Patents by Inventor Iwao Yagi
Iwao Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11888012Abstract: Provided is a solid-state image capturing element including a semiconductor substrate and first and second photoelectric conversion parts configured to convert light into electric charge. The first and the second photoelectric conversion parts each have a laminated structure including an upper electrode, a lower electrode, a photoelectric conversion film sandwiched between the upper electrode and the lower electrode, and an accumulation electrode facing the upper electrode through the photoelectric conversion film and an insulating film.Type: GrantFiled: July 25, 2019Date of Patent: January 30, 2024Assignees: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Kenichi Murata, Masahiro Joei, Fumihiko Koga, Iwao Yagi, Shintarou Hirata, Hideaki Togashi, Yosuke Saito, Shingo Takahashi
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Publication number: 20230329017Abstract: A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and- an upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.Type: ApplicationFiled: May 3, 2023Publication date: October 12, 2023Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yohei HIROSE, Iwao YAGI, Shintarou HIRATA, Hideaki MOGI, Masashi BANDO, Osamu ENOKI
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Publication number: 20230309331Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.Type: ApplicationFiled: May 23, 2023Publication date: September 28, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yuta HASEGAWA, Nobuyuki MATSUZAWA, Yoshiaki OBANA, Ichiro TAKEMURA, Norikazu NAKAYAMA, Masami SHIMOKAWA, Tetsuji YAMAGUCHI, Iwao YAGI, Hideaki MOGI
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Publication number: 20230262998Abstract: There is provided an imaging device and an electronic apparatus including an imaging device, where the imaging device includes: a first electrode; a second electrode; a photoelectric conversion layer disposed between the first electrode and the second electrode and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material, where the second organic semiconductor material comprises a subphthalocyanine material, and where the second organic semiconductor material has a highest occupied molecular orbital level ranging from ?6 eV to ?6.7 eV.Type: ApplicationFiled: February 7, 2023Publication date: August 17, 2023Applicant: Sony Group CorporationInventors: Yuta HASEGAWA, Masashi BANDO, Shintarou HIRATA, Hideaki MOGI, Iwao YAGI, Yasuharu UJIIE, Yuki NEGISHI
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Patent number: 11730004Abstract: A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and an upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.Type: GrantFiled: September 17, 2021Date of Patent: August 15, 2023Assignees: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yohei Hirose, Iwao Yagi, Shintarou Hirata, Hideaki Mogi, Masashi Bando, Osamu Enoki
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Patent number: 11700733Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.Type: GrantFiled: June 3, 2021Date of Patent: July 11, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yuta Hasegawa, Nobuyuki Matsuzawa, Yoshiaki Obana, Ichiro Takemura, Norikazu Nakayama, Masami Shimokawa, Tetsuji Yamaguchi, Iwao Yagi, Hideaki Mogi
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Publication number: 20230215880Abstract: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode; a third electrode; a photoelectric conversion layer; and a semiconductor layer. The first electrode and the second electrode are disposed in parallel. The third electrode is disposed to be opposed to the first electrode and the second electrode. The photoelectric conversion layer is provided between the first electrode and second electrode and the third electrode. The semiconductor layer is provided between the first electrode and second electrode and the photoelectric conversion layer. The semiconductor layer has a first layer and a second layer stacked therein in order from the photoelectric conversion layer side. The second layer has an energy level at a lowest edge of a conduction band that is shallower than an energy level of the first layer at a lowest edge of a conduction band.Type: ApplicationFiled: March 24, 2021Publication date: July 6, 2023Inventors: Masahiro JOEI, Shintarou HIRATA, Tomiyuki YUKAWA, Ryosuke SUZUKI, Hiroshi NAKANO, Toshihiko HAYASHI, Ryotaro TAKAGUCHI, Iwao YAGI, Kenichi MURATA
