Patents by Inventor In-seon Park

In-seon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip radio frequency package and radio frequency module
    Patent number: 11101840
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: August 24, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Antenna module
    Patent number: 11095037
    Abstract: An antenna module includes: a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; an antenna package including antenna members configured to transmit or receive a radio frequency (RF) signal, a feed vias each having one end electrically connected to a respective one of the antenna members and another end electrically connected to the at least one wiring layer, and a dielectric layer having a height greater than a height of the at least one insulating layer, and having a first surface facing a second surface of the connection member; and dielectric members disposed in positions corresponding to the antenna members on the second surface of the antenna package.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: August 17, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Doo Il Kim, Yong Ho Baek, Jin Seon Park, Young Sik Hur
  • TOUCH SENSING UNIT AND DISPLAY DEVICE INCLUDING THE SAME
    Publication number: 20210247862
    Abstract: A touch sensing unit includes a first touch electrode disposed in a touch sensor area. A second touch electrode is disposed in the touch sensor area. A first touch line is disposed in a touch peripheral area. The first touch line is electrically connected to the first touch electrode. The touch peripheral area is disposed on a periphery of the touch sensor area. A second touch line is disposed in the touch peripheral area. The second touch line is electrically connected to the second touch electrode. The touch peripheral area includes first and second regions. In the first region, a width of the first touch line is smaller than a width of the second touch line. In the second region, the width of the first touch line is equal to the width of the second touch line.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 12, 2021
    Inventors: HWAN HEE JEONG, Kl CHEOL KIM, JONG SEON PARK
  • CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    Publication number: 20210242595
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Application
    Filed: June 3, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    Publication number: 20210242594
    Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
    Type: Application
    Filed: June 3, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung KANG, Seong Jong CHEON, Hak Gu KIM, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • METHOD AND APPARATUS FOR FORMING LAYER, METAL OXIDE TRANSISTOR AND FABRICATION METHOD THEREOF
    Publication number: 20210238738
    Abstract: A layer forming method according to one embodiment of the present invention contains a source gas dosing/pressurizing step of dosing a source gas into a chamber having a substrate loaded therein in a state in which the outlet of the chamber is closed, thereby increasing the pressure in the chamber and adsorbing the source gas onto the substrate; a first main purging step of purging the chamber, after the source gas dosing/pressurizing step; a reactive gas dosing step of dosing a reactive gas into the chamber, after the first main purging step; and a second main purging step of purging the chamber, after the reactive gas dosing step.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 5, 2021
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANGUNIVERSITY)
    Inventors: Myung Mo SUNG, Jinwon JUNG, Jin Seon PARK
  • CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
    Publication number: 20210242896
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Application
    Filed: August 17, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • Method of preparing thermoplastic resin, thermoplastic resin composition including the same, and method of manufacturing injection-molded article using thermoplastic resin composition
    Patent number: 11066542
    Abstract: The present invention relates to a method of preparing a thermoplastic resin, a method of preparing a thermoplastic resin composition including the same, and a method of manufacturing an injection-molded article using the thermoplastic resin composition. By using a mixture of molecular weight modifiers having different reactivities according to the present invention, coagulation may be performed using a small amount of coagulant, productivity may be increased, and a molded article, which is manufactured using a thermoplastic resin, having excellent appearance characteristics along with superior mechanical strength, processability, or the like may be provided.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: July 20, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jong Beom Kim, Joo Byung Chai, Yu Sung Jung, Chang Sull Kim, Eun Seon Park, Tae Young Jeon, Young Min Kim
  • Pressure Sensing Device And Processing Method Thereof
    Publication number: 20210181050
    Abstract: A pressure sensing device includes a pressure signal receiver configured to receive an analog pressure signal from a pressure sensor, a converter configured to convert the analog pressure signal to a digital pressure signal, and a processor configured to convert a pressure value of the digital pressure signal to a bit value corresponding to the pressure value and output the bit value. The processor is configured to convert the pressure value to a first bit value by a first bit resolution in response to the pressure value being included in a first pressure interval, and convert the pressure value to a second bit value by a second bit resolution in response to the pressure value being included in a second pressure interval. The second pressure interval is a pressure interval greater than the first pressure interval, and the first bit resolution is greater than the second bit resolution.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 17, 2021
    Applicant: Tyco Electronics AMP Korea Co. Ltd.
