Patents by Inventor Jae Hoon Choi

Jae Hoon Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9627584
    Abstract: A light emitting device includes a light emitting structure including a plurality of compound semiconductor layers. A current spreading layer is provided under the light emitting structure, and a plurality of wavelength conversion structures is provided in the current spreading layer. An electrode layer is provided under the current spreading layer, and an electrode is provided on the light emitting structure.
    Type: Grant
    Filed: July 14, 2014
    Date of Patent: April 18, 2017
    Assignee: LG Innotek Co., Ltd.
    Inventors: Young Jae Choi, Jae Hoon Choi
  • Patent number: 9620392
    Abstract: An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust. The drying fluid line may be connected to the inlet.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Soo Kim, Jae-Phil Boo, Kang-Min Paek, Keon-Sik Seo, Jae-Hoon Choi
  • Publication number: 20170081504
    Abstract: Provided is a long fiber reinforced plastic composite material comprising: a thermoplastic plastic resin; and long fibers dispersed so as to have unidirectional orientation, wherein the content of the unidirectionally oriented long fibers is 70 to 100% by weight in the total content of the long fibers.
    Type: Application
    Filed: May 14, 2015
    Publication date: March 23, 2017
    Inventors: Jong-Sung PARK, Hee-June KIM, Jae-Hoon CHOI, Kang-Hyun SONG
  • Publication number: 20170084511
    Abstract: A semiconductor package includes a substrate having a groove in an upper surface. A semiconductor device is mounted on the substrate to cover one portion of the groove and leaving another portion exposed.
    Type: Application
    Filed: July 28, 2016
    Publication date: March 23, 2017
    Inventors: Jae-chan Lee, Chang-yong Park, Hun Han, Jae-hoon Choi
  • Patent number: 9578749
    Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: February 21, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung-Hyun Cho, Yong-Ho Baek, Young-Gwan Ko, Jae-Hoon Choi, Jung-Hyun Park
  • Publication number: 20170047960
    Abstract: An electronic device, a protection device, and a method for protecting the electronic device with the protection device is provided. The electronic device includes a sensor module configured to detect a motion state of the electronic device when a cover is connected to the electronic device, and a processor configured to control an actuator of the cover based on the detected motion state of the electronic device.
    Type: Application
    Filed: August 15, 2016
    Publication date: February 16, 2017
    Inventors: Kwang-Min KIL, Jae-Hoon CHOI, Li-Yeon KANG, Jin-Keun PARK, Sang-Soo LEE, Min-Jong LIM, Dong-Sub KIM, Sang-Kyu LEE, Jong-Chul CHOI, Chang-Ryong HEO
  • Publication number: 20170028948
    Abstract: A battery management system for a vehicle is provided to prevent current consumption of a battery by operating a relay connected between the battery and electronic loads to prevent an over-discharge of the battery. The battery management system includes a sensing unit that is configured to measure a current and a voltage of a battery for a vehicle and a relay that is connected between the battery for the vehicle and electronic units of the vehicle. Additionally, a controller is configured to receive data from the sensing unit to turn off the relay.
    Type: Application
    Filed: November 20, 2015
    Publication date: February 2, 2017
    Inventors: Yu Seok Kim, Jin Ho Park, Kyung In Min, Jae Hoon Choi, Dong Gun Kim, Do Kyoung Lim, Jun Ho Bang, Dong Il Kim, Yoon Jun Lee, Hee Tae Yang, Kyun Young Ahn, Kyoung-Ho Kim, Suk Hyung Kim, Jin Wook Kim
  • Patent number: 9553236
    Abstract: A light emitting device includes a first conductive semiconductor layer on a substrate, a control layer interposed between the substrate and the first conductive semiconductor layer. The control layer includes a first nitride semiconductor layer having aluminum (Al), a plurality of nano-structures on the first nitride semiconductor layer, and a second nitride semiconductor layer provided on the first nitride semiconductor layer and having gallium (Ga).
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: January 24, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Hoon Choi, Young Jae Choi
  • Publication number: 20170015205
    Abstract: An apparatus for controlling supply of power of a battery is provided. In particular the apparatus supplies battery power to various loads within a vehicle by a release of a door-lock using a key. The battery power is supplied to the loads by rotation of the key for releasing the door-lock when the power of the battery supplied to the various loads is blocked to prevent over-discharge.
