Abstract: A method for manufacturing a metal card includes: a step for forming a metal card by laminating a stack of sheets in which are stacked a plurality of sheets, centered on a metal sheet, including adhesive sheets having the same size as the metal sheet, an upper inlay sheet having a first antenna, and a lower inlay sheet having a second antenna; a step for forming a COB accommodation space, which can accommodate a COB, by milling a certain area of the metal card using computerized numerical control (CNC) machining; a step for forming a through-hole, which exposes the first antenna and the second antenna, by milling a COB contact point region of the COB accommodation space down to the lower inlay sheet; a step for electrically connecting the first antenna and the second antenna by dispensing a conductive elastic liquid into the through-hole; and a step for bidirectionally connecting the first antenna and the second antenna to the COB by attaching the COB within the COB accommodation space so that the COB contact

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: According to one exemplary embodiment of the present disclosure, a light emitting diode system includes: a nitride-based multi-wavelength light emitting diode including a first semiconductor layer doped with an n-type material, a second semiconductor layer doped with a p-type material, and an active layer disposed between the first semiconductor layer and the second semiconductor layer and having a structure of an indium gallium nitride (InGaN)-based quantum well; and a control unit configured to adjust and apply at least one of a pulse width and a duty cycle of an injection current to the nitride-based multi-wavelength light emitting diode.

Abstract: The present application relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation film having excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending, while preventing generation of bright spots in the organic electronic device.

Abstract: An imaging apparatus includes a camera to capture a camera image of a target disposed on an examination table; an X-ray source to generate and radiate X-rays; a memory to store imaging protocols; a display; and a controller. The controller is configured to receive information regarding a selection of an imaging protocol, identify a position of an imaging region of the target based on the camera image, the imaging region corresponding to the selection of the imaging protocol and the camera image being acquired with the examination table at a first distance from the X-ray source, control the display to display the camera image of the target and an indicator indicating the imaging region on the camera image based on the identified position, and control the X-ray source to radiate the X-rays toward the target disposed on the examination table at a second distance from the X-ray source.

Abstract: A coil component includes: a body; a substrate disposed in the body, and having a first surface and a second surface facing each other; a coil unit including first and second coil patterns disposed on the first surface and the second surface of the substrate, respectively, first and second lead-out portions extending to surfaces of the body, a first connection portion disposed between the first coil pattern and the first lead-out portion, and a second connection portion disposed between the second coil pattern and the second lead-out portion; and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the first and second lead-out portions, respectively. Each of the first and second connection portions includes one connection pattern and at least one separation pattern. The connection pattern has a smaller line width than a respective one of the lead-out portions.

Abstract: A method of controlling a pressure variable weather strip for varying a pressure of a sealing part of the weather strip is provided. The method includes a closing checking step of, by a controller, checking whether an opening/closing part of a vehicle is in a closed state. When a vehicle speed reaches a preset target vehicle speed to increase the pressure of the sealing part in a state in which the opening/closing part is closed, the controller operates an air supply device to supply air to the sealing part.

Abstract: In one aspect, a variable pressure weatherstrip assembly according to the present disclosure includes: a weatherstrip including a sealing portion having a closed cross-section therein and configured to seal a portion between a vehicle body and an opening/closing part of a vehicle, and a fixing portion integrated with the sealing portion and fixed to a panel of the vehicle; an air supply device configured to supply pressurized air to the sealing portion; an air line configured to allow the air supply device and the sealing portion to communicate with each other; and one or more control valves installed in the air line, disposed between the sealing portion and the air supply device, and configured to control the air to be supplied to the sealing portion from the air supply device.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: The present invention relates to a metal card and a card manufacturing method, and the metal card includes a metal sheet, a machined part made of a plastic material in such a manner as to be inserted into one side surface of the metal sheet, an insulating sheet with a ferromagnetic insulating material in such a manner as to be attached to the underside of the metal sheet, and an inlay sheet with antenna coils in such a manner as to be attached to the underside of the insulating sheet, wherein the metal sheet has a machined part insertion portion formed on one side surface thereof to insert the machined part, and the ferromagnetic insulating material has the shape of one or more pieces or powder.