    Inventors: Hyung Jin Kim, Eul-Chul Byeon, Yong Seon Park
  • FLAVOURING COMPONENT, AND APPARATUS AND METHOD FOR MANUFACTURING A FLAVOURING COMPONENT
    Publication number: 20210169134
    Abstract: A flavouring component for a smoking article comprising a rod of flavouring material. The flavouring material comprises a carrier material and flavouring particles adhered to to the carrier material by means of a binder. The flavouring material is formed by passing the carrier material through a mixture comprising the binder and the flavouring particles. Also disclosed is a smoking article including such a flavouring component, and an apparatus and method for manufacturing such a flavouring component.
    Type: Application
    Filed: February 11, 2021
    Publication date: June 10, 2021
    Inventors: Gary FALLON, Kie Seon PARK
  • THERMOPLASTIC RESIN AND THERMOPLASTIC RESIN COMPOSITION
    Publication number: 20210163736
    Abstract: The present invention relates to a thermoplastic resin. More particularly, the present invention relates to a thermoplastic resin that is a graft copolymer having a seed-shell structure and includes a bimodal seed including a large-diameter rubbery polymer having an average particle diameter of greater than 2,000 ? and 3,500 ? or less and a small-diameter rubbery polymer having an average particle diameter of 500 ? to 2,000 ?; and an aromatic vinyl-vinyl cyan shell, wherein the aromatic vinyl cyan compound is included in an amount of 5% by weight to 28% by weight based on a total weight of the aromatic vinyl-vinyl cyan shell. In accordance with the present invention, a thermoplastic resin having a composition capable of improving graft density, and a thermoplastic resin composition capable of increasing dispersion and having high gloss due to inclusion of the thermoplastic resin are provided.
    Type: Application
    Filed: August 2, 2017
    Publication date: June 3, 2021
    Inventors: Joo Byung CHAI, Tae Young JEON, Yu Sung JUNG, Jong Beom KIM, Chang Sull KIM, Eun Seon PARK, Young Min KIM
  • INFORMATION PROCESSING METHOD AND APPARATUS THEREFOR
    Publication number: 20210168293
    Abstract: Disclosed are an information processing method and information processing apparatus which execute an installed artificial intelligence (AI) algorithm and/or machine learning algorithm to process a spoken utterance of a user in a 5G communication environment. The information processing method according to an embodiment of the present disclosure may include receiving a spoken utterance of a user and extracting, from the spoken utterance, a demonstrative pronoun referring to a target indicated by the user, determining an image capture region to be scanned by a camera according to the type of the demonstrative pronoun, recognizing the target indicated by the user from a result of scanning the image capture region, and feeding back a result of processing the spoken utterance to the user on the basis of a result of recognizing the target indicated by the user.
