Abstract: The present invention provides a resin molding method that can produce a molded product that is inexpensive and represents a small linear expansion coefficient, a high degree of resistance to various liquids and an excellent mold releasability as well as a high degree of dimensional accuracy. The resin molding method includes a step of plasticizing thermosetting resin (S2) and injecting the plasticized thermosetting resin into the cavity of a metal mold apparatus (S3), a step of curing the thermosetting resin in the cavity (S4) and a step of opening the mold (S5). The step of opening the mold (S5) is executed when the mold that forms the cavity is at a temperature not lower than the glass transition point Tg of the thermosetting resin.

Abstract: A sealant contains a dicyclopentadiene type epoxy resin represented by formula 1 below, a hydrogenated bisphenol A epoxy resin, and a photo-induced cationic polymerization initiator, in which the content of the dicyclopentadiene type epoxy resin is 15 to 40 parts by mass relative to 100 parts by mass of the total mass of epoxy resins contained in the sealant. where n represents an integer of 0 to 2.

Abstract: A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.

Abstract: A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.

Abstract: A liquid ejection head includes a chip having a liquid ejection pressure generating element and an electrode terminal for electrically connecting the liquid ejection pressure generating element to an external source, an electrical wiring board having a lead wiring to be electrically connected to the electrode terminal, and a lead sealing material for covering an electrical connection portion between the electrode terminal and the lead wiring. The lead sealing material contains an epoxy resin which has an average number of functional groups per molecule of more than two and is solid at 25° C., an acid anhydride curing agent having a polybutadiene backbone, a curing accelerator, and an inorganic filler.

Abstract: A liquid discharge head includes a substrate having, on one side thereof, energy generating elements for generating energy used for discharging liquid, and a sealing member arranged in contact with at least a part of one or more end faces of the substrate, the sealing member being a cured product of a composition having an epoxy resin having a butadiene skeleton and an epoxy resin curing agent having a butadiene skeleton.

Abstract: An inkjet head includes a discharge element substrate including a base material provided with an energy generation element for generating energy to be used for discharging ink, a discharge port provided corresponding to the energy generation element, and an electrode pad electrically connected to the energy generation element, an electric contact substrate including an electric contact terminal for receiving an electric signal from an inkjet apparatus, and an electric wiring tape for electrically connecting the electric contact substrate and the discharge element substrate to each other, wherein a sealing member sealing a vicinity of an electric connection portion between the electric contact substrate and the electric wiring tape is a cured product of a composition including a silicone-modified resin, a boron trifluoride compound, and a mercaptosilane compound.

Abstract: A liquid discharge head comprises a discharge port forming member having formed therein a discharge port arranged corresponding to an energy generating element which generates energy to eject a liquid and a flow path forming member for forming a flow path to supply ink to the discharge port. At least one of the discharge port forming member and the flow path forming member is made of a cured material of a composition containing an epoxy resin and a phenol resin having a higher oxygen equivalent than that of the epoxy resin.

Abstract: Sealants discharged from a syringe are irradiated with activation energy rays from a lamp. Thereby, it takes a predetermined time until the curing of the sealant begins after the irradiation of the activation energy rays. Therefore, the sealant can pass through between the lead wires in the meantime. As a result, a necessary amount of the sealant can enter into the lower side of the lead wire. Thereafter, the sealant begins to be cured and is gradually cured. In consequence, the sealant does not go through between the lead wires to flow into the lower side of the lead wire or flow out into locations other than the sealing location, and can gradually accumulate at the upper side of the lead wire to provide a sufficiently thick sealant.

Abstract: Provided is a liquid ejection head, comprising a chip having a liquid ejection pressure generating element and an electrode terminal for electrically connecting the liquid ejection pressure generating element to an outside, an electrical wiring board having a lead wiring to be electrically connected to the electrode terminal, and a lead sealing material for covering an electrical connection portion between the electrode terminal and the lead wiring. The lead sealing material contains an epoxy resin (a) which has an average number of functional groups per molecule of more than two and is solid at 25° C., an acid anhydride curing agent (b) having a polybutadiene backbone, a curing accelerator (c), and an inorganic filler (d).

Abstract: An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

Abstract: A sealant for an ink jet head includes at least an oxetane compound having a biphenyl skeleton, an alicyclic epoxy compound, and a cationic polymerization initiator.

Abstract: An inkjet head includes a discharge element substrate including a base material provided with an energy generation element for generating energy to be used for discharging ink, a discharge port provided corresponding to the energy generation element, and an electrode pad electrically connected to the energy generation element, an electric contact substrate including an electric contact terminal for receiving an electric signal from an inkjet apparatus, and an electric wiring tape for electrically connecting the electric contact substrate and the discharge element substrate to each other, wherein a sealing member sealing a vicinity of an electric connection portion between the electric contact substrate and the electric wiring tape is a cured product of a composition including a silicone-modified resin, a boron trifluoride compound, and a mercaptosilane compound.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: In a method for manufacturing a liquid discharge head having a support member bonded with an adhesive to a discharge element substrate forming a discharge port for discharging a liquid, the adhesive contains a multifunctional epoxy resin of epoxy equivalent of 150 or less, a curing agent, and a mercapto silane coupling agent. The adhesive is applied to one side or both sides of junction surfaces of both members, both members of the liquid discharge head are positioned, heated and pressed, and the adhesive is cured to bond both members.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: A liquid discharge head includes a substrate having, on one side thereof, energy generating elements for generating energy used for discharging liquid, and a sealing member arranged in contact with at least a part of one or more end faces of the substrate, the sealing member being a cured product of a composition having an epoxy resin having a butadiene skeleton and an epoxy resin curing agent having a butadiene skeleton.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.