semiconductor layer, the gate electrode, the source and the drain electrodes, and the pixel electrode is at least formed by photol

Abstract: A method and system are provided for speech recognition. The speech recognition method includes the steps of preparing training data representing acoustic parameters of each of phonemes at each time frame; receiving an input signal representing a sound to be recognized and converting the input signal to input data; comparing the input data at each frame with the training data of each of the phonemes to derive a similarity measure of the input data with respect to each of the phonemes; and processing the similarity measures obtained in the comparing step using a neural net model governing development of activities of plural cells to conduct speech recognition of the input signal.

Abstract: Provided is a refrigerator including an adiabatic space formed on an inner surface of a chilling chamber door and an ice machine disposed inside the adiabatic space, thereby enabling a more efficient usage of an inner space of the refrigerator. Also, the present invention provides a cooling air passage structure of a refrigerator for properly supplying cooling air for freezing to an inside of the refrigerator having an ice machine disposed on an inner surface of a chilling chamber door.

Abstract: Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is position in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.

Abstract: The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.

Abstract: Disclosed is a dispenser for a refrigerator, which enables an effective usage of the inner space of the refrigerator and enables to always provide fresh water to a user. The dispenser (50) includes: a first pipe (51) connected with a water supply source; a reservoir (52) installed inside a door of the refrigerator and connected with the first pipe (51), for temporarily storing water supplied from the water supply source; a second pipe (53) connected with the reservoir (52); and a discharging part (54) installed in the door of the refrigerator and connected with the second pipe (53), for discharging the water supplied from the reservoir (52) depending on a user's necessity.

Abstract: Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is positioned in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.

Abstract: The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

Abstract: The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

Abstract: Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is positioned in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.

Abstract: The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

Abstract: Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is positioned in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.

Abstract: The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

Abstract: A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

Abstract: A laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated. The pre-scriber can be a rotating blade.

Abstract: Disclosed is a process for effecting liquid-phase hydrogenation of MAN to GBL in high conversion and high selectivity. The present invention provides an improved process of catalytic hydrogenation for converting MAN or SA to GBL in the liquid phase in the presence of a noble metal (palladium-molybdenum-nickel) catalyst supported on silica having a large surface area. The catalytic hydrogenation is conducted at a temperature of 150 to 250° C. and under a pressure of 50 to 150 kg/cm2.

Abstract: Disclosed is a liquid crystal display panel capable of being cut by a laser light. The liquid crystal display panel according to the present invention includes a substrate having a buffer layer between a conducting layer and an inner surface of the substrate, in which the buffer layer is disposed along a cutting line and spreads a crack and edges of the conducting layer is positioned in a region defined by the cutting line. Further, a method for manufacturing the liquid crystal display panel is disclosed, in which the liquid crystal display panel is machined by a laser cutter and a laser grinder.