Patents by Inventor In-Sung Nam

In-Sung Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220006793
    Abstract: The present disclosure is directed to methods that provide a secure communication protocol by utilizing one step process of authenticating and encrypting data without having to exchange symmetric keys or needing to renew or re-issue digital identities fundamental to asymmetric encryption methodology.
    Type: Application
    Filed: July 8, 2021
    Publication date: January 6, 2022
    Inventor: Sung Nam Choi
  • Publication number: 20210384633
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Application
    Filed: September 1, 2021
    Publication date: December 9, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
  • Publication number: 20210376490
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
  • Publication number: 20210343977
    Abstract: The present disclosure relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, and provides an encapsulation film which can form a structure capable of blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby effectively releasing the heat accumulated in the organic electronic device and preventing the occurrence of deterioration of the organic electronic device.
    Type: Application
    Filed: September 3, 2019
    Publication date: November 4, 2021
    Inventors: Sung Nam MOON, Seung Min LEE, Eun Jeong KIM, Yeong Bong MOK, Se Woo YANG, Jun Won CHOI
  • Publication number: 20210308340
    Abstract: Provided is a method for manufacturing a stent, including: coating a coating material on a stent; and drying the stent at a temperature in the range of from 40° C. to 150° C., and the coating and the drying are simultaneously performed.
    Type: Application
    Filed: May 27, 2019
    Publication date: October 7, 2021
    Inventors: Chang Hun KUM, Kwang Soo KIM, Bunam CHANG, Jae Hwa CHO, Sung Nam KANG, Gyu Hyun JIN, Hye Young KWON, Ji Seon HONG, Saet Byeol KIM
  • Publication number: 20210287137
    Abstract: Disclosed are a system for predicting optical properties of molecules based on machine learning and a method thereof. More particularly, the system for predicting optical properties according to an embodiment includes a preprocessor that receives molecular information of a target molecule and surrounding molecules, and vectorizes the molecular information of a target molecule and surrounding molecules; a feature extractor that receives the vectorized information of the target molecule and surrounding molecules and extracts the features of the target molecule and surrounding molecules; an integrated feature extractor that receives both features of the target molecule and surrounding molecules and extract the integrated features of the target molecule and surrounding molecules by using an algorithm; and an optical property predictor that receives the integrated features of the target molecule and surrounding molecules and predicts optical properties of the target molecule affected by surrounding molecules.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 16, 2021
    Applicant: Korea University Research and Business Foundation
    Inventors: Sung Nam PARK, Joon Young JOUNG, Min Hi HAN, Dong Hun CHOI, Min Seok JEONG
  • Publication number: 20210287254
    Abstract: Disclosed is provided a system for providing an advertisement information platform service using a block chain.
    Type: Application
    Filed: August 5, 2019
    Publication date: September 16, 2021
    Inventor: Sung Nam HA
  • Patent number: 11121476
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
  • Publication number: 20210279542
    Abstract: The present invention relates to a metal card manufacturing method including the steps of: preparing a metal sheet having a given size capable of accommodating a plurality of individual cards; forming holes on at least one or more edges of stacked sheets formed by stacking a plurality of sheets inclusive of adhesive sheets and an inlay sheet on which antenna coils are printed, the plurality of sheets having the same size capable of accommodating the plurality of individual cards as each other; fitting the holes formed on the stacked sheets to pins located on a loading plate; placing the metal sheet on top of the stacked sheets; forming a metal card sheet through lamination among the metal sheet and the stacked sheets; and cutting the metal card sheet along individual card outlines of the plurality of individual cards.
    Type: Application
    Filed: June 20, 2018
    Publication date: September 9, 2021
    Inventors: Ki sung NAM, Han seon KIM, Suk Ku LEE
  • Publication number: 20210271950
    Abstract: The present invention relates to a metal card and a card manufacturing method, and the metal card includes a metal sheet, a machined part made of a plastic material in such a manner as to be inserted into one side surface of the metal sheet, an insulating sheet with a ferromagnetic insulating material in such a manner as to be attached to the underside of the metal sheet, and an inlay sheet with antenna coils in such a manner as to be attached to the underside of the insulating sheet, wherein the metal sheet has a machined part insertion portion formed on one side surface thereof to insert the machined part, and the ferromagnetic insulating material has the shape of one or more pieces or powder.
