Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: The present disclosure is directed to methods that provide a secure communication protocol by utilizing one step process of authenticating and encrypting data without having to exchange symmetric keys or needing to renew or re-issue digital identities fundamental to asymmetric encryption methodology.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

Abstract: The present disclosure relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, and provides an encapsulation film which can form a structure capable of blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby effectively releasing the heat accumulated in the organic electronic device and preventing the occurrence of deterioration of the organic electronic device.

Abstract: Provided is a method for manufacturing a stent, including: coating a coating material on a stent; and drying the stent at a temperature in the range of from 40° C. to 150° C., and the coating and the drying are simultaneously performed.

Abstract: Disclosed are a system for predicting optical properties of molecules based on machine learning and a method thereof. More particularly, the system for predicting optical properties according to an embodiment includes a preprocessor that receives molecular information of a target molecule and surrounding molecules, and vectorizes the molecular information of a target molecule and surrounding molecules; a feature extractor that receives the vectorized information of the target molecule and surrounding molecules and extracts the features of the target molecule and surrounding molecules; an integrated feature extractor that receives both features of the target molecule and surrounding molecules and extract the integrated features of the target molecule and surrounding molecules by using an algorithm; and an optical property predictor that receives the integrated features of the target molecule and surrounding molecules and predicts optical properties of the target molecule affected by surrounding molecules.

Abstract: Disclosed is provided a system for providing an advertisement information platform service using a block chain.

Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

Abstract: The present invention relates to a metal card manufacturing method including the steps of: preparing a metal sheet having a given size capable of accommodating a plurality of individual cards; forming holes on at least one or more edges of stacked sheets formed by stacking a plurality of sheets inclusive of adhesive sheets and an inlay sheet on which antenna coils are printed, the plurality of sheets having the same size capable of accommodating the plurality of individual cards as each other; fitting the holes formed on the stacked sheets to pins located on a loading plate; placing the metal sheet on top of the stacked sheets; forming a metal card sheet through lamination among the metal sheet and the stacked sheets; and cutting the metal card sheet along individual card outlines of the plurality of individual cards.

Abstract: The present invention relates to a metal card and a card manufacturing method, and the metal card includes a metal sheet, a machined part made of a plastic material in such a manner as to be inserted into one side surface of the metal sheet, an insulating sheet with a ferromagnetic insulating material in such a manner as to be attached to the underside of the metal sheet, and an inlay sheet with antenna coils in such a manner as to be attached to the underside of the insulating sheet, wherein the metal sheet has a machined part insertion portion formed on one side surface thereof to insert the machined part, and the ferromagnetic insulating material has the shape of one or more pieces or powder.

Abstract: The present disclosure is directed to methods that provide a secure communication protocol by utilizing one step process of authenticating and encrypting data without having to exchange symmetric keys or needing to renew or re-issue digital identities fundamental to asymmetric encryption methodology.

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).

Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus for each frequency at a temperature of 50° C. or more as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.

Abstract: Provided is a pressure-sensitive adhesive composition for a foldable display, more particularly, a pressure-sensitive adhesive composition for a foldable display which, by satisfying a specific range of storage modulus at high temperature as well as at low temperature and room temperature, not only allows excellent folding properties to be realized but also satisfies excellent adhesion, excellent heat resistance, and excellent recovery rate requirements at the same time.

Abstract: An electronic device is provided. The electronic device includes a housing, a display configured to be exposed through one surface of the housing, a communication module configured to communicate over a first network compliant with a first protocol or a second network compliant with a second protocol, a processor configured to be electrically connected with the display and the communication module, and a memory configured to be electrically connected with the processor and store a specified application. The memory stores instructions, that when executed, cause the processor 420 to execute the specified application, designate a CP server by interacting with a platform server over the second network, receive an initial response message generated by the designated CP server over the first network, and verify a first identifier of the designated CP server based on the first protocol from a source of the initial response message.

Abstract: The present invention relates to a metal card manufacturing method including the steps of: preparing a metal sheet having a given size capable of accommodating a plurality of individual cards; preparing a ferromagnetic insulating sheet made by containing epoxy in a ferrite to the same size capable of accommodating the plurality of individual cards as the metal sheet; preparing an inlay sheet on which antenna coils are printed to the same size as the insulating sheet and forming holes on at least one or more edges of stacked sheets formed by stacking a plurality of sheets inclusive of the insulating sheet and the inlay sheet; fitting the holes formed on the stacked sheets to pins located on a loading plate; placing the metal sheet on top of the stacked sheets; forming a metal card sheet through lamination among the metal sheet and the stacked sheets; and cutting the metal card sheet along individual card outlines of the plurality of individual cards.

Abstract: Provided is a light emitting diode. The light emitting diode includes a substrate, a first semiconductor layer on the substrate, an active layer on the first semiconductor layer, a second semiconductor layer on the active layer, and a conductor passing through the second semiconductor layer and the active layer to contact the first semiconductor layer.