Patents by Inventor In-Gyu Baek

In-Gyu Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10438529
    Abstract: A display device includes: a display panel including a display area, and a peripheral area disposed in the vicinity of the display area; a scan driver including a plurality of stages integrated on the peripheral area; a plurality of gate lines connected to the plurality of stages, respectively; and a plurality of pixel rows in the display area and connected with the plurality of gate lines, respectively. The plurality of stages and the plurality of pixel rows are each arranged in a first direction in a line, the peripheral area includes a fan-out region between the plurality of stages and the plurality of pixel rows, and at least one of the plurality of gate lines in the fan-out region is inclined with respect to the first direction, and a second direction perpendicular to the first direction.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung-Soo Baek, Se Hyoung Cho, Dong-Gyu Kim, Dong-Hyeon Ki
  • Patent number: 10433437
    Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: October 1, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Chang Baek, Hyeong Sam Son, Chang Jin Song, Chang Hyeok Shin, Sung Ho Cho, Chong Kun Cho, Han Gyu Hwang, Min Woo Yoo
  • Publication number: 20190292091
    Abstract: The present invention provides a glass wool cutting device. The device includes a cutting section housing that has a cutting section chamber, a feed port that is connected to the cutting section chamber, and a discharge port that is connected to the cutting section chamber. A stationary knife is disposed on the cutting section housing to protrude into the cutting section chamber and a movable cutter that has a rotary support body is disposed in the cutting section chamber and a movable knife is supported on the rotary support body to apply a shearing force to the glass wool together with the stationary knife. Additionally, a cutter actuator provides a driving force to the rotary support body.
    Type: Application
    Filed: October 19, 2018
    Publication date: September 26, 2019
    Inventors: Han Ki Lee, Mun Gyu Bak, Hak Soo Kim, Ju Seong Park, A Rom Oh, Seung Chan Baek, Song Woo Nam, Ju Hong Kim
  • Patent number: 10410599
    Abstract: A source driver integrated circuit (IC) for driving a flat panel display is provided. The source driver IC includes a first control logic circuit configured to generate first output signals for driving first source lines arranged in a first region of the flat panel display and a second control logic circuit configured to generate second output signals for driving second source lines arranged in a second region of the flat panel display. A first output delay between two adjacent output signals among the first output signals is different from a second output delay between two adjacent output signals among the second output signals.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: September 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha Joon Shin, Jin-Soo Kim, Seung Hwan Baek, Kyung-Gyu Park, Ji-Yong Jeong
  • Publication number: 20190237414
    Abstract: The semiconductor devices may include a semiconductor substrate, and a guard ring and a crack sensing circuit on the semiconductor substrate. The semiconductor substrate may include a main chip region that is defined by the guard ring and includes the crack sensing circuit, a central portion of the main chip region surrounded by the crack sensing circuit, and a chamfer region that is in a corner portion of the main chip region and is defined by the guard ring and the crack sensing circuit. The semiconductor devices may also include at least one gate structure on the semiconductor substrate in the main chip region, a plurality of metal pattern structures on the at least one gate structure in the chamfer region, and an insulating layer on the plurality of metal pattern structures. The plurality of metal pattern structures may extend in parallel to one another and may have different lengths.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 1, 2019
    Inventors: NAM-GYU BAEK, YUN-RAE CHO, HYUNG-GIL BAEK, SUN-DAE KIM
  • Patent number: 10362307
    Abstract: A method of determining a quantization parameter includes determining an adjustment range of a quantization parameter correction value based on a size of a motion area of an input image, calculating an average bitrate value of the input image, and adjusting the quantization parameter correction value by decreasing the quantization parameter correction value within the adjustment range in response to determining that the average bitrate value is greater than an upper limit value, and by increasing the quantization parameter correction value within the adjustment range in response to determining that the average bitrate value is equal to or less than a lower limit value.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 23, 2019
    Assignee: HANWHA TECHWIN CO., LTD.
