Abstract: The invention relates to an optoelectronic light-emitting device (1), including: at least one light-emitting diode (40) having an emitting surface (44) adapted to emit so-called excitation luminous radiation; and a photoluminescent material (31) that coats the emitting surface (44), the photoluminescent material containing photoluminescent particles adapted to convert said excitation luminous radiation through the emitting surface (44) at least in part into so-called photoluminescence luminous radiation. The optoelectronic device includes at least one photodiode (50) adjacent the light-emitting diode (40) having a receiving surface (54) coated by the photoluminescent material (31) and adapted to detect at least part of the excitation radiation and/or the photoluminescence radiation coming from the photoluminescent material (31) through the receiving surface.

Abstract: A method of manufacturing a gallium nitride light-emitting diode, including the successive steps of: a) forming a planar active gallium nitride light-emitting diode stack including first and second doped gallium nitride layers of opposite conductivity types and, between the first and second gallium nitride layers, an emissive layer with one or a plurality of quantum wells; and b) growing nanowires on the surface of the first gallium nitride layer opposite to the emissive layer.

Abstract: The invention relates to a method of manufacturing an optoelectronic device (1) produced on the basis of GaN, comprising an emission structure (10) configured to emit a first light radiation at the first wavelength (?1), the method comprising the following steps: i. producing a growth structure (20) comprising a nucleation layer (23) of Inx2Ga1-x2N at least partially relaxed; ii. producing a conversion structure (30), comprising an emission layer (33) configured to emit light at a second wavelength (?2), and an absorption layer (34) produced on the basis of InGaN; iii. transfer of the conversion structure (30) onto the emission structure (10) in such a way that the absorption layer (34) is located between the emission structure (10) and the emission layer (33) of the conversion structure.

Abstract: Disclosed is a light-emitting diode containing: first and second semiconductor layers respectively n-doped and p-doped, forming a p-n junction; an active zone placed between the first and second layers, including an InXGa1-XN emitting layer able to form a quantum well, and two InYGa1-YN, where 0<Y<X, barrier layers between which the emitting layer is placed; and an intermediate layer, which is placed either in the barrier layer located between the emitting layer and the first layer and portions of which are then on either side of the intermediate layer, or placed between the barrier layer and the emitting layer. The intermediate layer includes a III-N semiconductor of bandgap wider than that of the barrier layer. The second layer includes GaN or InWGa1-WN, where 0<W<Y, and the first layer includes InVGa1-VN, where V>W>0.

Abstract: A light emitting diode including: a structure for emitting light at a first wavelength ?1, comprising a p-n junction in which is arranged an active zone including a first emissive layer comprising InX1Ga1-X1N arranged between two first barriers; a conversion structure configured for converting the light emitted by the emission structure into a second wavelength different to the first, arranged on the emission structure and including a second InX2Ga1-X2N emissive layer, arranged between two second barriers each including several InX3Ga1-X3N absorption layers separated from each other by a GaN interlayer; in which the indium concentrations X1, X2 and X3 are such that 0<X1<X2 and Eg(InX2Ga1-X2N)<Eg(InX3Ga1-X3N)?h·c/?1.

Abstract: An optoelectronic device including a substrate with first and second opposite surfaces; and electrical insulation side elements extending from the first surface to the second surface and defining, within the substrate, first semi-conductive or conductive portions which are electrically insulated from each other. The optoelectronic device also includes, for each first portion a first conductive contact pad on the second surface in contact with the first portion and a set of light-emitting diodes resting on the first surface and electrically connected to the first portion. The optoelectronic device also includes a conductive, at least partially transparent electrode layer covering all the light-emitting diodes; an insulating, at least partially transparent encapsulation layer covering the electrode layer; and at least one second conductive contact pad electrically connected to the electrode layer.

Abstract: A light emitting diode including an n-doped InXnGa(1-Xn)N layer and a p-doped InXpGa(1-Xp)N layer, and an active area arranged between the InXnGa(1-Xn)N layer and the InXpGa(1-Xp)N layer including: a first InN layer with a thickness eInN106; a second InN layer with a thickness eInN108; a separating layer arranged between the InN layers and including InXbGa(1-Xb)N and a thickness <3 nm; an InX1Ga(1-X1)N layer arranged between the InXnGa(1-Xn)N layer and the first InN layer; an InX2Ga(1-X2)N layer arranged between the InXpGa(1-Xp)N layer and the second InN layer; wherein the indium compositions Xn, Xp, Xb, X1 and X2 are between 0 and about 0.25, and wherein the thicknesses eInN106 and eInN108 are such that eInN106<eInN108.

Abstract: An optoelectronic device including a light emitting component and a field-effect transistor, the optoelectronic device including a first semiconductor layer made of a III-V or II-VI compound doped a first conductivity type; an active layer of the light-emitting component; and a second semiconductor layer made of the III-V or III-VI compound doped a second conductivity type opposite the first type, the active layer being sandwiched between the first and second semiconductor layers, wherein the channel of the field-effect transistor is located in the first semiconductor layer, the first semiconductor layer being uninterrupted between the field-effect transistor and the lightemitting component.

Abstract: The invention relates to an optoelectronic device (45) including: light-emitting diodes (LED) including semiconductor elements (24); current-limiting components (50), wherein each component is connected in series to one of the semiconductor elements and has a resistance that increases with the strength of the current.

Abstract: A method of manufacturing elementary chips of a LED-based emissive display device, each chip including an inorganic semiconductor LED, a circuit for controlling the LED, and a plurality of areas of connection to an external device arranged on a connection surface of the chip.

