Abstract: A composition for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes a Siphoviridae bacteriophage (Bac-FRP-4) having an ability to lyse the enterotoxigenic Bacteroides fragilis cells and a pharmaceutically acceptable carrier. A method for preventing or treating an infection or disease caused by enterotoxigenic Bacteroides fragilis includes administering to a subject a Siphoviridae bacteriophage and lysing the enterotoxigenic Bacteroides fragilis cells by the Siphoviridae bacteriophage.

Abstract: Disclosed are an electronic apparatus for recognizing a multimedia signal and an operating method of the electronic apparatus, including segmenting a detection signal into a plurality of frames; segmenting each of the frames into a plurality of blocks; and representing each of the blocks as a hash word based on a time feature and a frequency feature for each of the blocks.

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

Abstract: Disclosed is a robot cleaner comprising: a cleaner main body to which a dust collecting device is mounted; a cleaning module which is configured to be movable relative to the cleaner main body and performs the function of cleaning a floor; a connection unit which is connected to each of the cleaner main body and the cleaning module and is configured to have a variable length; and a driving unit configured to change the length of the connection unit.

Abstract: A band tightening apparatus for binding an intestine with a band according to an embodiment of the present disclosure pulls a holder that fixes a band so that the length of the band wound around the intestine is ideally adjusted. The apparatus can pull the band wound around the intestine so that the length of the band wound around the intestine is ideally adjusted and the apparatus can fix the band with a fixing pin for convenient use.

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.

Abstract: Provided is a semiconductor package comprising a lower package that includes a lower substrate and a lower semiconductor chip, an interposer substrate on the lower package and having a plurality of holes that penetrate the interposer substrate, a thermal radiation structure that includes a supporter on a top surface of the interposer substrate and a plurality of protrusions in the holes of the interposer substrate, and a thermal conductive layer between the lower semiconductor chip and the protrusions of the thermal radiation structure.

Abstract: A method by a computer system including generating audio files based on respective audio signals, the audio signals having been respectively generated from a plurality of objects at a venue, generating metadata including spatial features at the venue that are respectively set for the objects, and transmitting the audio files and the metadata for the objects to a first electronic device to cause the first electronic device to realize a being-there at the venue by rendering the audio files based on the spatial features in the metadata may be provided.

Abstract: Provided are a computer system for producing audio content for realizing a user-customized being-there and a method thereof. The computer system may be configured to generate audio files based on respective audio signals that are respectively generated from a plurality of objects at a venue, set spatial features at the venue for the objects, respectively, using a production tool, and generate metadata for the audio files based on the spatial features. An electronic device may realize a being-there at the venue by rendering the audio files based on the spatial features in the metadata. That is, a user of the electronic device may feel a user-customized being-there as if the user directly listens to audio signals generated from corresponding objects at a venue in which the objects are provided.

Abstract: A semiconductor package includes a first substrate that includes a first insulating layer, a ground pattern in the first insulating layer, and a first conductive pattern; a first semiconductor chip placed on an upper surface of the first substrate; a ball array structure that is placed on the upper surface of the first substrate along a perimeter of the first semiconductor chip and is electrically connected to the ground pattern; and a shielding structure placed on the upper surface of the first semiconductor chip and in contact with the upper surface of the ball array structure. The ball array structure has a closed loop shape, and includes a solder ball portion and a connecting portion that connects adjacent solder ball portions. A maximum width of the solder ball portion is greater than a width of the connecting portion in a direction perpendicular to an extension direction of the connecting portion.

Abstract: A display substrate, a method for forming a display substrate, and a display device are provided.

Abstract: A display panel has a mounting hole. The display panel includes a first conductive layer, a second conductive layer, and a first insulating isolation layer located between the first conductive layer and the second conductive layer. The first conductive layer includes a first crack detection line and a first electrode connected to each other. The second conductive layer includes a second crack detection line and a second electrode connected to each other. The first electrode and the second electrode constitute a capacitor. The mutual-sensing capacitor is disposed outside of the mounting hole. The capacitor is configured to detect whether there is a crack in a portion of the display panel located around the mounting hole.

Abstract: A semiconductor package includes: a lower package: an upper substrate on the lower package: and connection members connecting the lower package to the upper substrate. wherein the lower package includes: a lower substrate; and a lower semiconductor chip, wherein the upper substrate includes: an upper substrate body: upper connection pads combined with the connection members: and auxiliary members extending from the upper substrate body toward the lower substrate, wherein the connection members are arranged in a first horizontal direction to form a first connection member column, wherein the auxiliary members are arranged in the first horizontal direction to form a first auxiliary member column, wherein the first connection member column and the first auxiliary member column are located between a side surface of the lower semiconductor chip and a side surface of the lower substrate, and the first auxiliary member column is spaced apart from the first connection member column.

Abstract: A composition for preventing or treating an infection or disease caused by a pathogenic Escherichia coli includes a Myoviridae bacteriophage (Esc-COP-23) having an ability to lyse the pathogenic Escherichia coli and a pharmaceutically acceptable carrier. A method for preventing or treating an infection or disease caused by a pathogenic Escherichia coli includes administering to a subject a Myoviridae bacteriophage and lysing the pathogenic Escherichia coli by the Myoviridae bacteriophage.

Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip connection units to connect the first package substrate to the first semiconductor chip, an interposer on the first semiconductor chip, the interposer having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate, and an upper filling layer including a center portion and an outer portion, the center portion being between the first semiconductor chip and the interposer, and the outer portion surrounding the center portion and having a thickness greater than a thickness of the center portion in a direction perpendicular to the upper surface of the first package substrate.

Abstract: A display panel and a preparation method therefor, and a display apparatus. The display panel comprises: a display region and a bezel region surrounding the display region; a barrier structure, located in the bezel region and arranged on one side of the base substrate, surrounding the display region; a touch-control electrode lead, comprising a first metal lead and a metal connection bridge which are electrically connected; said first metal lead is arranged on the upper side of said barrier structure; the first metal lead extends from the display region to the bezel region and is located on the side of the barrier structure facing the display region; said metal connection bridge is located in the bezel region; the metal connection bridge is arranged between the base substrate and the surface of the barrier structure on the side away from the base substrate.

Abstract: The present disclosure relates to a novel anticancer pharmaceutical composition. The present disclosure achieves an anticancer effect using a compound effective in inhibiting the expression of ANO1 (TMEM16A). In addition, the present disclosure provides an ANO1 (TMEM16A) antagonist using the compound inhibiting the expression of ANO1 (TMEM16A).

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip connection units to connect the first package substrate to the first semiconductor chip, an interposer on the first semiconductor chip, the interposer having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate, and an upper filling layer including a center portion and an outer portion, the center portion being between the first semiconductor chip and the interposer, and the outer portion surrounding the center portion and having a thickness greater than a thickness of the center portion in a direction perpendicular to the upper surface of the first package substrate.