Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A method for sensing damage to a bearing of an engine using a vibration signal may sense the damage to the bearing even without a sensor for directly sensing the damage to the bearing using a frequency signal input to a knocking sensor from the engine for each traveling state (acceleration traveling, cruise traveling, deceleration traveling) of a vehicle.

Abstract: An imaging apparatus includes a camera to capture a camera image of a target disposed on an examination table; an X-ray source to generate and radiate X-rays; a memory to store imaging protocols; a display; and a controller. The controller is configured to receive information regarding a selection of an imaging protocol, identify a position of an imaging region of the target based on the camera image, the imaging region corresponding to the selection of the imaging protocol and the camera image being acquired with the examination table at a first distance from the X-ray source, control the display to display the camera image of the target and an indicator indicating the imaging region on the camera image based on the identified position, and control the X-ray source to radiate the X-rays toward the target disposed on the examination table at a second distance from the X-ray source.

Abstract: A system for controlling a variable oil pump is provided. The system includes a variable oil pump that varies a discharge pressure of oil and an actuator that is operated to vary the discharge pressure of the oil of the variable oil pump. A controller turns the actuator on or off based a relationship between an outdoor temperature and a cooling water temperature of an engine.

Abstract: An x-ray imaging apparatus and a method of controlling the x-ray imaging apparatus are provided. The x-ray imaging apparatus includes x-ray detectors, and a user interface configured to display sizes of the x-ray detectors, and display a modality in which an x-ray detector, among the x-ray detectors, is usable, while a size of the x-ray detector is displayed.

Abstract: A method for sensing damage to a bearing of an engine using a vibration signal may sense the damage to the bearing even without a sensor for directly sensing the damage to the bearing using a frequency signal input to a knocking sensor from the engine for each traveling state (acceleration traveling, cruise traveling, deceleration traveling) of a vehicle.

Abstract: A coil component includes a body, a support substrate disposed within the body, a lead portion disposed on a first surface of the support substrate, a first insulating layer disposed on the first surface of the support substrate to cover the lead portion, a coil unit including a plurality of turns disposed on the first insulating layer, a second insulating layer covering the coil unit, and first and second external electrodes spaced apart from each other on the body, and connected to the coil unit and the lead portion, respectively.

Abstract: Provided is a method for manufacturing a stent, including: coating a coating material on a stent; and drying the stent at a temperature in the range of from 40° C. to 150° C., and the coating and the drying are simultaneously performed.

Abstract: The inventive concept provides a method for treating a surface of an object to be treated, in which a part provided and contaminated in an apparatus for treatment of a substrate such as a wafer serves as the object to be treated. In an embodiment, the surface treatment method includes forming a vacuum in an atmosphere in which the object is provided and cleaning the surface of the object by collision of first particles with contaminants on the surface of the object at supersonic speed.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: The present invention relates to a power transmission apparatus capable of measuring torque and a power generation apparatus using the same, and more particularly, to a power transmission apparatus capable of measuring torque and a power generation apparatus using the same which includes a disk-shaped outer body that receives power from the outside, an inner body that is coupled to the inside of the outer body, and at least one load cell formed between the outer body and the inner body.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

Abstract: A method for manufacturing a metal card includes: a step for forming a metal card by laminating a stack of sheets in which are stacked a plurality of sheets, centered on a metal sheet, including adhesive sheets having the same size as the metal sheet, an upper inlay sheet having a first antenna, and a lower inlay sheet having a second antenna; a step for forming a COB accommodation space, which can accommodate a COB, by milling a certain area of the metal card using computerized numerical control (CNC) machining; a step for forming a through-hole, which exposes the first antenna and the second antenna, by milling a COB contact point region of the COB accommodation space down to the lower inlay sheet; a step for electrically connecting the first antenna and the second antenna by dispensing a conductive elastic liquid into the through-hole; and a step for bidirectionally connecting the first antenna and the second antenna to the COB by attaching the COB within the COB accommodation space so that the COB contact

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.

Abstract: The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.