Abstract: A light emitting diode including: a structure for emitting light at a first wavelength ?1, comprising a p-n junction in which is arranged an active zone including a first emissive layer comprising InX1Ga1-X1N arranged between two first barriers; a conversion structure configured for converting the light emitted by the emission structure into a second wavelength different to the first, arranged on the emission structure and including a second InX2Ga1-X2N emissive layer, arranged between two second barriers each including several InX3Ga1-X3N absorption layers separated from each other by a GaN interlayer; in which the indium concentrations X1, X2 and X3 are such that 0<X1<X2 and Eg(InX2Ga1-X2N)<Eg(InX3Ga1-X3N)?h·c/?1.

Abstract: A diode including: first and second doped semi-conductor portions forming a p-n junction, a first part of the first portion being arranged between a second part of the first portion and the second portion; dielectric portions covering side walls of the second portion and the first part of the first portion; a first electrode arranged against outer side walls of the dielectric portions and against side walls of the second part of the first portion, electrically connected to the first portion only by contact with said side walls, and passing through the entire thickness of the first portion; a second optically reflecting electrode electrically connected to the second portion such that the second portion is arranged between the second electrode and the first portion.

Abstract: A method of making a display device comprising at least implementation of the following steps: fabricate a matrix of LEDs each comprising electrodes accessible from a back face of the LED matrix and light emitting surfaces on a front face of the LED matrix; securing a stack of layers comprising at least one semiconducting layer, a gate dielectric layer and a layer of gate conducting material, onto the back face of the LED matrix; starting from the stack of layers, fabricate an electronic control circuit electrically coupled to the electrodes of the LEDs, including the fabrication of FET transistors of which active zones are formed in the semiconducting layer and of which the gates are formed in the gate dielectric layer and in the layer of gate conducting material.

Abstract: A method of manufacturing an emissive LED display device, including the steps of forming a plurality of chips, each including at least one LED and, on a connection surface, a plurality of hydrophilic electric connection areas and a hydrophobic area; forming a transfer substrate including, for each chip, a plurality of hydrophilic electric connection areas and a hydrophobic area; arranging a drop of a liquid on each electric connection area of the transfer substrate and/or of each chip; and affixing the chips to the transfer substrate by direct bonding, using the capillary restoring force of the drops to align the electric connection areas of the chips with the electric connection areas of the transfer substrate.

Abstract: A luminous panel includes a substrate having electric connections and an array of microchips secured to the substrate and connected to the electric connections in order to be driven. Each microchip includes control circuit based on transistors formed in a silicon volume, the circuit being connected to the substrate connections, and a micro-LED secured to the control circuit and connected thereto in order to be controlled.

Abstract: An optoelectronic device including three-dimensional semiconductor elements predominantly made of a first compound selected from among the group consisting of Compounds III-V, Compounds II-VI, and Compounds IV. Each semiconductor element defines, optionally with insulating portions partially covering said semiconductor element, at least one first surface including contiguous facets angled relative to each other. The optoelectronic device includes quantum dots at least some of the seams between the facets. The quantum dots are predominantly made of a mixture of the first compound and an additional element and are suitable for emitting or receiving a first electromagnetic radiation at a first wavelength.

Abstract: The invention relates to an optoelectronic device (50) including: a semiconductor substrate (14) doped with a first conductivity type; semiconductor contact pads (54) or a semiconductor layer, in contact with a surface of the substrate, doped with a second conductivity type opposite to the first type; conical or frusto-conical wired semiconductor elements (26), doped with the first conductivity type, each element being in contact with one of the contact pads or with the layer; light-emitting semiconductor portions (30), each portion at least partially covering one of the semiconductor elements; and a circuit (S) for polarizing the contact pads (54) or the layer. The contact pads or the layer are selected among: aluminum nitride, boron nitride, silicon carbide, magnesium nitride, gallium and magnesium nitride, or a combination of same and the nitride compounds thereof.

Abstract: A light-emitting device including a light-emitting diode including an n-doped InGaN layer and a p-doped GaN layer, and an active zone including a number m of InGaN-emitting layers each one arranged between two InGaN barrier layers, of which the indium compositions of the emitting layers are different and are greater on the side of the n-doped InGaN layer than on the side of the p-doped GaN layer, and of which the indium compositions of the barrier layers are different and which are greater on the side of the n-doped InGaN layer than on the side of the p-doped GaN layer. An electric power supply supplies the diode with a periodic signal. A controller of the power supply can alter the peak value of the periodic signal according to a spectrum of the light emitted.

Abstract: An optoelectronic device is provided, including light-emitting diodes arranged such that: N diodes of said plurality, where N ?2, are connected in series and are configured to be forward-biased, and at least one diode is connected in parallel to the N diodes and is configured to be reverse-biased and to form a Zener diode, wherein a sum of threshold voltages of the N diodes is less than a breakdown voltage of the Zener diode, and the light-emitting diodes include a stack of semiconductive portions including a first conductivity-type doped portion, a second conductivity-type doped portion opposite the first type, and a first intermediate portion doped according to the first type and being disposed between said first and second portions and having a doping level such that the breakdown voltage is greater than the sum of the threshold voltages of each of the N diodes.

Abstract: The invention relates to a method of manufacturing optoelectronic devices including light-emitting diodes, including the steps of: a) forming a first integrated circuit chip including light-emitting diodes; b) bonding a second integrated chip to a first surface of the first chip; c) decreasing the thickness of the first chip on the side opposite to the first surface to form a second surface opposite to the first surface; d) bonding, to the second surface, a cap including a silicon wafer provided with recesses opposite the light-emitting diodes; e) decreasing the thickness of the second chip; f) decreasing the thickness of the silicon wafer before step d) or after step e), each recess being filled with a photoluminescent material; and g) sawing the structure obtained at step f) into a plurality of separate optoelectronic devices.