    Type: Application
    Filed: November 19, 2015
    Publication date: January 19, 2017
    Inventors: Kyun Young Ahn, Kyung In Min, Jae Hoon Choi, Dong Gun Kim, Do Kyoung Lim, Jin Wook Kim, Jun Ho Bang, Yoon Jun Lee, Hee Tae Yang, Yu Seok Kim, Kyung Ho Kim, Suk Hyung Kim, Dong Il Kim, Jin Ho Park
  • Patent number: 9548416
    Abstract: Disclosed is a light emitting device. The light emitting device includes a nano-structure, a first semiconductor layer on the nano-structure, an active layer on the first semiconductor layer, and a second conductive semiconductor layer on the active layer. The nano-structure includes a graphene layer disposed under the first semiconductor layer to make contact with the first semiconductor layer; and a plurality of nano-textures extending from a top surface of the graphene layer to the first semiconductor layer and contacted with the first semiconductor layer.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 17, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae-Hoon Choi, Buem Yeon Lee, Ki Young Song, Rak Jun Choi
  • Patent number: 9539742
    Abstract: The present disclosure includes a continuous carbon fiber reinforced thermoplastic plastic composite. The continuous carbon fiber reinforced thermoplastic plastic composite includes a continuous carbon fiber impregnated in thermoplastic resin, and the continuous carbon fiber is a continuous carbon fiber has the width of 4 times to 8 times as wide as the original fiber bundle.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: January 10, 2017
    Assignee: LG HAUSYS, LTD.
    Inventors: Gi-Hune Jung, Yong-Hoon Yoon, Hee-June Kim, Tae-Hwa Lee, Ae-ri Oh, Jae-Hoon Choi
  • Publication number: 20160381796
    Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.
    Type: Application
    Filed: April 12, 2016
    Publication date: December 29, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung-Uk LEE, Il-Jong SEO, Jae-Hoon CHOI, Yong-Ho BAEK
  • Publication number: 20160372412
    Abstract: A package substrate includes: a body layer; and a pattern layer formed on a surface of the body layer. The pattern layer includes: a wire pattern; a solder pad connected to the wire pattern; and a through hole adjacent to a boundary between the wire pattern and the solder pad and vertically penetrating the pattern layer. A semiconductor package and an electronic device are disclosed.
    Type: Application
    Filed: May 14, 2016
    Publication date: December 22, 2016
    Inventors: Jae-hoon CHOI, Chang-yong PARK, Dong-woo SHIN
  • Patent number: 9487983
    Abstract: A detent hood hinge which includes a hinge bracket fixed to a vehicle body, and a hinge arm rotatably coupled to the hinge bracket at a first end, a hood being coupled to a second end of the hinge arm may include a detent bracket coupled to the hinge arm and having a slide hole perforated on one side, a sleeve pin mounted so as to protrude from the slide hole at one end and coupled to the detent bracket so as to be slidable along the slide hole, a spring configured to be elastically deformed in accordance with sliding of the sleeve pin, and a lock stopper fixed to the hinge bracket and formed with a seating groove.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: November 8, 2016
    Assignees: Hyundai Motor Company, Pyeong Hwa Automotive Co., Ltd.
    Inventors: Jae-Hoon Choi, Yong-Ju Kim
  • Patent number: 9419257
    Abstract: A high voltage battery includes an electrode assembly. A pouch-shaped case is sealed by an edge portion to cover the electrode assembly and has an open inlet formed at one side of the case to allow an electrolyte to be injected to the case therethrough. An outlet is connected to the inlet and discharges gas generated inside the case outside a vehicle.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: August 16, 2016
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Do Kyoung Lim, Jae Hoon Choi, Suk Hyung Kim, Dong Gun Kim
  • Publication number: 20160219710
    Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.
    Type: Application
    Filed: January 21, 2016
    Publication date: July 28, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho-Sik PARK, Dong-Keun LEE, Jae-Hoon CHOI, Sang-Jae LEE, Sung-Taek LIM
  • Publication number: 20160215547
    Abstract: A detent hood hinge which includes a hinge bracket fixed to a vehicle body, and a hinge arm rotatably coupled to the hinge bracket at a first end, a hood being coupled to a second end of the hinge arm may include a detent bracket coupled to the hinge arm and having a slide hole perforated on one side, a sleeve pin mounted so as to protrude from the slide hole at one end and coupled to the detent bracket so as to be slidable along the slide hole, a spring configured to be elastically deformed in accordance with sliding of the sleeve pin, and a lock stopper fixed to the hinge bracket and formed with a seating groove.
    Type: Application
    Filed: August 28, 2015
    Publication date: July 28, 2016
    Applicants: Hyundai Motor Company, Pyeong Hwa Automotive Co., Ltd.
    Inventors: Jae-Hoon CHOI, Yong-Ju KIM
  • Publication number: 20160219709
    Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.
    Type: Application
    Filed: January 7, 2016
    Publication date: July 28, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joon-Sung LEE, Yong-Sam LEE, Seok-Hwan AHN, Jae-Hoon CHOI
  • Publication number: 20160167278
    Abstract: A variable extrusion die apparatus includes a first die into which an extrusion material is injected. A second die is coupled to the first die and has an extrusion nozzle having a shape corresponding to a cross section of an extrusion product. A swivel core is rotatably installed in the extrusion nozzle, wherein a cross section of the extrusion nozzle is varied by rotation of the swivel core.
    Type: Application
    Filed: May 11, 2015
    Publication date: June 16, 2016
    Inventors: Hyung Soo PARK, Jae Hoon CHOI
  • Patent number: D771175
    Type: Grant
    Filed: February 28, 2015
    Date of Patent: November 8, 2016
    Assignee: PODO LABS, INC.
    Inventors: Jae Hoon Choi, Edmond Lee, Sam Pullman