    Inventors: Kyung Pyo Hong, Sujit Kumar Mahapatro, Yun Seok Kwon, Hee Gyu Baek
  • Patent number: 10354165
    Abstract: An apparatus for detecting an afterimage candidate region includes: a comparison unit which compares gradation data of an n-th frame with integrated gradation data of an (n?1)-th frame and generates integrated gradation data of the n-th frame, where n is a natural number; a memory which provides the integrated gradation data of the (n?1)-th frame to the comparison unit and stores the integrated gradation data of the n-th frame; and an afterimage candidate region detection unit which detects an afterimage candidate region based on the integrated gradation data of the n-th frame, where each of the integrated gradation data of the n-th frame and the integrated gradation data of the (n?1)-th frame comprises a comparison region and a gradation region.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yong Jun Jang, Nam Gon Choi, Joon Chul Goh, Gi Geun Kim, Geun Jeong Park, Cheol Woo Park, Yun Ki Baek, Jeong Hun So, Dong Gyu Lee
  • Publication number: 20190189046
    Abstract: A display device includes: a display panel including a display area, and a peripheral area disposed in the vicinity of the display area; a scan driver including a plurality of stages integrated on the peripheral area; a plurality of gate lines connected to the plurality of stages, respectively; and a plurality of pixel rows in the display area and connected with the plurality of gate lines, respectively. The plurality of stages and the plurality of pixel rows are each arranged in a first direction in a line, the peripheral area includes a fan-out region between the plurality of stages and the plurality of pixel rows, and at least one of the plurality of gate lines in the fan-out region is inclined with respect to the first direction, and a second direction perpendicular to the first direction.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Inventors: Seung-Soo BAEK, Se Hyoung CHO, Dong-Gyu KIM, Dong-Hyeon KI
  • Publication number: 20190182974
    Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.
    Type: Application
    Filed: February 14, 2019
    Publication date: June 13, 2019
    Inventors: Seung Chang BAEK, Hyeong Sam SON, Chang Jin SONG, Chang Hyeok SHIN, Sung Ho CHO, Chong Kun CHO, Han Gyu HWANG, Min Woo YOO
  • Publication number: 20190164295
    Abstract: Provided are a system and method for simultaneously reconstructing an initial three-dimensional (3D) trajectory and velocity of an object by using single camera images. The system for simultaneously reconstructing an initial 3D trajectory and velocity of an object by using single camera images includes a receiver configured to receive 3D world coordinate information of a starting point of an object and object-captured image information of a single camera, a two-dimensional (2D) coordinate acquisition unit configured to acquire 2D image coordinates of the object from the object-captured image information, and a reconstructor configured to simultaneously reconstruct an initial 3D velocity and trajectory of the object by applying a 3D motion equation to the 2D image coordinates and depth information from the single camera to the object.
    Type: Application
    Filed: June 25, 2018
    Publication date: May 30, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jong Sung KIM, Myung Gyu KIM, Woo Suk KIM, Seong Min BAEK, Sang Woo SEO, Sung Jin HONG
  • Patent number: 10304781
    Abstract: The semiconductor devices may include a semiconductor substrate, and a guard ring and a crack sensing circuit on the semiconductor substrate. The semiconductor substrate may include a main chip region that is defined by the guard ring and includes the crack sensing circuit, a central portion of the main chip region surrounded by the crack sensing circuit, and a chamfer region that is in a corner portion of the main chip region and is defined by the guard ring and the crack sensing circuit. The semiconductor devices may also include at least one gate structure on the semiconductor substrate in the main chip region, a plurality of metal pattern structures on the at least one gate structure in the chamfer region, and an insulating layer on the plurality of metal pattern structures. The plurality of metal pattern structures may extend in parallel to one another and may have different lengths.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Nam-gyu Baek, Yun-rae Cho, Hyung-gil Baek, Sun-dae Kim
  • Patent number: 10303739
    Abstract: A short message processing method and apparatus, which analyzes a short message received from a mobile communication network and provides via a packet data service node (PDSN) a supplementary service such as a credit card settlement details notifying service, a contact point registration service, a spam filtering service, a schedule registration service, a message history management service, and so forth, based on the result of the analysis. The short message processing method and apparatus can execute a supplementary service corresponding to the short message received through a PDSN, in corporation with a platform such as WIPI or BREW.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gyu-baek Kim, Nam-geol Lee
  • Publication number: 20190159355
    Abstract: An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.
    Type: Application
    Filed: March 6, 2018
    Publication date: May 23, 2019
    Inventors: Seung Chang BAEK, Hyeong Sam SON, Chang Jin SONG, Chang Hyeok SHIN, Sung Ho CHO, Chong Kun CHO, Han Gyu HWANG, Min Woo YOO
  • Patent number: 10286498
    Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: May 14, 2019
    Assignee: KYUNG DONG ONE CORPORATION
    Inventors: Ashutosh Sharma, Jae Pil Jung, Jong Hyun Yoon, Bum Gyu Baek, Heung Rak Sohn, Song Hee Yim, Jong Hyuk Yoon
  • Publication number: 20190139921
    Abstract: A semiconductor device includes a substrate, a contact pad arranged in the substrate, a bump arranged on the contact pad to be electrically connected with the contact pad, an insulating film arranged on the substrate to surround a side surface of the bump and to expose at least a portion of the contact pad to the bump, and a photosensitive film which is formed on the insulating film and comprises a polyimide, wherein the photosensitive film comprises a first region surrounding the side surface of the bump and having a first thickness measured in a vertical direction, and a second region arranged on the first region and having a second thickness thickermeasured in the vertical direction, wherein the second region is spaced apart from the bump in a horizontal direction, and wherein the second thickness is greater than a thickness two times thicker than a difference value between the second thickness and the first thickness.
