Composite seal member for semiconductor production apparatus
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Claims
The ornamental design for composite seal member for semiconductor production apparatus, as shown and described.
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Type: Grant
Filed: May 14, 2018
Date of Patent: Oct 6, 2020
Assignee: Valqua, Ltd. (Tokyo)
Inventors: Nobuhiro Yoshida (Gojo), Ippei Nakagawa (Gojo), Sangho Kim (Gojo)
Primary Examiner: Richard E Chilcot
Application Number: 35/506,052