Abstract: A CMOS image sensor and a method for fabricating the same are disclosed, in which transfer characteristics are improved. The method includes forming a photodiode region and a second conductive type ion region on a surface of a first conductive type substrate by implanting a second conductive type impurity ion into an entire surface of the substrate where a transistor is to be formed, forming a second conductive type lightly doped ion region in the substrate corresponding to the photodiode region by lightly implanting a second conductive type impurity ion only in an area where the photodiode region is opened, and diffusing the second conductive type lightly doped ion region into the second conductive type ion region by a thermal process.

Abstract: A method for fabricating a CMOS image sensor is disclosed, to minimize the leakage current and to improve the yield, which includes the steps of preparing a semiconductor substrate including a peripheral circuit and a pixel array, wherein the pixel array is comprised of a photodiode and a readout circuit; defining an active area and a field area in the semiconductor substrate; forming a field oxide layer in the field area of the semiconductor substrate; forming gate electrodes in the peripheral circuit and the readout circuit of the pixel array; forming a photodiode in a photodiode portion of the pixel array; forming source and drain junctions at both sides of the gate electrode in the semiconductor substrate of the active area; forming a salicide prevention layer in the semiconductor substrate of the pixel array; and forming salicide layers in the surface of the gate electrode and the source and drain junctions in the peripheral circuit by using the salicide prevention layer as a mask.

Abstract: A CMOS image sensor and a method for manufacturing the same, capable of preventing an interface between an active region and a field region in the CMOS image sensor from being damaged by ion implantation. The method comprises implanting dopant ions into a source region between a gate electrode of the reset transistor and the photodiode, using an ion implantation mask that covers predetermined locations of the field region and the source region.

Abstract: Disclosed are a complementary metal oxide semiconductor (CMOS) image sensor and a method for fabricating the same, which are capable of effectively preventing a cross talk effect. The CMOS image sensor includes a semiconductor substrate; device isolation regions provided on the semiconductor for defining device regions therebetween; photocharge generating portions provided on the device regions for receiving external light and for generating and storing electric charges; light concentrating portions provided over the photocharge generating portions for concentrating the external light onto corresponding photocharge generating portions; and cross talk preventing portions for preventing the light passing through the light concentrating portions from being incident onto adjacent photocharge generating portions.

Abstract: An example CMOS image sensor has pixel units and protection regions. The pixel unit has a light sensing region for converting an incident light into an electrical signal and an active region for controlling the transfer of the electrical signal. Each pixel unit is isolated by an element isolation layer. The protection region, which is located between each element isolation layer, prevents crosstalk generated between each pixel unit while the incident light is converted to the electrical signal. The protection region may include a well and a junction.

Abstract: A CMOS image sensor-manufacturing method includes forming a photodiode on a substrate, forming an insulating layer over the substrate, forming a contact hole in the insulating layer, and forming a gate terminal over the insulating layer. The gate terminal is connected to the photodiode through the contact hole.

Abstract: An image sensor and a method of manufacturing the same are disclosed. When forming an impurity region for a photodiode, the photodiode can be exposed by reducing the impurity region. Thus, a depletion region of the photodiode, formed when the sensor operates, extends to the exposed surface of the photodiode through the inner region of the photodiode, so that it is possible for the photodiode to normally absorb short wavelength light as well as long wavelength light at its depletion region.

Abstract: A CMOS image sensor is disclosed which has a photodiode formed by implanting ions into an area of a substrate. The photodiode surface area corresponds to about 15% to 40% of the surface area of a photoreceptor part region of the sensor. Thus, the capacitance associated with the photodiode is reduced relative to prior art photodiodes, and, thus, the output signals generated by the detected light are increased. Further, by reducing the size of the photodiode in manufacturing the CMOS image sensor, the junction region is reduced to thereby improve the absorption efficiency of light and high integration of the CMOS image sensor can be achieved to thereby prevent deterioration of device characteristics.

Abstract: An example CMOS image sensor has pixel units and protection regions. The pixel unit has a light sensing region for converting an incident light into an electrical signal and an active region for controlling the transfer of the electrical signal. Each pixel unit is isolated by an element isolation layer. The protection region, which is located between each element isolation layer, prevents crosstalk generated between each pixel unit while the incident light is converted to the electrical signal. The protection region may include a well and a junction.