    Type: Application
    Filed: February 11, 2020
    Publication date: June 3, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: In Jung YANG, Mi Seon PARK, Ji-Won KIM
  • Method and apparatus for forming layer, metal oxide transistor and fabrication method thereof
    Patent number: 11015243
    Abstract: A layer forming method according to one embodiment of the present invention comprises: a source gas dosing/pressurizing step of dosing a source gas into a chamber having a substrate loaded therein in a state in which the outlet of the chamber is closed, thereby increasing the pressure in the chamber and adsorbing the source gas onto the substrate; a first main purging step of purging the chamber, after the source gas dosing/pressurizing step; a reactive gas dosing step of dosing a reactive gas into the chamber, after the first main purging step; and a second main purging step of purging the chamber, after the reactive gas dosing step.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: May 25, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Jinwon Jung, Jin Seon Park
  • Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element
    Patent number: 10991831
    Abstract: A layer according to one embodiment of the present invention may exhibit a first number of electron states in a low-level electron energy range in a conduction band, and exhibit a second number of electron states in a high-level electron energy range higher than the low-level electron energy level in the conduction band, wherein localized states may exist between the low-level electron energy range and the high-level electron energy level.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 27, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Jinwon Jung, Hongbum Kim, Jin Seon Park
  • Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element
    Patent number: 10985247
    Abstract: A layer according to one embodiment of the present invention may exhibit a first number of electron states in a low-level electron energy range in a conduction band, and exhibit a second number of electron states in a high-level electron energy range higher than the low-level electron energy level in the conduction band, wherein localized states may exist between the low-level electron energy range and the high-level electron energy level.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: April 20, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Jinwon Jung, Hongbum Kim, Jin Seon Park
  • Touch sensing unit and display device with lines in the peripheral area
    Patent number: 10983641
    Abstract: A touch sensing unit includes a first touch electrode disposed in a touch sensor area. A second touch electrode is disposed in the touch sensor area. A first touch line is disposed in a touch peripheral area. The first touch line is electrically connected to the first touch electrode. The touch peripheral area is disposed on a periphery of the touch sensor area. A second touch line is disposed in the touch peripheral area. The second touch line is electrically connected to the second touch electrode. The touch peripheral area includes first and second regions. In the first region, a width of the first touch line is smaller than a width of the second touch line. In the second region, the width of the first touch line is equal to the width of the second touch line.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: April 20, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hwan Hee Jeong, Ki Cheol Kim, Jong Seon Park
  • DISPLAY DEVICE
    Publication number: 20210109616
    Abstract: A display device includes: a display panel having a display area and a non-display area at least partially disposed around the display area; and a touch sensor disposed on the display panel and including a touch sensor area and a touch pad area adjacent to the touch sensor area, wherein the touch sensor includes a plurality of touch electrodes disposed in the touch sensor area, a plurality of touch pads disposed in the touch pad area, and a plurality of touch signal lines electrically connecting the touch electrodes with the touch pads, respectively.
    Type: Application
    Filed: June 2, 2020
    Publication date: April 15, 2021
    Inventors: Jong Seon PARK, Dong Jin MOON, Ye Ri JEONG, Hwan Hee JEONG, In Young HAN
  • Layer, multilevel element, method for fabricating multilevel element, and method for driving multilevel element
    Patent number: 10978561
    Abstract: A layer according to one embodiment of the present invention may exhibit a first number of electron states in a low-level electron energy range in a conduction band, and exhibit a second number of electron states in a high-level electron energy range higher than the low-level electron energy level in the conduction band, wherein localized states may exist between the low-level electron energy range and the high-level electron energy level.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: April 13, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Jinwon Jung, Hongbum Kim, Jin Seon Park
  • Flavouring component, and apparatus and method for manufacturing a flavouring component
    Patent number: 10966453
    Abstract: A flavouring component (43) for a smoking article (50) comprising a rod (33) of flavouring material (17). The flavouring material (17) comprises a carrier material (15) and flavouring particles (14) adhered to the carrier material (15) by means of a binder (13). The flavouring material (17) is formed by passing the carrier material (15) through a mixture (12) comprising the binder (13) and the flavouring particles (14). Also disclosed is a smoking article (50) including such a flavouring component (43), and an apparatus (10) and method for manufacturing such a flavouring component (43).
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: April 6, 2021
    Assignee: BRITISH AMERICAN TOBACCO (INVESTMENTS) LIMITED
    Inventors: Gary Fallon, Kie Seon Park
  • METHOD OF MANAGING BIOMETRIC INFORMATION USING SENSOR USAGE INFORMATION
    Publication number: 20210085225
    Abstract: The present invention relates to a method for managing biometric information and, more specifically, to a method for managing biometric information capable of preventing a use of a sensor module of which an expiration date has expired or a defective sensor module, by determining the validity of a sensor module of a continuous biometric information measuring device on the basis of the generation date of sensor usage information or production lot information received from the continuous biometric information measuring device, and preventing re-use or shared use of the sensor module on the basis of user information provided in a measurement message received from the continuous biometric information measuring device.
    Type: Application
    Filed: January 24, 2019
    Publication date: March 25, 2021
    Inventors: Jeong Je PARK, Jin Won LEE, Ji Seon NAH, Hyo Seon PARK, Jin Ho KIM