Abstract: A probe apparatus comprises a test head for electrically testing a chip of a semiconductor wafer, a probe card having a plurality of probe needles electrically connected to the test head, a table plate for supporting the semiconductor wafer such that the semiconductor wafer faces the probe card, a CCD camera for detecting heights at predetermined two pairs of points on the probe card and outputting signals corresponding to the heights, and three leg members for driving the table plate such that the semiconductor wafer supported by the table plate is parallel to the probe card, on the basis of distances between the two pairs of points in X- and Y-directions which are obtained from X- and Y-directional movement amounts of the table plate.

Abstract: A probe apparatus having a measuring section with a first system for electrically measuring an object. A loader section has a second system for carrying objects to the measuring section and a marking section has a third system for marking objects. These sections are independent of each other so that a vibration occurring in one section is not transmitted to the other sections.

Abstract: A semiconductor wafer receiving apparatus has a base, a table for supporting a wafer, a receiving member having at least three receiving pins which project from a supporting surface and are concealed under the supporting surface upon vertical movement of the table, and a driving unit for vertically moving the table. The wafer is transferred onto the receiving pins while the receiving pins project, and is held on the table while the receiving pins are concealed.

Abstract: A semiconductor wafer receiving apparatus has a base, a table for supporting a wafer, a receiving member having at least three receiving pins which project from a supporting surface and are concealed under the supporting surface upon vertical movement of the table, and a driving unit for vertically moving the table. The wafer is transferred onto the receiving pins while the receiving pins project, and is held on the table while the receiving pins are concealed.

Abstract: A transfer apparatus for carrying a semiconductor wafer into a wafer cassette comprising an arm to load a semiconductor wafer thereon, a moving mechanism to move the arm to a wafer cassette, a chucking device to have a wafer attracted to the arm, and an auxiliary mechanism to push a wafer and adjust the position of the wafer to the inlet of a wafer cassette when the wafer comes into contact with the side wall of the wafer cassette.