Patents by Inventor Jörg Franke

Jörg Franke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10552423
    Abstract: Technologies are described for facilitating query execution. A data network is received. The data network includes a plurality of nodes. Each of the nodes is associated with a portion of stored data. User input is received defining at least one semantic tag. User input is received associating the at least one semantic tag with at least one of the plurality of nodes. The association between the at least one sematic tag and the at least one of the plurality of nodes is stored.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: February 4, 2020
    Assignee: SAP SE
    Inventor: Jörg Franke
  • Patent number: 10473733
    Abstract: Magnetic field compensation device having a first bar-shaped flux concentrator and a second bar-shaped flux concentrator, wherein the first flux concentrator and the second flux concentrator are separated from one another in a y-direction, and the longitudinal axis of the first flux concentrator and the longitudinal axis of the second flux concentrator are arranged to be substantially parallel to one another. A control unit is in an operative electrical connection with the magnetic field sensor and the compensating coil, and the control unit is equipped to control the compensating current through the compensating coil using a measured signal from the magnetic field sensor in such a manner that, for an external magnetic field formed in the x-direction at the location of the magnetic field sensor, the magnetic field is substantially compensated.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: November 12, 2019
    Assignee: TDK-Micronas GmbH
    Inventor: Joerg Franke
  • Patent number: 10436817
    Abstract: A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: October 8, 2019
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Klaus Heberle, Joerg Franke, Oliver Breitwieser
  • Patent number: 10429209
    Abstract: A position determining unit is provided that has a number of sensor units arranged at positions along a path, and a transducer. Each sensor unit has a carrier, a first and second supply voltage connection, a switching output, a measuring unit and a bias magnet comprising two poles. The measuring unit is arranged on the carrier and has at least one magnetic field sensor, wherein the switching output is switched into an On or Off-state as a function of a threshold value exceeding or falling short of a sensor signal. The first supply voltage connection of each sensor unit is connected to a supply voltage, wherein a first sensor unit is arranged at a beginning of the path and a last sensor unit is arranged at the end of the path. The second supply voltage connection of the first sensor unit is connected to a reference potential.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: October 1, 2019
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Klaus Heberle
  • Publication number: 20190130012
    Abstract: In one general aspect, a method and system are described for providing a flexible data hierarchy. The method may include obtaining a plurality of data sets, the plurality of data sets including system-defined attributes and user-defined attributes, generating, for each attribute in each data set, a field for receiving input, providing, in a user interface display, at least one data set of the plurality of data sets and the generated field for each attribute in the at least one data set, receiving, in two or more of the generated fields, a value indicating a sequence placement for a respective attribute associated with a respective field of the two or more generated fields, and automatically generating, for the attributes associated with the two or more fields having a value, at least one hierarchical structure according to the sequence placement.
    Type: Application
    Filed: October 26, 2017
    Publication date: May 2, 2019
    Inventors: Jörg Franke, Manfred Crumbach, Hao Zhou, Hao Liu, Weicheng Mao, Nan Luo, Jie Cen
  • Publication number: 20190063953
    Abstract: A distance measuring device with two magnetic field sensors and a permanent magnet and a semiconductor body is provided. The device includes a monolithically integrated evaluation circuit, and a difference signal can be determined by means of the magnetic field sensors and provides an output signal as a result of the determination. The value of the output signal based on the neutralization of a magnetic-flux-free region is a function of a distance of a ferromagnetic sensing element from the two magnetic field sensors. The semiconductor body is arranged between U-shaped pole shanks of the magnet, which is magnetized in the X direction, wherein the first magnetic field sensor is arranged in an area located between two opposing shanks of the first pole, and the second magnetic field sensor is arranged in an area located between two opposing shanks of the second pole.
    Type: Application
    Filed: October 29, 2018
    Publication date: February 28, 2019
    Applicant: TDK-Micronas GmbH
    Inventor: Joerg FRANKE
  • Publication number: 20190013267
    Abstract: A packaged IC component having a semiconductor body and a printed circuit board. The semiconductor body includes a monolithically integrated circuit and at least two metal contact areas. The printed circuit board has a first and second region and a top and a bottom. At least two formed terminal contacts and two conductive traces are connected to the terminal contacts, and the terminal contacts are designed as contact holes passing through the printed circuit board, and are arranged in the first region of the printed circuit board. The two metal contact areas are connected to the conductive traces by bond wires, and the semiconductor body is implemented as a die. The die is arranged in the second region on the top of the printed circuit board, and the semiconductor body and the bond wires are completely covered with a potting compound on the top of the printed circuit board.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 10, 2019
    Applicant: TDK-Micronas GmbH
    Inventors: Joerg Franke, Thomas Leneke
  • Publication number: 20190001847
    Abstract: A seat adjuster having a fixed part (12), a drive element (26), an output element (22, 24), a clamping body coupling arrangement (16) by means of which a back and forth movement of the drive element (22, 24) out of a neutral position and back into the neutral position is converted into a continued movement of the output element (22, 24) in a uniform direction of rotation, and a releasable locking device for locking the output element (22) in a form-fitting manner on the fixed part (12), characterized in that the locking device is formed by a locking ring (74) which is axially displaceable between a locking position, in which it is non-rotatably coupled to the output element (22), and a release position, and cam surfaces (82, 84) are formed on the locking ring (74) and the drive element (26), which cam surfaces are complementary to one another and translate a rotation of the drive element (26) away from the neutral position into an axial movement of the locking ring (74) into the released position.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 3, 2019
    Inventors: Michael Kuhlmann, Jörg Franke
  • Patent number: 10165686
    Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: December 25, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Klaus Heberle, Oliver Breitwieser, Timo Kaufmann
  • Publication number: 20180329963
    Abstract: Disclosed herein are system, method, and computer program product embodiments for an embedded analytics and transactional data processing system. An embodiment operates by receiving selection of a filter that indicates a subset of transactional data from a database to be displayed via an interface. Analytical data associated with the subset of transactional data is determined. Via the interface, the filter selection, the analytical data, and the subset of transactional data are all provided.
