Patents by Inventor Jae Hoon Choi

Jae Hoon Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9871549
    Abstract: An electronic device, a protection device, and a method for protecting the electronic device with the protection device is provided. The electronic device includes a sensor module configured to detect a motion state of the electronic device when a cover is connected to the electronic device, and a processor configured to control an actuator of the cover based on the detected motion state of the electronic device.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: January 16, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Kwang-Min Kil, Jae-Hoon Choi, Li-Yeon Kang, Jin-Keun Park, Sang-Soo Lee, Min-Jong Lim, Dong-Sub Kim, Sang-Kyu Lee, Jong-Chul Choi, Chang-Ryong Heo
  • Publication number: 20180013297
    Abstract: A battery management system for a vehicle is provided. The system is capable of preventing vehicle malfunction by preventing overcharge and over-discharge of a low-voltage battery by providing a controller that is configured to receive power transmitted from a first connection line and power transmitted from a second connection line. The battery management system includes a relay configured to electrically connect and disconnect power that is supplied from a battery to loads. The system also includes a controller configured to receive a first regular power transmitted through a connection line between the battery and the relay and a second regular power transmitted through a connection line between the relay and the loads. The controller is further configured to turn the relay on and off.
    Type: Application
    Filed: December 12, 2016
    Publication date: January 11, 2018
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Jong Hu Yoon, Mi Ok Kim, Kyung In Min, Do Sung Hwang, Jae Hoon Choi, Kyung Ho Kim, Beom Gyu Kim, Hee Tae Yang, Yu Seok Kim, Hyo Sik Moon, Suk Hyung Kim, Beom Joo Kwon
  • Publication number: 20180006381
    Abstract: An electromagnetic wave absorber that improves an electromagnetic wave absorption rate in a specific frequency is provided. The electromagnetic wave absorber includes a dielectric layer; a first metal conductive layer disposed on a first surface of the dielectric layer and having a slot positioned symmetrical about a center of the dielectric layer and a second metal conductive layer disposed on a second surface of the dielectric layer.
    Type: Application
    Filed: October 26, 2016
    Publication date: January 4, 2018
    Inventors: Wang Gi Hong, Jae Hoon Choi, Eun Jeong, Jin Pil Tak
  • Patent number: 9837343
    Abstract: A chip embedded substrate includes: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: December 5, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joon Sung Kim, Yong Ho Baek, Jung Hyun Cho, Eung Suek Lee, Jae Hoon Choi, Young Gwan Ko
  • Patent number: 9831544
    Abstract: Disclosed is a human body wearable dual band antenna. The disclosed human body wearable antenna comprises: a substrate; a zeroth-order resonance antenna formed on the bottom of the substrate, for receiving a signal from a wireless device which is implanted in a human body; and a micro strip antenna formed on the top of the substrate, for transmitting the signal to a wireless device which is external to the human body. The dual band human body wearable antenna according to the present invention can relay communications between the wireless device which is implanted in the human body and the wireless device which is external to the human body.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: November 28, 2017
    Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
    Inventors: Jae-Hoon Choi, Kyeol Kwon, Jae-geun Ha, Soon-Yong Lee
  • Patent number: 9831142
    Abstract: A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: November 28, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Ho Baek, Jung Hyun Cho, Jae Hoon Choi
  • Publication number: 20170338678
    Abstract: A vehicle electric power system for jumpstarting includes: an auxiliary battery; a first relay having a first end connected to the auxiliary battery; a power connecting terminal for jumpstarting being connected to an external power source when jumpstarting is initiated; a second relay having a first end connected to the power connecting terminal and a second end electrically connected to a second end of the first relay; and a reconnection switch having a first end connected both to the auxiliary battery and to the power connecting terminal and a second end connected to a control terminal used to turn on the first relay. The reconnection switch electrically connects the first and second ends thereof to each other in response to a reconnecting input signal, thereby applying external power to the control terminal, and turning on the first relay.
    Type: Application
    Filed: October 11, 2016
    Publication date: November 23, 2017
    Applicant: Hyundai Motor Company
    Inventors: Hee Tae YANG, Kyung In MIN, Jae Hoon CHOI, Kyung Ho KIM, Yu Seok KIM, Hyo Sik MOON, Suk Hyung KIM
  • Patent number: 9824816
    Abstract: A wireless power receiving device and a wireless power transmission apparatus are provided. The wireless power receiver may include a resonator configured to emit an electromagnetic field, a blocker configured to surround a portion of an exterior of the resonator, and a spacer disposed between the resonator and the blocker.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: November 21, 2017
    Assignees: Samsung Electronics Co., Ltd., Industry-University Cooperation Foundation Hanyang University
    Inventors: Keum Su Song, Sang Wook Kwon, Ki Young Kim, Dong Zo Kim, Bong Chul Kim, Yun Kwon Park, Jae Hyun Park, Chi Hyung Ahn, Young Ho Ryu, Byoung Hee Lee, Jun Seok Lee, Jae Hoon Choi, Kyung Young Jung, Sang Gyu Ha
  • Patent number: 9819381
    Abstract: An electronic device may include: at least one protective member disposed in at least one area of the electronic device; at least one sensor configured to detect the drop of the electronic device; a protective member driving module configured to activate the protective member to change the shape of the protective member according to whether the drop of the electronic device is detected; and at least one processor configured to receive a drop sensing signal detected by the sensor and to control the protective member driving module to change the shape of the protective member.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: November 14, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Chul Choi, Li-Yeon Kang, Kwangmin Gil, Jinkeun Park, Min-Woo Yoo, Sangsoo Lee, Min-Jong Lim, Jae-Hoon Choi, Chang-Ryong Heo, Dongsub Kim, Sangkyu Lee
  • Patent number: 9786624
    Abstract: A semiconductor package includes a substrate having a groove in an upper surface. A semiconductor device is mounted on the substrate to cover one portion of the groove and leaving another portion exposed.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: October 10, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-chan Lee, Chang-yong Park, Hun Han, Jae-hoon Choi
  • Patent number: 9761519
    Abstract: A package substrate includes: a body layer; and a pattern layer formed on a surface of the body layer. The pattern layer includes: a wire pattern; a solder pad connected to the wire pattern; and a through hole adjacent to a boundary between the wire pattern and the solder pad and vertically penetrating the pattern layer. A semiconductor package and an electronic device are disclosed.
    Type: Grant
    Filed: May 14, 2016
    Date of Patent: September 12, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-hoon Choi, Chang-yong Park, Dong-woo Shin
  • Patent number: 9744709
    Abstract: A variable extrusion die apparatus includes a first die into which an extrusion material is injected. A second die is coupled to the first die and has an extrusion nozzle having a shape corresponding to a cross section of an extrusion product. A swivel core is rotatably installed in the extrusion nozzle, wherein a cross section of the extrusion nozzle is varied by rotation of the swivel core.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: August 29, 2017
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Hyung Soo Park, Jae Hoon Choi
  • Publication number: 20170229400
    Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate. The semiconductor package further includes an electromagnetic wave shielding member. The electromagnetic wave shielding member includes an upper surface and a plurality of side surfaces. The electromagnetic wave shielding member surrounds an upper surface and side surfaces of the semiconductor chip. The semiconductor package further includes a hooking member formed from a deformation of a lower end of one of the side surfaces of the electromagnetic wave shielding member. The hooking member is interposed between the semiconductor chip and the substrate to fix the electromagnetic wave shielding member.
    Type: Application
    Filed: January 27, 2017
    Publication date: August 10, 2017
    Inventors: JAE-HOON CHOI, DONG-WOO SHIN, CHANG-YONG PARK
  • Publication number: 20170210866
    Abstract: Provided is a method of preparing a continuous fiber reinforced composite, and the method includes impregnating fibers provided from at least one fiber creel or metal wires provided from at least one metal wire creel in a thermoplastic resin to form a melt; molding a shape of the melt by using a mold and curing the resultant by heating in a heating tube to form a primary cured product, as a primary molding process; re-molding the primary cured product by using the mold again and curing the resultant by heating in the heating tube to form a secondary cured product, as a secondary molding process; and cooling, pultruding, and cutting the secondary cured product to perform finishing of the product.
    Type: Application
    Filed: May 19, 2015
    Publication date: July 27, 2017
    Inventors: Jae-Hoon CHOI, Hee-June KIM, Ae-Ri OH, Kang-Hyun SONG
  • Publication number: 20170213794
    Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
    Type: Application
    Filed: December 20, 2016
    Publication date: July 27, 2017
    Inventors: Yong Ho BAEK, Sang Kun KIM, Ye Jeong KIM, Jae Ean LEE, Jae Hoon CHOI
  • Publication number: 20170158078
    Abstract: An apparatus for estimating a state of charge (SOC) of a vehicle battery including a storage for storing a map, in which SOC corresponding to a charging current is recorded, according to a charging voltage, a converter for charging a lithium ion battery, a current sensor for detecting a charging current of the lithium ion battery, and a controller for retrieving the map corresponding to a charging voltage of the lithium ion battery from the storage and for extracting an SOC corresponding to the charging current detected by the current sensor from the retrieved map to estimate a SOC of the lithium ion battery.
    Type: Application
    Filed: July 14, 2016
    Publication date: June 8, 2017
    Inventors: Yu Seok KIM, Jae Hoon CHOI, Dong Gun KIM, Dong Gil HA, Hee Tae YANG, Suk Hyung KIM, Do Kyoung LIM
  • Publication number: 20170144563
    Abstract: A method for controlling an output of a battery includes measuring a state of charge (SOC) or a resistance of the battery of a vehicle, comparing a deterioration level of the battery with a set deterioration level, and controlling a temperature of the battery, an average output of the battery, and a load mode of the battery when the deterioration level of the battery is larger than the set deterioration level.
    Type: Application
    Filed: September 14, 2016
    Publication date: May 25, 2017
    Inventors: Do Kyoung LIM, Jae Hoon CHOI
  • Publication number: 20170133288
    Abstract: A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
    Type: Application
    Filed: July 1, 2016
    Publication date: May 11, 2017
    Inventors: Yong Ho BAEK, Jung Hyun CHO, Jae Hoon CHOI
  • Publication number: 20170106765
    Abstract: A method and system for detecting fusion of a relay are provided to more accurately diagnose fusion of a relay by adjusting relay OFF order when a vehicle engine is turned off using data regarding whether fusion of a relay was detected when the vehicle engine was turned on. The method includes detecting whether first and second relays have been fused when a vehicle engine was turned on and adjusting OFF order of the first and second relays when the vehicle engine is turned off based on whether the first and second relays have been fused.
    Type: Application
    Filed: August 4, 2016
    Publication date: April 20, 2017
    Inventors: Kyung Ho Kim, Kyung In Min, Jae Hoon Choi, Dong Gun Kim, Do Kyoung Lim, Jin Wook Kim, Jun Ho Bang, Yoon Jun Lee, Hee Tae Yang, Yu Seok Kim, Hyo Sik Moon, Kyun Young Ahn, Suk Hyung Kim, Dong Il Kim
  • Publication number: 20170111076
    Abstract: An electronic device may include: at least one protective member disposed in at least one area of the electronic device; at least one sensor configured to detect the drop of the electronic device; a protective member driving module configured to activate the protective member to change the shape of the protective member according to whether the drop of the electronic device is detected; and at least one processor configured to receive a drop sensing signal detected by the sensor and to control the protective member driving module to change the shape of the protective member.
    Type: Application
    Filed: October 13, 2016
    Publication date: April 20, 2017
    Inventors: Jong-Chul CHOI, Li-Yeon KANG, Kwangmin GIL, Jinkeun PARK, Min-Woo YOO, Sangsoo LEE, Min-Jong LIM, Jae-Hoon CHOI, Chang-Ryong HEO, Dongsub KIM, Sangkyu LEE