Patents by Inventor Ippei Nakagawa

Ippei Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11384838
    Abstract: A seal member includes a bottom portion, a first side wall portion, a second side wall portion, and an outer wall portion. At least one of the first side wall portion and the second side wall portion is provided to be outwardly widened from the bottom portion toward the outer wall portion with respect to a virtual plane perpendicular to an axis. The outer wall portion has a recessed portion recessed toward a bottom portion side, between the first side wall portion and the second side wall portion, and the outer wall portion forms a first lip region in a region including the first side wall portion, and forms a second lip region in a region including the second side wall portion, with the recessed portion being sandwiched therebetween.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: July 12, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Ippei Nakagawa, Nobuhiro Yoshida, Hamid Noorbakhsh
  • Patent number: 11231108
    Abstract: Provided is a composite seal member that can maintain performance such as vacuum seal performance, plasma resistance, and corrosive gas resistance over a long period. The composite seal member is mounted in a seal groove provided in a body surface of a first member, and establishes a sealed state between the first member and a second member when the second member is moved closer toward the first member. The composite seal member includes a first seal member disposed on the side of a first side wall of the seal groove and made of an elastic member, and a second seal member disposed on the side of a second side wall of the seal groove and made of a material that is harder than the first seal member.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: January 25, 2022
    Assignee: Valqua, Ltd.
    Inventors: Sangho Kim, Michi Kuroda, Nobuhiro Yoshida, Ippei Nakagawa
  • Publication number: 20210183680
    Abstract: Implementations described herein provide a substrate support assembly that includes a seal band. The seal band has a ring shaped body. The ring shaped body has an inner surface, a top surface, and a bottom surface. Each of the top surface and the bottom surface extend from the inner surface at a first angle of more than 110° from the inner surface. The seal band also has an outer surface that has an indent formed therein. The outer surface connects the top surface to the bottom surface. A second angle is formed between an imaginary line normal to the inner surface and the bottom surface. The second angle is between about 10° and about 30°. The ring shaped body has a cross-sectional profile forming a V-shape.
    Type: Application
    Filed: February 24, 2021
    Publication date: June 17, 2021
    Inventors: Hamid NOORBAKHSH, Ippei NAKAGAWA, Nobuhiro YOSHIDA
  • Patent number: 10943808
    Abstract: Implementations described herein provide a substrate support assembly that includes a seal band. The seal band protects an adhesive layer that is disposed between an electrostatic chuck (ESC) and a cooling plate of the substrate support assembly. In one example, a substrate support assembly includes an electrostatic chuck and a cooling plate. A bonding layer secures a bottom surface of the electrostatic chuck to a top surface of the cooling plate. The bonding layer has an adhesive layer and a seal band. The seal band circumscribes and protects the adhesive layer. The seal band has a ring shaped body. The ring shaped body has a top surface connected to a bottom surface by an inner surface and an outer surface. The top surface and the bottom surface angled less than 85 degrees from the inner surface. The outer surface has an indent formed therein.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: March 9, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Hamid Noorbakhsh, Ippei Nakagawa, Nobuhiro Yoshida
  • Publication number: 20190353250
    Abstract: Provided is a composite seal member that can maintain performance such as vacuum seal performance, plasma resistance, and corrosive gas resistance over a long period. The composite seal member is mounted in a seal groove provided in a body surface of a first member, and establishes a sealed state between the first member and a second member when the second member is moved closer toward the first member. The composite seal member includes a first seal member disposed on the side of a first side wall of the seal groove and made of an elastic member, and a second seal member disposed on the side of a second side wall of the seal groove and made of a material that is harder than the first seal member.
    Type: Application
    Filed: January 24, 2018
    Publication date: November 21, 2019
    Inventors: Sangho Kim, Michi Kuroda, Nobuhiro Yoshida, Ippei Nakagawa
  • Publication number: 20190242480
    Abstract: A seal member includes a bottom portion, a first side wall portion, a second side wall portion, and an outer wall portion. At least one of the first side wall portion and the second side wall portion is provided to be outwardly widened from the bottom portion toward the outer wall portion with respect to a virtual plane perpendicular to an axis. The outer wall portion has a recessed portion recessed toward a bottom portion side, between the first side wall portion and the second side wall portion, and the outer wall portion forms a first lip region in a region including the first side wall portion, and forms a second lip region in a region including the second side wall portion, with the recessed portion being sandwiched therebetween.
    Type: Application
    Filed: September 5, 2017
    Publication date: August 8, 2019
    Inventors: Ippei NAKAGAWA, Nobuhiro YOSHIDA
  • Patent number: D877865
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: March 10, 2020
    Assignee: VALQUA, LTD.
    Inventor: Ippei Nakagawa
  • Patent number: D896353
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 15, 2020
    Assignee: VALQUA, LTD.
    Inventor: Ippei Nakagawa
  • Patent number: D898170
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: October 6, 2020
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa, Sangho Kim
  • Patent number: D901648
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: November 10, 2020
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D909322
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: February 2, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D909323
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: February 2, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D917028
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: April 20, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D922027
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: June 15, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa, Sangho Kim
  • Patent number: D922546
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: June 15, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa, Sangho Kim
  • Patent number: D933031
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 12, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D933032
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 12, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D933033
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 12, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D933619
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 19, 2021
    Assignee: Valqua, Ltd.
    Inventors: Nobuhiro Yoshida, Ippei Nakagawa
  • Patent number: D942596
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 1, 2022
    Assignee: VALQUA, LTD.
    Inventor: Ippei Nakagawa