    Type: Application
    Filed: June 19, 2018
    Publication date: September 2, 2021
    Inventors: Ki sung NAM, Han seon KIM, Suk Ku LEE
  • Patent number: 11070532
    Abstract: The present disclosure is directed to methods that provide a secure communication protocol by utilizing one step process of authenticating and encrypting data without having to exchange symmetric keys or needing to renew or re-issue digital identities fundamental to asymmetric encryption methodology.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: July 20, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Sung Nam Choi
  • Patent number: 11069954
    Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: July 20, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo Kim, Jae Yeong Kim, Sung Yong An, Sung Nam Cho, Ji Hyung Jung
  • Patent number: 11066581
    Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus for each frequency at a temperature of 50° C. or more as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: July 20, 2021
    Assignee: INNOX ADVANCED MATERIALS CO., LTD.
    Inventors: Jong Geol Lee, Dong Ki Baek, Sung Nam Lee, Hanhi Kang
  • Patent number: 11066580
    Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus at high temperature as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: July 20, 2021
    Assignee: INNOX ADVANCED MATERIALS CO., LTD.
    Inventors: Jong Geol Lee, Dong Ki Baek, Sung Nam Lee, Hanhi Kang
  • Patent number: 11050683
    Abstract: An electronic device is provided. The electronic device includes a housing, a display configured to be exposed through one surface of the housing, a communication module configured to communicate over a first network compliant with a first protocol or a second network compliant with a second protocol, a processor configured to be electrically connected with the display and the communication module, and a memory configured to be electrically connected with the processor and store a specified application. The memory stores instructions, that when executed, cause the processor 420 to execute the specified application, designate a CP server by interacting with a platform server over the second network, receive an initial response message generated by the designated CP server over the first network, and verify a first identifier of the designated CP server based on the first protocol from a source of the initial response message.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: June 29, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyong Jin Ban, Yong Suk Kwon, Tae Sun Yeoum, Myeong Cheol Kim, Sung Jin Kim, Yoon Sung Nam, Pei Huang, Qia Wang, Zhinan Zhou
  • Publication number: 20210170735
    Abstract: The present invention relates to a metal card manufacturing method including the steps of: preparing a metal sheet having a given size capable of accommodating a plurality of individual cards; preparing a ferromagnetic insulating sheet made by containing epoxy in a ferrite to the same size capable of accommodating the plurality of individual cards as the metal sheet; preparing an inlay sheet on which antenna coils are printed to the same size as the insulating sheet and forming holes on at least one or more edges of stacked sheets formed by stacking a plurality of sheets inclusive of the insulating sheet and the inlay sheet; fitting the holes formed on the stacked sheets to pins located on a loading plate; placing the metal sheet on top of the stacked sheets; forming a metal card sheet through lamination among the metal sheet and the stacked sheets; and cutting the metal card sheet along individual card outlines of the plurality of individual cards.
    Type: Application
    Filed: June 20, 2018
    Publication date: June 10, 2021
    Inventors: Ki sung NAM, Han seon KIM, Suk Ku LEE
  • Patent number: 11024772
    Abstract: Provided is a light emitting diode. The light emitting diode includes a substrate, a first semiconductor layer on the substrate, an active layer on the first semiconductor layer, a second semiconductor layer on the active layer, and a conductor passing through the second semiconductor layer and the active layer to contact the first semiconductor layer.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: June 1, 2021
    Assignee: KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
    Inventors: Sung-Nam Lee, Seung-Hye Baek
  • Patent number: 11009855
    Abstract: Provided is a method for manufacturing a metal card which is capable of allowing metal card antennas to have no interference with a metal sheet by including a processed plastic layer formed on the metal sheet, and an insulating sheet. The metal card is capable of improving sensitivity of antenna coil, thereby solving an existing problem of the difficulties in performing RF communication because of material characteristics of a metal layer.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: May 18, 2021
    Assignees: KONA I CO., LTD., KONA M CO., LTD.
    Inventors: Ki sung Nam, Han seon Kim, Suk Ku Lee
  • Publication number: 20210143527
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
    Type: Application
    Filed: January 19, 2021
    Publication date: May 13, 2021
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
  • Publication number: 20210111478
    Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).
    Type: Application
    Filed: February 12, 2020
    Publication date: April 15, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo KIM, Jae Yeong KIM, Sung Yong AN, Sung Nam CHO, Ji Hyung JUNG