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Publication number: 20220415969Abstract: A solid-state imaging device according to an embodiment of the present disclosure includes: a plurality of photoelectric converters that is stacked on a semiconductor substrate, and has wavelength selectivities different from each other; and a wiring line that is formed on the semiconductor substrate, and is electrically coupled to the plurality of photoelectric converters. Each of the photoelectric converters includes a photoelectric conversion film, and a first electrode and a second electrode that are disposed with the photoelectric conversion film interposed therebetween. The wiring line extends in a direction normal to the semiconductor substrate, and includes a vertical wiring line formed in contact with the second electrode of each of the photoelectric converters.Type: ApplicationFiled: November 12, 2020Publication date: December 29, 2022Inventors: Masahiro JOEI, Kenichi MURATA, Fumihiko KOGA, Iwao YAGI, Shintarou HIRATA, Hideaki TOGASHI, Yosuke SAITO, Nobutoshi FUJII
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Publication number: 20220407019Abstract: A photoelectric conversion element 10A according to an embodiment of the present disclosure includes: a first electrode 21; a second electrode 23 that is disposed to be opposed to the first electrode 21; and a photoelectric conversion layer 22 that is provided between the first electrode 21 and the second electrode 23. The photoelectric conversion layer 22 includes a hole transporting material as a first organic semiconductor material. The hole transporting material absorbs blue light.Type: ApplicationFiled: October 20, 2020Publication date: December 22, 2022Inventors: Yoshiyuki HIRANO, Yuta HASEGAWA, Osamu ENOKI, Iwao YAGI, Yosuke SAITO, Masami SENOH
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Publication number: 20220367573Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).Type: ApplicationFiled: June 16, 2022Publication date: November 17, 2022Applicant: SONY GROUP CORPORATIONInventors: Masaki MURATA, Hideaki MOGI, Shintarou HIRATA, Iwao YAGI, Yasuharu UJIIE, Masashi BANDO, Raku SHIRASAWA, Hajime KOBAYASHI, Mitsunori NAKAMOTO, Yuichi TOKITA
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Patent number: 11411051Abstract: An image pickup element is constituted by laminating at least a first electrode, an organic photoelectric conversion layer, and a second electrode in order, and the organic photoelectric conversion layer includes a first organic semiconductor material having the following structural formula (1).Type: GrantFiled: December 12, 2019Date of Patent: August 9, 2022Assignee: SONY CORPORATIONInventors: Masaki Murata, Hideaki Mogi, Shintarou Hirata, Iwao Yagi, Yasuharu Ujiie, Masashi Bando, Raku Shirasawa, Hajime Kobayashi, Mitsunori Nakamoto, Yuichi Tokita
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Publication number: 20220013584Abstract: A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and an upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.Type: ApplicationFiled: September 17, 2021Publication date: January 13, 2022Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yohei Hirose, Iwao Yagi, Shintarou Hirata, Hideaki Mogi, Masashi Bando, Osamu Enoki
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Publication number: 20220005872Abstract: A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and—an upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.Type: ApplicationFiled: September 17, 2021Publication date: January 6, 2022Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yohei HIROSE, Iwao YAGI, Shintarou HIRATA, Hideaki MOGI, Masashi BANDO, Osamu ENOKI
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Patent number: 11158675Abstract: A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and an—upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.Type: GrantFiled: July 20, 2017Date of Patent: October 26, 2021Assignees: Sony Corporation, Sony Semiconductor Solutions CorporationInventors: Yohei Hirose, Iwao Yagi, Shintarou Hirata, Hideaki Mogi, Masashi Bando, Osamu Enoki
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Publication number: 20210320149Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.Type: ApplicationFiled: June 3, 2021Publication date: October 14, 2021Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yuta HASEGAWA, Nobuyuki MATSUZAWA, Yoshiaki OBANA, Ichiro TAKEMURA, Norikazu NAKAYAMA, Masami SHIMOKAWA, Tetsuji YAMAGUCHI, Iwao YAGI, Hideaki MOGI
