Patents by Inventor ISAAC Q. WANG

ISAAC Q. WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240006827
    Abstract: An information handling system includes a plug-in connector interface and an accelerator module installed into the plug-in connector interface. The plug-in connector interface is located at a location on a printed circuit board of the information handling system. The information handling system instantiates a workload on a processor, and allocates a processing resource of the accelerator module to the workload based upon the plug-in connector interface being located at the location.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventors: Isaac Q. Wang, Jordan Chin
  • Patent number: 11837522
    Abstract: An information handling system includes a printed circuit board (PCB) and an integrated circuit device. The integrated circuit device includes a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate. The substrate includes a ball grid array (BGA) on the first surface of the substrate. The integrated circuit device is bonded to a first surface of the PCB via the BGA. The die is collocated with the cutout area.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: December 5, 2023
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Isaac Q. Wang
  • Patent number: 11829212
    Abstract: In one embodiment, a method for distributing power using a power distribution system includes: receiving, by a first power distribution end of a power conductor of the power distribution system, power from a power supply unit via a first cable coupled to the power supply unit, the first power distribution end coupled to a first connector, the first connector including a first power interface coupling the first power distribution end to the first cable, the power conductor contoured to removably couple to a heatsink of the information handling system; and providing, by a second power distribution end of the power conductor, the power to a component of the information handling system via a second cable coupled to the component, the second power distribution end coupled to a second connector, the second connector including a second power interface coupling the second power distribution end to the second cable.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Corey D. Hartman, Timothy M. Lambert, Isaac Q. Wang
  • Patent number: 11757223
    Abstract: An information handling system may include a printed circuit board and a plurality of connectors each electrically and mechanically coupled to the printed circuit board, each connector of the plurality of connectors configured to receive a respective modular information handling resource in order to electrically couple, via electrically-conductive pins of such connector, the respective modular information handling resource to the printed circuit board. Each connector may include a body comprising electrically non-conductive material and including a receptacle formed therein for receiving a mating edge connector of the respective modular information handling resource, a bus bar comprising electrically conductive material, other than the electrically-conductive pins of such connector, disposed within or upon the body and extending through at least a portion of the body, and an electrical termination electrically coupled to the bus bar.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Timothy M. Lambert, Corey D. Hartman
  • Patent number: 11662793
    Abstract: A method of selectively disabling power delivery to a group of memory devices of an information handling system, the method including performing an initialization of a first memory device and a second memory device of the memory devices; after performing the initialization of the memory devices, performing boot procedures at the first memory device and the second memory device; while performing the boot procedures at the first memory device and the second memory device, detecting a memory failure of the first memory device; in response to detecting the memory failure of the first memory device, providing a signal to a power management integrate circuit (PMIC) of the first memory device to disable power at the first memory device; and continuing the boot procedures at the second memory device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 30, 2023
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Lee Zaretsky
  • Publication number: 20230102559
    Abstract: In one embodiment, a method for distributing power using a power distribution system includes: receiving, by a first power distribution end of a power conductor of the power distribution system, power from a power supply unit via a first cable coupled to the power supply unit, the first power distribution end coupled to a first connector, the first connector including a first power interface coupling the first power distribution end to the first cable, the power conductor contoured to removably couple to a heatsink of the information handling system; and providing, by a second power distribution end of the power conductor, the power to a component of the information handling system via a second cable coupled to the component, the second power distribution end coupled to a second connector, the second connector including a second power interface coupling the second power distribution end to the second cable.
    Type: Application
    Filed: September 27, 2021
    Publication date: March 30, 2023
    Inventors: Corey D. Hartman, Timothy M. Lambert, Isaac Q. Wang
  • Patent number: 11599496
    Abstract: An information handling system includes an identification resistor, calibration circuitry, and a system-on-a-chip (SOC). The SOC sets the calibration line to a first digital state to place the calibration circuitry in an inventory mode. While the calibration circuitry is in the inventory mode, the SOC determines an inventory amount of time to charge the capacitor to a voltage substantially equal to a threshold voltage. The SOC then sets the calibration line to a second digital state to place the calibration circuitry in a calibration mode. While the calibration circuitry is in the calibration mode, the SOC determines a calibration amount of time to charge the capacitor to the voltage substantially equal to the threshold voltage. The SOC determines a resistance of the identification resistor based on the inventory amount of time and the calibration amount of time. The SOC also determines bit strapping information corresponding to the determined resistance.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: March 7, 2023
    Assignee: Dell Products L.P.