    Type: Application
    Filed: July 9, 2018
    Publication date: May 9, 2019
    Inventors: Nam Gyu BAEK, In Young LEE, Hyun Soo CHUNG, Ho Geon SONG
  • Publication number: 20190103425
    Abstract: A method of manufacturing an image sensing apparatus includes: forming a first substrate structure including a first region of a pixel region, the first substrate structure having a first surface and a second surface; forming a second substrate structure including a circuit region for driving the pixel region, the second substrate structure having a third surface and a fourth surface; bonding the first substrate structure to the second substrate structure, such that the first surface is connected to the third surface; forming a second region of the pixel region on the second surface; forming a first connection via, the first connection via extending from the second surface to pass through the first substrate structure; mounting semiconductor chips on the fourth surface, using a conductive bump; and separating a stack structure of the first substrate structure, the second substrate structure, and the semiconductor chips into unit image sensing apparatuses.
    Type: Application
    Filed: May 2, 2018
    Publication date: April 4, 2019
    Inventors: Sung Hyun YOON, Doo Won KWON, Kwan Sik KIM, In Gyu BAEK, Tae Young SONG
  • Publication number: 20190043813
    Abstract: Provided is a semiconductor device including a semiconductor substrate including a main chip area and a scribe lane area adjacent to the main chip area, the scribe lane area including a first region adjacent to the main chip area and a second region adjacent to the first region; an insulating layer disposed on the semiconductor substrate; first embossing structures disposed on a first surface of the insulating layer in a first area of the insulating layer corresponding to the first region; second embossing structures disposed on the first surface of the insulating layer in a second area of the insulating layer corresponding to the second region; and dam structures provided in the first area of the insulating layer at positions corresponding to the first embossing structures, the dam structures extending in a direction perpendicular to a second surface of the insulating layer that is adjacent to the semiconductor substrate.
    Type: Application
    Filed: October 12, 2018
    Publication date: February 7, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun-dae KIM, Hyung-gil BAEK, Yun-rae CHO, Nam-gyu BAEK
  • Patent number: 10109664
    Abstract: An image sensor configured to provide improved reliability may include a charge passivation layer that includes a multiple different elements, each element of the different elements being a metal element or a metalloid element. The different elements may include a first element of a first group of periodic table elements and a second element of a second, different group of periodic table elements. The charge passivation layer may include an amorphous crystal structure.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In Gyu Baek, Sang Hoon Uhm, Tae Yon Lee, Jae Sung Hur
  • Patent number: 10103109
    Abstract: Provided is a semiconductor device including a semiconductor substrate including a main chip area and a scribe lane area adjacent to the main chip area, the scribe lane area including a first region adjacent to the main chip area and a second region adjacent to the first region; an insulating layer disposed on the semiconductor substrate; first embossing structures disposed on a first surface of the insulating layer in a first area of the insulating layer corresponding to the first region; second embossing structures disposed on the first surface of the insulating layer in a second area of the insulating layer corresponding to the second region; and dam structures provided in the first area of the insulating layer at positions corresponding to the first embossing structures, the dam structures extending in a direction perpendicular to a second surface of the insulating layer that is adjacent to the semiconductor substrate.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: October 16, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun-dae Kim, Hyung-gil Baek, Yun-rae Cho, Nam-gyu Baek
  • Patent number: 10031655
    Abstract: A DLNA device for performing a DLNA service scenario, comprises a display unit, an input unit, a communicator and a controller. The display unit is configured to display a user interface for performing the DLNA service scenario. The input unit is configured to receive, from a user, an operational instruction for the user interface. The communicator is configured to communicate with a DLNA network. The controller is configured to control the user interface displayed on the display unit and control the communicator. The user interface is configured to include a main layer providing an interface for media content selection, a first sublayer providing an interface for media server selection, and a second sublayer providing an interface for media player selection. The first sublayer and the second sublayer are displayed temporarily on at least a portion of the main layer according to the operational instruction.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: July 24, 2018
    Assignee: SK TELECOM CO., LTD.
    Inventors: Gyu-baek Kim, Youn-soon Oh, Yong-hee Han, Woon-sik Lee, Hye-min Lee, Hyu-dae Kim