Composite seal member for semiconductor production apparatus

- Valqua, Ltd.
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Description

1.1 is a perspective view of a composite seal member for semiconductor production apparatus, showing our new design;

1.2 is a front elevation view thereof;

1.3 is a rear elevation view thereof;

1.4 is a left side elevation view thereof;

1.5 is a right side elevation view thereof;

1.6 is a top view thereof;

1.7 is a bottom view thereof;

1.8 is a cross-sectional view thereof;

1.9 is an enlarged cross-sectional view of a portion thereof; and

1.10 is an enlarged cross-sectional view of a portion thereof in a condition of use.

The broken lines shown in Reproduction 1.10 are for the purposes of illustrating environmental structure and form no part of the claimed design.

Claims

The ornamental design for composite seal member for semiconductor production apparatus, as shown and described.

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Patent History
Patent number: D898170
Type: Grant
Filed: May 14, 2018
Date of Patent: Oct 6, 2020
Assignee: Valqua, Ltd. (Tokyo)
Inventors: Nobuhiro Yoshida (Gojo), Ippei Nakagawa (Gojo), Sangho Kim (Gojo)
Primary Examiner: Richard E Chilcot
Application Number: 35/506,052
Classifications
Current U.S. Class: Gasket Or Packing (D23/269)