    Inventors: James L. Petivan, III, Isaac Q. Wang, Yeshaswy Rajupalepu
  • Publication number: 20230065935
    Abstract: A method of selectively disabling power delivery to a group of memory devices of an information handling system, the method including performing an initialization of a first memory device and a second memory device of the memory devices; after performing the initialization of the memory devices, performing boot procedures at the first memory device and the second memory device; while performing the boot procedures at the first memory device and the second memory device, detecting a memory failure of the first memory device; in response to detecting the memory failure of the first memory device, providing a signal to a power management integrate circuit (PMIC) of the first memory device to disable power at the first memory device; and continuing the boot procedures at the second memory device.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Isaac Q. Wang, Lee Zaretsky
  • Patent number: 11592894
    Abstract: In one embodiment, a method for increasing power efficiency for an information handling system includes: monitoring, by a host service, one or more performance metrics associated with a memory device of the information handling system, the memory device including a power controller communicably coupled to a management device via a side-band bus; predicting, by the host service, an energy requirement for the memory device based on the one or more performance metrics; generating, by the host service, a power configuration profile based on the energy requirement, the power configuration profile indicating one or more power controller parameters associated with the power controller; sending, by the host service, the power configuration profile to the management device; receiving, by the management device, the power configuration profile; and modifying, by the management device and via the side-band bus, the one or more power controller parameters based on the power configuration profile.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Lee B. Zaretsky
  • Publication number: 20220382334
    Abstract: An information handling system may include a battery, a circuit board, an enclosure, and a control circuit. The circuit board may include at least one electric component, a first electrically conductive pad, and a second electrically conductive pad in proximity to the first electrically conductive pad. The enclosure may be configured to house components of the information handling system including the battery and the circuit board, and the enclosure may include a first member, a second member configured to be mechanically coupled to the first member, and a mechanical component comprising conductive material and configured to electrically short the first electrically conductive pad to the second electrically conductive pad when the first member is mechanically coupled to the second member, and cause electrical isolation of the first electrically conductive pad from the second electrically conductive pad when the first member is mechanically decoupled from the second member.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 1, 2022
    Applicant: Dell Products L.P.
    Inventors: Isaac Q. WANG, Anthony W. HOWARD
  • Patent number: 11510305
    Abstract: A static resistant fan apparatus, comprising: a conductive shaft; a first conductive fan blade connected to the conductive shaft and extending away from the conductive shaft; a second conductive fan blade connected to the conductive shaft and extending away from the conductive shaft opposite to the first conductive fan blade; a conductive support structure surrounding the conductive shaft, wherein an inner edge of the support structure is spaced apart from the conductive shaft a distance; and a conductive ground pass coupled between the conductive shaft and the support structure and spanning the distance, wherein the conductive shaft, the conductive support structure, and the conductive ground pass provide a path to ground for the first conductive and the second conductive fan blades.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: November 22, 2022
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Qinghong He
  • Patent number: 11500427
    Abstract: An information handling system may include a battery, a circuit board, an enclosure, and a control circuit. The circuit board may include at least one electric component, a first electrically conductive pad, and a second electrically conductive pad in proximity to the first electrically conductive pad. The enclosure may be configured to house components of the information handling system including the battery and the circuit board, and the enclosure may include a first member, a second member configured to be mechanically coupled to the first member, and a mechanical component comprising conductive material and configured to electrically short the first electrically conductive pad to the second electrically conductive pad when the first member is mechanically coupled to the second member, and cause electrical isolation of the first electrically conductive pad from the second electrically conductive pad when the first member is mechanically decoupled from the second member.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: November 15, 2022
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Anthony W. Howard
  • Publication number: 20220336981
    Abstract: An information handling system may include a printed circuit board and a plurality of connectors each electrically and mechanically coupled to the printed circuit board, each connector of the plurality of connectors configured to receive a respective modular information handling resource in order to electrically couple, via electrically-conductive pins of such connector, the respective modular information handling resource to the printed circuit board. Each connector may include a body comprising electrically non-conductive material and including a receptacle formed therein for receiving a mating edge connector of the respective modular information handling resource, a bus bar comprising electrically conductive material, other than the electrically-conductive pins of such connector, disposed within or upon the body and extending through at least a portion of the body, and an electrical termination electrically coupled to the bus bar.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 20, 2022
    Applicant: Dell Products L.P.