    Type: Application
    Filed: May 9, 2017
    Publication date: November 15, 2018
    Inventors: Emil Voutta, Kai Richter, Anja Wipfler, Jörg Franke, Manfred Crumbach, Thomas Fleckenstein, Stefan Kraus, Sandeep R S, Andreas Balzar
  • Publication number: 20180321330
    Abstract: Magnetic field compensation device having a first bar-shaped flux concentrator and a second bar-shaped flux concentrator, wherein the first flux concentrator and the second flux concentrator are separated from one another in a y-direction, and the longitudinal axis of the first flux concentrator and the longitudinal axis of the second flux concentrator are arranged to be substantially parallel to one another. A control unit is in an operative electrical connection with the magnetic field sensor and the compensating coil, and the control unit is equipped to control the compensating current through the compensating coil using a measured signal from the magnetic field sensor in such a manner that, for an external magnetic field formed in the x-direction at the location of the magnetic field sensor, the magnetic field is substantially compensated.
    Type: Application
    Filed: July 11, 2017
    Publication date: November 8, 2018
    Applicant: TDK-Micronas GmbH
    Inventor: Joerg FRANKE
  • Publication number: 20180259566
    Abstract: A measurement method is for determining core losses, which serve to produce magnetic circuits for electrical machines. In order to allow an accurate measurement that is as quick as possible, it is proposed that a magnetic coupling is produced between a measuring coil connected in a capacitor and a core to be measured, and the measuring coil is then acted upon by an alternating frequency in order to measure the resonant frequency of the resulting resonant circuit and/or the quality of the resulting resonant circuit as a measure of the core loss.
    Type: Application
    Filed: September 9, 2016
    Publication date: September 13, 2018
    Applicant: Friedrich-Alexander-Universität Erlangen-Nürnberg
    Inventors: Michael SCHNEIDER, Jörg FRANKE
  • Patent number: 10026684
    Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: July 17, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Klaus Heberle, Joerg Franke, Thomas Leneke
  • Patent number: 10018684
    Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body with a surface, formed in an x-y plane, and a back surface. Each circle half of a disk-shaped magnet has two magnetic poles and the magnet is rotatable relative to the IC housing around a z-direction. An imaginary lengthening of the axis penetrates the magnet in the center of gravity of the main extension surface of the magnet. A first pixel cell and a second pixel cell are integrated into the surface of the semiconductor body together with a circuit arrangement, and each pixel cell has a first magnetic field sensor and a second magnetic field sensor. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the first pixel cell in a projection along an imaginary lengthening of the axis is arranged within the two inner circle segments.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: July 10, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 10006969
    Abstract: A sensor device is provided for suppressing a magnetic stray field, having a semiconductor body with a surface formed in an x-y plane, the x-direction and the y-direction are formed orthogonal to one another, and the sensor device has a first pixel cell and a second pixel cell integrated into the surface of the semiconductor body. A first magnetic field sensor detects a magnetic field in the x-direction and a second magnetic field sensor detects a magnetic field in the y-direction. The two pixel cells in a projection along an imaginary lengthening of the axis are arranged at an edge or next to an extension of the magnet in the x-y plane.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: June 26, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Publication number: 20180172780
    Abstract: A calibration method for a Hall sensor having a Hall sensitive layer with four electrical contacts and a first field plate, wherein, at a first temperature and at a first magnetic flux density, a resistance value of the Hall sensitive layer is determined for each of at least three different field plate voltages present at the field plate, a calibration curve is produced from the at least three resistance values, a deviation value of the calibration curve is determined from a reference calibration curve, and the field plate voltage that is present at the first field plate or an operating voltage that is present at the sensitive layer is readjusted by a correction value corresponding to the deviation value.
    Type: Application
    Filed: December 15, 2017
    Publication date: June 21, 2018
    Applicant: TDK-Micronas GmbH
    Inventors: Timo KAUFMANN, Joerg FRANKE
  • Publication number: 20180130729
    Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Applicant: TDK-Micronas GmbH
    Inventors: Klaus HEBERLE, Joerg FRANKE, Thomas LENEKE
  • Patent number: 9933495
    Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body, a first pixel cell and a second pixel cell integrated into a surface of the semiconductor body together with a circuit arrangement. Each pixel cell has a first magnetic field sensor and a second magnetic field sensor to detect a magnetic field in the x-direction and a magnetic field in the y-direction. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the substrate and the semiconductor body are disposed in the same IC package. A magnet is provided that has a planar main extension surface in the direction of an x-y plane and has a magnetization with four magnetic poles in the direction of the x-y plane. The IC package is spaced apart from the main extension surface of the magnet in the z-direction and at least partially within a ring magnet.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 3, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke, Andreas Ring
  • Patent number: 9893005
    Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: February 13, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Klaus Heberle, Joerg Franke, Thomas Leneke
  • Publication number: 20180031391
    Abstract: A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.
    Type: Application
    Filed: July 31, 2017
    Publication date: February 1, 2018
    Applicant: TDK - Micronas GmbH
    Inventors: Joerg FRANKE, Timo KAUFMANN