Abstract: In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

Abstract: Disclosed is a method and system for inserting redundant paths into an integrated circuit. Particularly, the invention provides a method for identifying a single via in a first path connecting two elements, determining if an alternate route is available for connecting the two elements (other than a redundant via), and for inserting a second path into the available alternate route. The combination of the first and second paths provides greater redundancy than inserting a redundant via alone. More importantly, such redundant paths provide for redundancy when congestion prevents a redundant via from being inserted adjacent to the single via. An embodiment of the method further comprises removing the single via and any redundant wire segments, if all of the additional vias used to form the second path can be made redundant.

Abstract: In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

Abstract: A method of estimating integrated circuit yield comprises providing an integrated circuit layout and a set of systematic defects based on a manufacturing process. Next, the method represents a systematic defect by modifying structures in the integrated circuit layout to create modified structures. More specifically, for short-circuit-causing defects, the method pre-expands the structures when the structures comprise a higher systematic defect sensitivity level, and pre-shrinks the structures when the structures comprise a lower systematic defect sensitivity level. Following this, a critical area analysis is performed on the integrated circuit layout using the modified structures, wherein dot-throwing, geometric expansion, or Voronoi diagrams are used. The method then computes a fault density value, random defects and systematic defects are computed.

Abstract: Embodiments herein provide a method and computer program product for optimizing router settings to increase IC yield. A method begins by reviewing yield data in an IC manufacturing line to identify structure-specific mechanisms that impact IC yield. Next, the method establishes a structural identifier for each structure-specific mechanism, wherein the structural identifiers include wire codes, tags, and/or unique identifiers. Different structural identifiers are established for wires having different widths. Furthermore, the method establishes a weighting factor for each structure-specific mechanism, wherein higher weighting factors are established for structure-specific mechanisms comprising thick wires proximate to multiple thick wires. The method establishes the structural identifiers and the weighting factors for incidence of spacing between single wide lines, double wide lines, and triple wide lines and for incidence of wires above large metal lands.

Abstract: A method, apparatus, and computer program product that performs yield estimates using critical area analysis on integrated circuits having redundant and non-redundant elements. The non-redundant elements are ignored or removed from the critical area analysis performed for undesired opens.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: The present invention relates to a method, a tool, and a computer program product for creating a layout of an electronic circuit from a netlist of interconnected components, wherein the components can be represented by planar geometric shapes in the layout. The advantages of the present invention are achieved by tightly coupling placement and routing. An initial placement of shapes of extended size is succeeded by a routing step that tries to create wires between shapes of reduced size. If that fails, it is tried to wire shapes of extended size instead. The wiring can be combined with a delta-placement of shapes within shapes of extended size such that wires connected to shapes of extended size also connect to the shapes.

Abstract: Method and apparatus for providing a non-blocking routing network for establishing arbitrary connections between n primary nodes (m—0, . . . , m_n?1) and N?n secondary nodes (r—0, . . . , r_N?1). The routing network requires less physical connections than a corresponding Clos routing network while having small transmission delays. One embodiment of the invention provides a routing network that is well suited for direct on-chip implementation due to the matrix structure of the routing network.

Abstract: The invention proposes a switching arrangement for transporting data packets which comprise a data packet destination information and a payload, to one or more output ports. The switching device is able to route the arriving data packets according to the data packet destination information, to at least one dedicated of the output ports. It comprises at each input port an input buffer with at least as many single input queues as there are output ports, and an input controller for each input port, serving for controlling the order of multiplexing the data packets from the input queues of the corresponding input buffer to the switching device. The total of input ports is divided up into several subsets of input ports. Each subset in the switching device has its separate output buffer for storing at addresses therein at least the payload of each data packet arriving at the input port. At least one set of as many output queues as the switching arrangement has output ports are arranged.