    Inventors: Isaac Q. WANG, Timothy M. LAMBERT, Corey D. HARTMAN
  • Publication number: 20220336320
    Abstract: An information handling system includes a printed circuit board (PCB) and an integrated circuit device. The integrated circuit device includes a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate. The substrate includes a ball grid array (BGA) on the first surface of the substrate. The integrated circuit device is bonded to a first surface of the PCB via the BGA. The die is collocated with the cutout area.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 20, 2022
    Inventors: Qinghong He, Isaac Q. Wang
  • Publication number: 20220326758
    Abstract: In one embodiment, a method for increasing power efficiency for an information handling system includes: monitoring, by a host service, one or more performance metrics associated with a memory device of the information handling system, the memory device including a power controller communicably coupled to a management device via a side-band bus; predicting, by the host service, an energy requirement for the memory device based on the one or more performance metrics; generating, by the host service, a power configuration profile based on the energy requirement, the power configuration profile indicating one or more power controller parameters associated with the power controller; sending, by the host service, the power configuration profile to the management device; receiving, by the management device, the power configuration profile; and modifying, by the management device and via the side-band bus, the one or more power controller parameters based on the power configuration profile.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 13, 2022
    Inventors: Isaac Q. Wang, Lee B. Zaretsky
  • Publication number: 20220327090
    Abstract: An information handling system includes an identification resistor, calibration circuitry, and a system-on-a-chip (SOC). The SOC sets the calibration line to a first digital state to place the calibration circuitry in an inventory mode. While the calibration circuitry is in the inventory mode, the SOC determines an inventory amount of time to charge the capacitor to a voltage substantially equal to a threshold voltage. The SOC then sets the calibration line to a second digital state to place the calibration circuitry in a calibration mode. While the calibration circuitry is in the calibration mode, the SOC determines a calibration amount of time to charge the capacitor to the voltage substantially equal to the threshold voltage. The SOC determines a resistance of the identification resistor based on the inventory amount of time and the calibration amount of time. The SOC also determines bit strapping information corresponding to the determined resistance.
    Type: Application
    Filed: April 28, 2022
    Publication date: October 13, 2022
    Inventors: James L. Petivan, III, Isaac Q. Wang, Yeshaswy Rajupalepu
  • Patent number: 11347677
    Abstract: An information handling system includes an identification resistor, calibration circuitry, and a system-on-a-chip (SOC). The SOC sets the calibration line to a first digital state to place the calibration circuitry in an inventory mode. While the calibration circuitry is in the inventory mode, the SOC determines an inventory amount of time to charge the capacitor to a voltage substantially equal to a threshold voltage. The SOC then sets the calibration line to a second digital state to place the calibration circuitry in a calibration mode. While the calibration circuitry is in the calibration mode, the SOC determines a calibration amount of time to charge the capacitor to the voltage substantially equal to the threshold voltage. The SOC determines a resistance of the identification resistor based on the inventory amount of time and the calibration amount of time. The SOC also determines bit strapping information corresponding to the determined resistance.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: May 31, 2022
    Assignee: Dell Products L.P.
    Inventors: James L. Petivan, III, Isaac Q. Wang, Yeshaswy Rajupalepu
  • Patent number: 11291106
    Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: March 29, 2022
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Jordan H. Chin, James L. Petivan, Robert Boyd Curtis, Tim M. Spencer
  • Patent number: 11146054
    Abstract: A computing device includes a module that connects to a main board and a short detector. The short detector applies a voltage to a first electrical contact of the module; while the voltage is applied: makes a comparison of a second voltage on a second electrical contact of the module to the voltage; makes a determination, based on the comparison, that the first electrical contact is connected to the second electrical contact via a short circuit; and in response to the determination, initiates remediation of the short circuit.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: October 12, 2021
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, James L. Petivan
  • Patent number: 11126220
    Abstract: An information handling system includes a synchronizer and a module identifier. The module identifier identifies a module identification event for a module attached to the information handling system; in response to identifying the module identification event: obtains a module identifier from the module, and makes a determination that the module identifier indicates that the module is a synchronization type of module, and initiates, based on the determination, time synchronization for the information handling system with a second information handling system using the module and the synchronizer.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: September 21, 2021
    Assignee: DELL PRODUCTS L.P.
    Inventors: Isaac Q. Wang, Timothy M. Lambert