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Publication number: 20210313381Abstract: Provided is a solid-state image capturing element including a semiconductor substrate and first and second photoelectric conversion parts configured to convert light into electric charge. The first and the second photoelectric conversion parts each have a laminated structure including an upper electrode, a lower electrode, a photoelectric conversion film sandwiched between the upper electrode and the lower electrode, and an accumulation electrode facing the upper electrode through the photoelectric conversion film and an insulating film.Type: ApplicationFiled: July 25, 2019Publication date: October 7, 2021Applicants: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Kenichi MURATA, Masahiro JOEI, Fumihiko KOGA, Iwao YAGI, Shintarou HIRATA, Hideaki TOGASHI, Yosuke SAITO, Shingo TAKAHASHI
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Publication number: 20210249474Abstract: There is provided a solid-state image sensor, a solid-state imaging device, an electronic apparatus, and a method of manufacturing a solid-state image sensor capable of improving characteristics. There is provided a solid-state image sensor including a stacked structure that includes a semiconductor substrate, a first photoelectric converter provided above the semiconductor substrate and converting light into charges, and a second photoelectric converter provided above the first photoelectric converter and converting light into charges, where the first photoelectric converter and the second photoelectric converter include a photoelectric conversion stacked structure in which a common electrode, a photoelectric conversion film, and a readout electrode are stacked so that the first photoelectric converter and the second photoelectric converter are in a line-symmetrical relationship with each other with a vertical plane perpendicular to a stacking direction of the stacked structure as an axis of symmetry.Type: ApplicationFiled: June 11, 2019Publication date: August 12, 2021Applicants: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Hideaki TOGASHI, Iwao YAGI, Masahiro JOEI, Fumihiko KOGA, Kenichi MURATA, Shintarou HIRATA, Yosuke SAITO, Akira FURUKAWA
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Publication number: 20210233948Abstract: A solid-state imaging element with pixel transistors and wires capable of efficiently outputting and transferring a pixel signal from a stacked photoelectric conversion film while suppressing an increase in manufacturing cost, and a manufacturing method thereof are provided.Type: ApplicationFiled: April 19, 2019Publication date: July 29, 2021Applicant: SONY CORPORATIONInventors: Masahiro JOEI, Kenichi MURATA, Fumihiko KOGA, Iwao YAGI, Shintarou HIRATA, Hideaki TOGASHI, Yosuke SAITO
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Patent number: 11056539Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode and a second electrode facing each other; and a photoelectric conversion layer provided between the first electrode and the second electrode, and including a first organic semiconductor material, a second organic semiconductor material, and a third organic semiconductor material that have mother skeletons different from one another. The first organic semiconductor material is one of fullerenes and fullerene derivatives. The second organic semiconductor material in a form of a single-layer film has a higher linear absorption coefficient of a maximal light absorption wavelength in a visible light region than a single-layer film of the first organic semiconductor material and a single-layer film of the third organic semiconductor material. The third organic semiconductor material has a value equal to or higher than a HOMO level of the second organic semiconductor material.Type: GrantFiled: July 3, 2019Date of Patent: July 6, 2021Assignee: Sony Semiconductor Solutions CorporationInventors: Yuta Hasegawa, Nobuyuki Matsuzawa, Yoshiaki Obana, Ichiro Takemura, Norikazu Nakayama, Masami Shimokawa, Tetsuji Yamaguchi, Iwao Yagi, Hideaki Mogi
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Publication number: 20210083009Abstract: A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode; a second electrode disposed to be opposed to the first electrode; and a photoelectric conversion layer provided between the first electrode and the second electrode and including an organic semiconductor material represented by the following general formula (1), in which the organic semiconductor material includes, in at least one of R2 or R6, a substituent represented by the following general formula (2).Type: ApplicationFiled: January 18, 2019Publication date: March 18, 2021Inventors: OSAMU ENOKI, YUTA HASEGAWA, YUKI NEGISHI, IWAO YAGI, YASUHARU UJIIE, YOSUKE SAITO