Patents by Inventor Issei Yamamoto

Issei Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180190595
    Abstract: A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.
    Type: Application
    Filed: December 22, 2017
    Publication date: July 5, 2018
    Inventors: Yoshihisa MASUDA, Ryoichi Kita, Issei Yamamoto, Katsuki Nakanishi, Yukio Nakazawa
  • Publication number: 20180108618
    Abstract: A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.
    Type: Application
    Filed: December 19, 2017
    Publication date: April 19, 2018
    Inventors: Issei Yamamoto, Atsushi Shimizu, Yoichi Takagi, Hideo Nakagoshi
  • Publication number: 20180092201
    Abstract: A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.
    Type: Application
    Filed: December 4, 2017
    Publication date: March 29, 2018
    Inventors: Yoshihito Otsubo, Issei Yamamoto, Takuya Murayama, Tadashi Nomura
  • Publication number: 20180092257
    Abstract: The characteristics of a shield wall that prevents the mutual interference of the noise between components are improved by lowering the resistance of the shield wall. A high-frequency module 1a includes a wiring board 2, a plurality of components 3a to 3e mounted on an upper surface 2a of the wiring board 2, a sealing resin layer 4 stacked on the upper surface 2a of the wiring board 2 to seal the components 3a to 3e, and a shield wall 5 disposed between the adjacent components in the sealing resin layer 4. A part of the shield wall 5 is constituted of metal pins 5a standing on the upper surface 2a of the wiring board 2.
    Type: Application
    Filed: November 10, 2017
    Publication date: March 29, 2018
    Inventors: Yoshihito Otsubo, Issei Yamamoto
  • Publication number: 20180077829
    Abstract: A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.
    Type: Application
    Filed: November 20, 2017
    Publication date: March 15, 2018
    Inventor: Issei YAMAMOTO
  • Patent number: 9781828
    Abstract: A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: October 3, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Issei Yamamoto, Yoshihito Otsubo
  • Publication number: 20170250061
    Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.
    Type: Application
    Filed: February 8, 2017
    Publication date: August 31, 2017
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Issei YAMAMOTO, Atsushi SHIMIZU, Yoichi TAKAGI, Hideo NAKAGOSHI, Toru KOMATSU, Hideki SHINKAI, Tetsuya ODA
  • Publication number: 20170229859
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.
    Type: Application
    Filed: April 24, 2017
    Publication date: August 10, 2017
    Inventors: Jun ADACHI, Jun URAKAWA, Issei YAMAMOTO
  • Patent number: 9681593
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: June 13, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jun Adachi, Jun Urakawa, Issei Yamamoto
  • Patent number: 9674970
    Abstract: In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: June 6, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Issei Yamamoto, Akihiko Kamada
  • Patent number: 9192051
    Abstract: In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: November 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Issei Yamamoto
  • Publication number: 20150140201
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.
    Type: Application
    Filed: January 29, 2015
    Publication date: May 21, 2015
    Inventors: Jun ADACHI, Jun URAKAWA, Issei YAMAMOTO
  • Patent number: 8975099
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: March 10, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jun Adachi, Jun Urakawa, Issei Yamamoto
  • Publication number: 20140261969
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.
    Type: Application
    Filed: June 3, 2014
    Publication date: September 18, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Jun ADACHI, Jun URAKAWA, Issei YAMAMOTO
  • Patent number: 8779466
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: July 15, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jun Adachi, Jun Urakawa, Issei Yamamoto
  • Patent number: 8437114
    Abstract: An ESD protection device is constructed such that its ESD characteristics are easily adjusted and stabilized and degradation of discharge characteristics caused by repetitive discharges is reliably prevented. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least a pair of discharge electrodes including exposed portions arranged to face each other and to be exposed in the cavity, external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes, and a conductive material dispersed along at least a portion of an inner circumferential surface which defines the cavity between the exposed portions of the discharge electrodes, the conductive material including an anchor portion embedded in the insulating substrate.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: May 7, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Issei Yamamoto, Jun Adachi, Akihiko Kamada
  • Patent number: 8426889
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: April 23, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Jun Adachi, Jun Urakawa, Issei Yamamoto
  • Patent number: 8428669
    Abstract: [Object] To provide a portable terminal device accepting an input operation in accordance with acceleration, which is less prone to cause incorrect input and allows a user to perform easily an input operation. [Constitution] A mobile phone includes an acceleration sensor 13 for detecting acceleration produced on a mobile phone main body; a cumulative value calculating section 100a for calculating a cumulative value of detected acceleration; a comparing section 100b for comparing the cumulative value with a threshold value; and a CPU 100 for controlling a security lock mode in accordance with a result of comparison by the comparing section 100b. When the cumulative value has exceeded the threshold value by a user shaking the mobile phone, the CPU 100 cancels the security lock mode.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: April 23, 2013
    Assignee: KYOCERA Corporation
    Inventor: Issei Yamamoto
  • Publication number: 20120320536
    Abstract: In a module substrate, a plurality of terminal connection substrates each including an insulator and a plurality of columnar terminal electrodes arranged on a single lateral surface or both lateral surfaces of the insulator is mounted on a single side of a composite substrate such that at least one of the terminal connection substrates extends over a border between a plurality of neighboring module substrates. The composite substrate, in which the plurality of terminal connection substrates is mounted on the single side and a plurality of electronic components is mounted on at least the single side, is divided at a location where the module substrates are to be cut from the composite substrate.
    Type: Application
    Filed: August 29, 2012
    Publication date: December 20, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Issei YAMAMOTO
  • Publication number: 20110222197
    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.
    Type: Application
    Filed: May 23, 2011
    Publication date: September 15, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Jun ADACHI, Jun URAKAWA, Issei YAMAMOTO