Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

Abstract: Systems and methods are provided for compensating for parasitics in current measurements utilizing series current sense resistors. In one or more embodiments, the techniques include connecting a probe to a terminal of a circuit and a waveform measuring device. A waveform measuring device then acquires, through the probe, a voltage waveform. A virtual probe netlist is generated, where the netlist is descriptive of a series resistance and associated parasitics. A virtual probe processor converts, based on the virtual probe netlist, the voltage waveform to a current waveform representative of a current in the circuit.

Abstract: Methodologies and systems are described herein whereby performance parameters of a power converter may be tested. In one or more embodiments, a system for testing the performance parameters comprises a multi-channel monitoring device including a first channel for monitoring a switch voltage of a power converter and a second channel for concurrently monitoring an output voltage of the power converter. The system further comprises a set of one or more processors for generating, as a function of the switch voltage and the output voltage, and displaying an inductor current waveform approximating current through an inductor of the power converter. Additionally or alternatively, other waveforms such as output current waveforms and inductor voltage waveforms, may be generated during testing of the power converter. An arbitrary wave generator may inject different signals during testing of the power converter.

Abstract: An inductor current measurement probe apparatus and system are described herein. In an embodiment, a system comprises a probe interconnect including a first connector that couples to a positive terminal of the inductor and a second connector that couples to a negative terminal of the inductor. The system further comprises an RC filter that is coupled to the probe interconnect and that includes at least one resistor and at least one capacitor in an arrangement that converts a voltage of the inductor to a differential capacitor voltage. The system further comprises a differential active probe input circuitry including a positive terminal and a negative terminal that are coupled to the RC filter and arranged to convert the differential capacitor voltage to a single-ended capacitor voltage. In other embodiments, the RC filter may be coupled directly to the inductor. The system may further convert the capacitor voltage to inductor current.

Abstract: Systems and methods are provided for compensating for parasitics in current measurements utilizing series current sense resistors. In one or more embodiments, the techniques include connecting a probe to a terminal of a circuit and a waveform measuring device. A waveform measuring device then acquires, through the probe, a voltage waveform. A virtual probe netlist is generated, where the netlist is descriptive of a series resistance and associated parasitics. A virtual probe processor converts, based on the virtual probe netlist, the voltage waveform to a current waveform representative of a current in the circuit.

Abstract: Methodologies and systems are described herein whereby the electrical performance of a device may be tested. In one or more embodiments, a system for testing the electrical performance comprises a monitoring device configured to perform a set of operations including concurrently monitoring at least three different test points of a device under test (DUT) and aggregating test data comprising signal information collected concurrently from at least three different test points of the DUT. In one or more embodiments, the system is configured to monitor at least three channels wherein at least one channel corresponds to a frequency range of less than 300 kHz and the phases of signals on at least three channels are different.

Abstract: An inductor current measurement probe apparatus and system are described herein. In an embodiment, a system comprises a probe interconnect including a first connector that couples to a positive terminal of the inductor and a second connector that couples to a negative terminal of the inductor. The system further comprises an RC filter that is coupled to the probe interconnect and that includes at least one resistor and at least one capacitor in an arrangement that converts a voltage of the inductor to a differential capacitor voltage. The system further comprises a differential active probe input circuitry including a positive terminal and a negative terminal that are coupled to the RC filter and arranged to convert the differential capacitor voltage to a single-ended capacitor voltage. In other embodiments, the RC filter may be coupled directly to the inductor. The system may further convert the capacitor voltage to inductor current.

Abstract: Methodologies and systems are described herein whereby performance parameters of a power converter may be tested. In one or more embodiments, a system for testing the performance parameters comprises a multi-channel monitoring device including a first channel for monitoring a switch voltage of a power converter and a second channel for concurrently monitoring an output voltage of the power converter. The system further comprises a set of one or more processors for generating, as a function of the switch voltage and the output voltage, and displaying an inductor current waveform approximating current through an inductor of the power converter. Additionally or alternatively, other waveforms such as output current waveforms and inductor voltage waveforms, may be generated during testing of the power converter. An arbitrary wave generator may inject different signals during testing of the power converter.

Abstract: Methodologies and systems are described herein whereby the electrical performance of a device may be tested. In one or more embodiments, a system for testing the electrical performance comprises a monitoring device configured to perform a set of operations including concurrently monitoring at least three different test points of a device under test (DUT) and aggregating test data comprising signal information collected concurrently from at least three different test points of the DUT. In one or more embodiments, the system is configured to monitor at least three channels wherein at least one channel corresponds to a frequency range of less than 300 kHz and the phases of signals on at least three channels are different.

Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Abstract: A connecting device for connecting to an electrical connection system of a solar module includes a connector housing to be arranged on an outer surface of the solar module and also at least one conductor component, which is arranged in the connector housing. At least one connection mechanism is provided with connecting device, and formed for connecting to a conductor, which is led out of the solar module, of the electrical connection system of the solar module. The connection mechanism has at least one resilient contact region, which is embodied for contacting the led-out conductor in a contacting position, the connection mechanism also includes at least one engagement portion, which is embodied for engaging a tool in order to move the resilient contact region out of its contacting position. This allows the connector housing to be attached to the connector housing in a largely automated manner and to be connected to a led-out conductor of the connection system.

Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Abstract: A connecting device for connecting to an electrical connection system of a solar module includes a connector housing to be arranged on an outer surface of the solar module and also at least one conductor component, which is arranged in the connector housing. At least one connection mechanism is provided with connecting device, and formed for connecting to a conductor, which is led out of the solar module, of the electrical connection system of the solar module. The connection mechanism has at least one resilient contact region, which is embodied for contacting the led-out conductor in a contacting position, the connection mechanism also includes at least one engagement portion, which is embodied for engaging a tool in order to move the resilient contact region out of its contacting position. This allows the connector housing to be attached to the connector housing in a largely automated manner and to be connected to a led-out conductor of the connection system.

Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Abstract: An adaptive subgridding method for power/ground plane simulations. The method includes superimposing a grid of cells onto a circuit plane. For each cell, the method may determine a fill ratio representing the amount of area in a given cell that overlaps with the circuit plane. For each cell having a fill ratio that is less than a predetermined upper limit or a predetermined lower limit the cell may be divided into a plurality of subcells. The method may then determine the fill ratio for each of the subcells. As with the original cells, each of the subcells having a fill ratio less than the predetermined upper limit and greater than the predetermined lower limit may be further subdivided into additional subcells. The loop may repeat itself until a predetermined integer value is reached, wherein the integer value indicates the number of times a cell may be subdivided.

Abstract: A bolster plate apparatus, used to secure a semiconductor device intermediate a printed circuit board and a heat sink apparatus, includes either an indentation or an open aperture into which a radio frequency absorptive material may be disposed. The absorptive material may be a ferrite material specifically selected to absorb frequencies in the range of the second to fourth harmonic of the processor clock signal frequency. The type of the ferrite material implanted in the bolster plate is selected to maximize the absorption of radio frequency energy, particularly that emitted at the pad vias on the underside of the printed circuit board, without affecting the signal integrity of the other pad connections. The shape of the cutout or aperture is also defined by the arrangement of RF emitting pads on the underside of the printed circuit board.

Abstract: A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors.