Patents by Inventor Jae Hoon Choi

Jae Hoon Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High voltage system of electric vehicles
    Patent number: 9365114
    Abstract: The present invention provides a high voltage system of an electric vehicle. More particularly, it relates to a high voltage system of an electric system which makes it possible to remove a sub-battery conventionally required in such systems by allowing a high voltage battery to function as the sub-battery. The high voltage system includes a high voltage battery, in which a cell and/or a module of the high voltage battery is connected to low voltage electric equipment through an NC relay, such that power of the cell and/or the module of the high voltage battery is supplied to the low voltage electric equipment at ignition-off.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: June 14, 2016
    Assignees: Hyundai Motor Company, Kia Motor Corporation
    Inventors: Suk Hyung Kim, Jae Hoon Choi, Do Kyoung Lim
  • Battery pack including spacer receiving conductive member
    Patent number: 9356277
    Abstract: A battery pack that has one or more batteries and a protection circuit module. The battery pack includes protection tab members that connect to the batteries and the tab members include a tab that has a coupling component that extends towards the batteries. The battery pack also includes a conductive member that connects the connection tab member to the protection circuit module. The battery pack also includes spacers that receive the connection tabs and that couple to the coupling component of the connection tabs and are interconnected to the conductive member and the spacers.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: May 31, 2016
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Ki-Woong Kim, Jae-Hoon Choi, Sung-Kyun Lim
  • ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160143142
    Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.
    Type: Application
    Filed: November 17, 2015
    Publication date: May 19, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung-Hyun CHO, Yong-Ho BAEK, Young-Gwan KO, Jae-Hoon CHOI, Jung-Hyun PARK
  • Core substrate, manufacturing method thereof, and structure for metal via
    Patent number: 9338887
    Abstract: The present invention relates to a core substrate, a manufacturing method thereof, and a structure for a metal via. In accordance with an embodiment of the present invention, a core substrate including: an insulation layer; a plurality of metal vias passing through the insulation layer and formed to become wider from upper and lower surfaces to a middle part of the insulation layer; and a conductive layer formed on the upper and lower surfaces of the insulation layer and connected to the plurality of metal vias. Further, a manufacturing method thereof and a structure for a metal via are provided.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: May 10, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hoon Choi, Jong Kuk Hong
  • SLOT COATER HAVING FLUID CONTROL UNIT
    Publication number: 20160114340
    Abstract: Disclosed is a slot coater, which includes a feeding unit having a passage through which a coating fluid flows in, a manifold for accommodating the coating fluid supplied through the feeding unit, a discharge unit communicating with the manifold to discharge the coating fluid accommodated in the manifold, a plurality of shim plates arranged at regular intervals in a length direction of the manifold, and a temperature control unit for generating a temperature difference between a shim plate located relatively closer to the feeding unit and a shim plate located respectively farther from the feeding unit.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 28, 2016
    Inventors: Jae-Hoon CHOI, Won-Chan PARK
  • EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160105967
    Abstract: An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
    Type: Application
    Filed: July 31, 2015
    Publication date: April 14, 2016
    Inventors: Jae Hoon CHOI, Jung Hyun PARK, Yong Ho BAEK, Hea Sung KIM, Jung Hyun CHO, Il Jong SEO
  • LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME
    Publication number: 20160049545
    Abstract: Disclosed is a light emitting device. The light emitting device includes a nano-structure, a first semiconductor layer on the nano-structure, an active layer on the first semiconductor layer, and a second conductive semiconductor layer on the active layer. The nano-structure includes a graphene layer disposed under the first semiconductor layer to make contact with the first semiconductor layer; and a plurality of nano-textures extending from a top surface of the graphene layer to the first semiconductor layer and contacted with the first semiconductor layer.
    Type: Application
    Filed: October 28, 2015
    Publication date: February 18, 2016
    Inventors: Jae Hoon CHOI, Buem Yeon LEE, Ki Young SONG, Rak Jun CHOI CHOI
  • PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20160044788
    Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
    Type: Application
    Filed: July 8, 2015
    Publication date: February 11, 2016
    Inventors: Jung Hyun PARK, Yong Ho BAEK, Jae Hoon CHOI
  • CARRIER SUBSTRATE AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20160037619
    Abstract: There are provided a carrier substrate including: a first metal layer; a barrier layer formed on one surface of the first carrier metal layer; and a second metal layer formed on one surface of the barrier layer, and a method of manufacturing a printed circuit board using the same.
    Type: Application
    Filed: June 9, 2015
    Publication date: February 4, 2016
    Inventors: Yong Ho BAEK, Young Gwan KO, Jae Hoon CHOI, Il Jong SEO, Sung Uk LEE, Eung Suek LEE
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160021744
    Abstract: A printed circuit board includes a first circuit pattern embedded in an insulating layer so that an upper surface of the first circuit pattern is exposed to one surface of the insulating layer, a coupling pad embedded in the insulating layer to come into contact with a lower surface of the first circuit pattern, and a bump pad formed on the upper surface of the first circuit pattern to protrude from one surface of the insulating layer.
    Type: Application
    Filed: June 10, 2015
    Publication date: January 21, 2016
    Inventors: Yong Ho BAEK, Young Gwan KO, Jung Hyun CHO, Jae Ean LEE, Jae Hoon CHOI, Jung Hyun PARK
  • CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160007449
    Abstract: Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.
    Type: Application
    Filed: June 29, 2015
    Publication date: January 7, 2016
    Inventors: Joon Sung KIM, Yong Ho BAEK, Jung Hyun CHO, Eung Suek LEE, Jae Hoon CHOI, Young Gwan KO
  • Electrode of secondary cell including porous insulating layer, and manufacturing method thereof
    Patent number: 9225012
    Abstract: The present invention provides a manufacturing method of a secondary cell electrode forming a porous insulating layer on at least one surface between a negative electrode and a positive electrode, including coating an electrode layer slurry on the electrode surface, coating the porous insulating layer while in a state in which the electrode layer slurry has not been dried, and simultaneously drying the electrode layer slurry and the porous insulating layer coating slurry so a binder of the porous insulating layer does not block the pores of the electrode layer.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: December 29, 2015
    Assignee: Hyundai Motor Company
    Inventors: Jae Hoon Choi, Sa Heum Kim, Dong Gun Kim
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150373833
    Abstract: There are provided a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a printed circuit board includes: an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer.
    Type: Application
    Filed: September 16, 2014
    Publication date: December 24, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Ho BAEK, Hyo Seung Nam, Jae Hoon Choi, Eung Suek Lee, Jeong Ho Lee
  • Light emitting device and light emitting device package having the same
    Patent number: 9202970
    Abstract: A light emitting device includes a nano-structure, a first semiconductor layer on the nano-structure, an active layer on the first semiconductor layer, and a second conductive semiconductor layer on the active layer. The nano-structure includes a graphene layer provided under the first semiconductor layer to make contact with the first semiconductor layer; and a plurality of nano-textures extending from a top surface of the graphene layer to the first semiconductor layer and in contact with the first semiconductor layer.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: December 1, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jae Hoon Choi, Buem Yeon Lee, Ki Young Song, Rak Joon Choi
  • Light emitting device
    Patent number: 9196791
    Abstract: A light emitting device includes a substrate, a buffer layer, a first conductive layer, an active layer and a third conductive semiconductor layer. The first conductive layer has a prescribed tensile stress, and a second conductive semiconductor layer has a prescribed compressive stress.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: November 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jae Hoon Choi, Young Jae Choi
  • Light emitting device
    Patent number: 9190566
    Abstract: Disclosed is a light emitting device package capable of improving luminous efficiency. The light emitting device includes a substrate; a first buffer layer on the substrate; a first insulating layer on the first buffer layer; a second buffer layer on the first insulating layer; a second insulating layer on the second buffer layer; a third buffer layer around the second buffer layer and the insulating layer; and a light emitting structure on the third buffer layer.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: November 17, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Hoon Choi, Young Jae Choi, Ho Jun Lee
  • DEVICE FOR PRODUCING COMPOSITE MATERIAL, COMPOSITE MATERIAL PRODUCED USING SAME, AND METHOD FOR PRODUCING COMPOSITE MATERIAL
    Publication number: 20150314558
    Abstract: The present invention provides a device for producing a composite material, including: a mat production unit that produces a mat which forms a polymer film having a plurality of fiber layers; a fiber production unit that produces a wide-width fiber which is formed of a plastic resin with a single direction fiber layer; and a composite material production unit to which the mat and the double width fiber are supplied so that the mat and the wide-width fiber are laminated according to a predetermined order of lamination. Also, the present invention provides a composite material produced using the device and a method for producing said composite material.
    Type: Application
    Filed: October 7, 2013
    Publication date: November 5, 2015
    Applicant: LG Hausys, Ltd.
    Inventors: Jae-Hoon CHOI, Hee-June KIM, Ae-Ri OH
  • Apparatus for storing electric energy and method of manufacturing the same
    Patent number: 9159504
    Abstract: Disclosed herein is an apparatus for storing an electric energy, the apparatus including: an electrode stack in which a cathode and an anode in which a cathode lead and an anode lead are respectively formed are alternately stacked; and collector plates disposed at both sides of the electrode stack, connected to the cathode lead and the anode lead, and provided with external terminals and one or more electrolyte flow holes.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 13, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Woong Paeng, Eun Sil Kim, Bae Kyun Kim, Jae Hoon Choi
  • SECONDARY BATTERY AND MANUFACTURING METHOD FOR THE SAME
    Publication number: 20150270515
    Abstract: A secondary battery and a manufacturing method for the same are disclosed. In one aspect, the method comprises cutting a wound tubing member to a predetermined length and inserting a battery cell including first and second electrode tabs into the cut tubing member. The method further comprises performing a primary heat-contraction process on the tubing member, wherein the primary heat-contraction process comprises applying heat to upper and lower portions of the battery cell. The method also comprises performing a secondary heat-contraction process on the tubing member, wherein the secondary heat-contraction process comprises applying heat to substantially the entire surface of the battery cell.
    Type: Application
    Filed: February 10, 2015
    Publication date: September 24, 2015
    Inventors: Kyung-Jae Shin, Jae-Hoon Choi, Sung-Kyun Lim
  • ETCHANT COMPOSITION AND METHOD FOR MANUFACTURING CIRCUIT PATTERN USING THE SAME
    Publication number: 20150267305
    Abstract: An etchant composition may contain 100 parts by weight of an aqueous etchant containing an oxidant, an acid additive, and water and 5 to 40 parts by weight of an organic solvent having a viscosity lower than that of water. And the organic solvent may have a viscosity of 0.8 cP or less.
    Type: Application
    Filed: September 15, 2014
    Publication date: September 24, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hoon CHOI, Makoto Dobashi