Abstract: Disclosed is a method and system for inserting redundant paths into an integrated circuit. Particularly, the invention provides a method for identifying a single via in a first path connecting two elements, determining if an alternate route is available for connecting the two elements (other than a redundant via), and for inserting a second path into the available alternate route. The combination of the first and second paths provides greater redundancy than inserting a redundant via alone. More importantly, such redundant paths provide for redundancy when congestion prevents a redundant via from being inserted adjacent to the single via. An embodiment of the method further comprises removing the single via and any redundant wire segments, if all of the additional vias used to form the second path can be made redundant.

Abstract: A signal distribution tree structure for distributing signals within a plurality of signal tree branches to a plurality of signal sinks, wherein the signal in subsequent sub trees (11) is driven by a preceding amplifier (2), which is characterized in that the amplifiers are logic gates (3), which combines the signals of a preferred input (31) connected to a preceding logic gate in the signal path with a signal of a secondary input (32) connected to an adjacent tree (12) path of a neighboring and/or preceding sub tree.

Abstract: The present invention relates to a method for routing data paths in a semiconductor chip with a plurality of layers. The inventive method comprises the steps of wiring a launching clock path and a receiving clock path on one or more layers according to at least one predetermined condition, performing one or more timing tests for determining any critical paths, and determining a weight function for every layer of each critical path. Said weight function is defined as the difference between a property of the launching clock tree and the same property of the receiving clock tree on said layer. If said weight function is positive for any layer, the wiring of the data path is not allowed on said layer. Preferably the remaining layers are chosen in such a way that a local variation of the delay on said layer is minimal.

Abstract: A method of routing an interconnect metal layer of an integrated circuit, wherein single-width nets are replicated and routed in parallel to reduce the total resistance on the net; wide wires are decomposed into a several single-width wires routed in parallel to improve uniformity of metal interconnect routing and therefore manufacturability of metal interconnect layers. The decomposition step is performed during a preliminary wire route after initial physical placement. Access to pin shapes is ensured through a branching and a recombination of the parallel single-width wires. Separate wire segments are rejoined at the source and sink of the net. The parallel wire segments do not change the logic behavior of the circuit.

Abstract: A method and system for placing logic nodes based on an estimated wiring congestion are provided. Specifically, under the present invention, relative probabilities for potential implementations of wiring interconnects between logic nodes are determined. Then, for each edge between adjacent bins, a total of corresponding relative probabilities is compared to a wiring availability. Based on the comparison, the logic nodes can be placed within wiring constraints.

Abstract: In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

Abstract: A method and system for placing logic nodes based on an estimated wiring congestion are provided. Specifically, under the present invention, relative probabilities for potential implementations of wiring interconnects between logic nodes are determined. Then, for each edge between adjacent bins, a total of corresponding relative probabilities is compared to a wiring availability. Based on the comparison, the logic nodes can be placed within wiring constraints.

Abstract: Method and apparatus for providing a non-blocking routing network for establishing arbitrary connections between n primary nodes (m_0, . . . , m_n−1) and N≧n secondary nodes (r_0, . . . , r_N−1). The routing network requires less physical connections than a corresponding Clos routing network while having small transmission delays. One embodiment of the invention provides a routing network that is well suited for direct on-chip implementation due to the matrix structure of the routing network.

Abstract: The invention proposes a switching arrangement for transporting data packets which comprise a data packet destination information and a payload, to one or more output ports. The switching device is able to route the arriving data packets according to the data packet destination information, to at least one dedicated of the output ports. It comprises at each input port an input buffer with at least as many single input queues as there are output ports, and an input controller for each input port, serving for controlling the order of multiplexing the data packets from the input queues of the corresponding input buffer to the switching device. The total of input ports is divided up into several subsets of input ports. Each subset in the switching device has its separate output buffer for storing at addresses therein at least the payload of each data packet arriving at the input port. At least one set of as many output queues as the switching arrangement has output ports are arranged.

Abstract: The present invention pertains to a design method for VLSI-chips. The chips are partitioned into segments in order to enable DRC and LVS. Thus, the memory requirements are kept below the limits of the platform used for the verification and the turnaround time is drastically reduced.