Abstract: An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: Sealants discharged from a syringe are irradiated with activation energy rays from a lamp. Thereby, it takes a predetermined time until the curing of the sealant begins after the irradiation of the activation energy rays. Therefore, the sealant can pass through between the lead wires in the meantime. As a result, a necessary amount of the sealant can enter into the lower side of the lead wire. Thereafter, the sealant begins to be cured and is gradually cured. In consequence, the sealant does not go through between the lead wires to flow into the lower side of the lead wire or flow out into locations other than the sealing location, and can gradually accumulate at the upper side of the lead wire to provide a sufficiently thick sealant.

Abstract: An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and having a number average molecular weight ranging from 8,000 to 22,000 and a polydispersity ranging from 3.5 to 5.0, (ii) a second epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, having a number average molecular weight ranging from 2,500 to 8,000 and a polydispersity ranging from 1.5 to 3.0, and (iii) a cationic polymerization catalyst.

Abstract: A sealant for an ink jet head includes at least an oxetane compound having a biphenyl skeleton, an alicyclic epoxy compound, and a cationic polymerization initiator.

Abstract: A liquid discharge head comprises a discharge port forming member having formed therein a discharge port arranged correspond to an energy generating element which generates energy to eject a liquid and a flow path forming member for forming a flow path to supply ink to the discharge port. At least one of the discharge port forming member and the flow path forming member is made of a cured material of a composition containing an epoxy resin and a phenol resin having a higher oxygen equivalent than that of the epoxy resin.

Abstract: A liquid discharge head including a discharge element substrate including an orifice plate having a discharge port for discharging a liquid, and a supply port opened in the reverse side of the surface forming the discharge port for supplying a liquid into the discharge port; a support member having a supply path for supplying a liquid into the supply port; and a flexible wiring substrate having a blanking portion for transmitting a signal for discharging a liquid to the discharge element substrate. The discharge element substrate is electrically connected to the flexible wiring substrate on the surface opening the supply port, the flexible wiring substrate is bonded to both the discharge element substrate and the support member by means of an adhesive, the end face of the blanking portion is covered with the adhesive, the covered blanking portion communicates with the supply port, and the adhesive is a thermally fusible adhesive composed of denatured polyolefin, having a softening point of 80° C. or higher.

Abstract: An epoxy resin composition can be used for forming a film having excellent water-repellency on a substrate surface. The epoxy resin composition contains (a) an epoxy resin having at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, and at least one alkylsiloxane group and (b) a cationic polymerization catalyst. The alicyclic epoxy groups and the perfluoroalkyl group are present in branched chains of the epoxy resin, and the alkylsiloxane group is present in the main chain of the epoxy resin.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: In a method for manufacturing a liquid discharge head having a support member bonded with an adhesive to a discharge element substrate forming a discharge port for discharging a liquid, the adhesive contains a multifunctional epoxy resin of epoxy equivalent of 150 or less, a curing agent, and a mercapto silane coupling agent, and the adhesive is applied to one side or both sides of junction surfaces of the both members, and the both members of the liquid discharge head are positioned, and heated and pressed, and the adhesive is cured to bond the both members.

Abstract: A liquid discharge head comprising: a discharge element substrate including an orifice plate having a discharge port for discharging a liquid, and a supply port opened in the reverse side of the surface forming the discharge port for supplying a liquid into the discharge port; a support member having a supply path for supplying a liquid into the supply port; and a flexible wiring substrate having a blanking portion for transmitting a signal for discharging a liquid to the discharge element substrate. The discharge element substrate is electrically connected to the flexible wiring substrate on the surface opening the supply port, the flexible wiring substrate is bonded to both the discharge element substrate and the support member by means of an adhesive, and the end face of the blanking portion is covered with the adhesive, the covered blanking portion communicates with the supply port, and the adhesive is a thermally fusible adhesive composed of denatured polyolefin, having a softening point of 80° C.

Abstract: An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and having a number average molecular weight ranging from 8,000 to 22,000 and a polydispersity ranging from 3.5 to 5.0, (ii) a second epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, having a number average molecular weight ranging from 2,500 to 8,000 and a polydispersity ranging from 1.5 to 3.0, and (iii) a cationic polymerization catalyst.

Abstract: An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and having a number average molecular weight ranging from 8,000 to 22,000 and a polydispersity ranging from 3.5 to 5.0, (ii) a second epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, having a number average molecular weight ranging from 2,500 to 8,000 and a polydispersity ranging from 1.5 to 3.0, and (iii) a cationic polymerization catalyst.

Abstract: An epoxy resin composition can be used for forming a film having excellent water-repellency on a substrate surface. The epoxy resin composition contains (a) an epoxy resin having at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, and at least one alkylsiloxane group and (b) a cationic polymerization catalyst. The alicyclic epoxy groups and the perfluoroalkyl group are present in branched chains of the epoxy resin, and the alkylsiloxane group is present in the main chain of the epoxy resin.

Abstract: An epoxy resin composition can be used for forming a film having excellent water-repellency on a substrate surface. The epoxy resin composition contains (a) an epoxy resin having at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, and at least one alkylsiloxane group and (b) a cationic polymerization catalyst. The alicyclic epoxy groups and the perfluoroalkyl group are present in branched chains of the epoxy resin, and the alkylsiloxane group is present in the main chain of the epoxy resin.

Abstract: A manufacturing method of an ink-jet recording head includes the following steps. An ink-repellent second active energy ray setting resin is coated over a first active energy ray setting resin for forming a liquid path. The first resin is set. Both resins are exposed, and both resins are developed.

Abstract: An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

Abstract: An epoxy resin composition suitable for forming a film of excellent water repellency which comprises an epoxy resin having one or more water repellent groups and two or more cyclic aliphatic epoxy groups per molecule, a triazine-base catalyst for cationic polymerization and a non-polar solvent.