Abstract: A high-voltage relay system for a vehicle is provided. The system includes a relay, a first contact part positioned between a battery and a power converter, a voltage application unit, and a second contact part positioned between the voltage application unit and the ground. A first resistor is connected, at a first end thereof, in series to a second end of the second contact part and connected, at a second end thereof, to the ground. A controller operates the relay in response to an ON/OFF control signal to short-circuit or open the contacts at both ends of the first contact part or the contacts at both ends of the second and determines whether the relay fails based on the type of the ON/OFF control signal and the voltage value between both ends of the first resistor.

Abstract: An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same are provided. The encapsulation film has excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending caused by CTE mismatch, and overcomes the performance decrease due to reliability degradation, while preventing generation of bright spots in the organic electronic device.

Abstract: An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same are provided. The encapsulation film has excellent reliability that allows forming a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, absorbs and disperses the stress according to panel bending caused by CTE mismatch, and overcomes the performance decrease due to reliability degradation, while preventing generation of bright spots in the organic electronic device.

Abstract: An encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same are provided, where the encapsulation film allows forming a structure capable of blocking moisture or oxygen penetrating into an organic electronic device from outside and prevents generation of bright spots in the organic electronic device.

Abstract: Disclosed herein are an emergency operating system and an emergency operating method for a hybrid vehicle with a damaged bearing of an engine, which are capable of preventing a bearing from being further damaged due to a drive motor and a hybrid starter and generator (HSG) when damage to the bearing installed in an engine is detected and capable of driving the hybrid vehicle and which include a bearing damage detection operation, an engine driving maintaining operation, a first state of charge (SOC) comparison operation, and a first emergency operating operation.

Abstract: An imaging apparatus includes a camera to capture a camera image of a target disposed on an examination table; an X-ray source to generate and radiate X-rays; a memory to store imaging protocols; a display; and a controller. The controller is configured to receive information regarding a selection of an imaging protocol, identify a position of an imaging region of the target based on the camera image, the imaging region corresponding to the selection of the imaging protocol and the camera image being acquired with the examination table at a first distance from the X-ray source, control the display to display the camera image of the target and an indicator indicating the imaging region on the camera image based on the identified position, and control the X-ray source to radiate the X-rays toward the target disposed on the examination table at a second distance from the X-ray source.

Abstract: Disclosed herein is a server collectively managing rejection codes for each type of a medical image and determining accuracy of the codes for the medical image transmitted from a medical imaging apparatus, providing a feedback, and a method of controlling the same. A medical imaging apparatus disclosed herein assigns rejection codes based on feedback received from the server and a method disclosed controls the same. The server includes a communication circuitry configured to communicate with a medical imaging apparatus, and a controller configured to control the communication circuitry to receive a medical image and a rejection code assigned to the medical image from the medical imaging apparatus, perform an image processing on the medical image to determine the rejection code of the medical image, and compare the determined rejection code and the received rejection code to generate information associated with a result of the comparison.

Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.

Abstract: The present invention relates to a metal card manufacturing method including the steps of: preparing a metal sheet having a given size capable of accommodating a plurality of individual cards; forming holes on at least one or more edges of stacked sheets formed by stacking a plurality of sheets inclusive of adhesive sheets and an inlay sheet on which antenna coils are printed, the plurality of sheets having the same size capable of accommodating the plurality of individual cards as each other; fitting the holes formed on the stacked sheets to pins located on a loading plate; placing the metal sheet on top of the stacked sheets; forming a metal card sheet through lamination among the metal sheet and the stacked sheets; and cutting the metal card sheet along individual card outlines of the plurality of individual cards.