Abstract: Apparatuses and methods for performing concurrent memory access operations for different memory planes are disclosed herein. An example apparatus may include a memory array having a plurality of memory planes. Each of the plurality of memory planes comprises a plurality of memory cells. The apparatus may further include a controller configured to receive a group of memory command and address pairs. Each memory command and address pair of the group of memory command and address pairs may be associated with a respective memory plane of the plurality of memory planes. The internal controller may be configured to concurrently perform memory access operations associated with each memory command and address pair of the group of memory command and address pairs regardless of page types associated with the pairs of the group (e.g., even if two or more of the memory command and address pairs may be associated with different page types).

Abstract: Apparatuses and methods for providing a program voltage responsive to a voltage determination are described. An example apparatus includes a memory array comprising a plurality of access lines. The example apparatus further includes a memory access circuit coupled to the memory array. The memory access circuit is configured to, during a memory program operation, provide an inhibit voltage to the plurality of access lines. The memory access circuit is further configured to, during the memory program operation, provide a program voltage to a target access line of the plurality of access lines responsive to a determination that an access line of the plurality of access lines has a voltage equal to or greater than a threshold voltage. The threshold voltage is less than the inhibit voltage.

Abstract: Apparatuses and methods for performing concurrent memory access operations for different memory planes are disclosed herein. An example apparatus may include a memory array having a plurality of memory planes. Each of the plurality of memory planes comprises a plurality of memory cells. The apparatus may further include a controller configured to receive a group of memory command and address pairs. Each memory command and address pair of the group of memory command and address pairs may be associated with a respective memory plane of the plurality of memory planes. The internal controller may be configured to concurrently perform memory access operations associated with each memory command and address pair of the group of memory command and address pairs regardless of page types associated with the pairs of the group (e.g., even if two or more of the memory command and address pairs may be associated with different page types).

Abstract: Apparatuses and methods for providing a program voltage responsive to a voltage determination are described. An example apparatus includes a memory array comprising a plurality of access lines. The example apparatus further includes a memory access circuit coupled to the memory array. The memory access circuit is configured to, during a memory program operation, provide an inhibit voltage to the plurality of access lines. The memory access circuit is further configured to, during the memory program operation, provide a program voltage to a target access line of the plurality of access lines responsive to a determination that an access line of the plurality of access lines has a voltage equal to or greater than a threshold voltage. The threshold voltage is less than the inhibit voltage.

Abstract: Systems, apparatuses and methods may provide for determining a magnitude of a bounce voltage on a source line associated with one or more memory cells and conducting, if the magnitude of the bounce voltage exceeds a threshold, a coarse-level program verification and a fine-level program verification of the one or more memory cells. Additionally, if the magnitude of the bounce voltage does not exceed the threshold, only the fine-level program verification of the one or more memory cells may be conducted. In one example, the coarse-level program verification is bypassed if the magnitude of the bounce voltage does not exceed the threshold.

Abstract: Systems, apparatuses and methods may provide for determining a magnitude of a bounce voltage on a source line associated with one or more memory cells and conducting, if the magnitude of the bounce voltage exceeds a threshold, a coarse-level program verification and a fine-level program verification of the one or more memory cells. Additionally, if the magnitude of the bounce voltage does not exceed the threshold, only the fine-level program verification of the one or more memory cells may be conducted. In one example, the coarse-level program verification is bypassed if the magnitude of the bounce voltage does not exceed the threshold.

Abstract: Memories, pre-charge circuits, and methods for pre-charging memory are described. One such method includes providing a voltage to a data line and adjusting the voltage provided to the data line based at least in part on a voltage difference between a target voltage and a voltage of the data line being pre-charged. An example pre-charge circuit includes a voltage generator configured to generate an output voltage having a magnitude based at least in part on a reference voltage and a feedback signal, first and second drivers, and a voltage detector. The voltage detector is configured to determine a voltage difference between the reference voltage and a sample voltage of a data line coupled to the second driver and generate the feedback signal based at least in part on the difference.

Abstract: A system includes a first switch, an amplifier, a second switch, and a capacitor. The first switch is electrically coupled between a first reference voltage and a node. The amplifier has a first input, a second input, and an output, the amplifier to receive a second reference voltage on the first input and a sample voltage on the second input. The second switch is electrically coupled between the output of the amplifier and the second input of the amplifier. The capacitor is electrically coupled between the second input of the amplifier and the node. The first switch and the second switch are closed to initialize the node to the first reference voltage and to initialize the amplifier in unity-gain configuration. The first switch and the second switch are opened to detect a leakage current by sensing a change in the sample voltage.

Abstract: Apparatuses and methods for comparing a sense current representative of a number of failing memory cells of a group of memory cells and a reference current representative of a reference number of failing memory cells is provided. One such apparatus includes a comparator configured to receive the sense current and to receive the reference current. The comparator includes a sense current buffer configured to buffer the sense current and the comparator is further configured to provide an output signal having a logic level indicative of a result of the comparison.

Abstract: Apparatuses and methods for comparing a sense current representative of a number of failing memory cells of a group of memory cells and a reference current representative of a reference number of failing memory cells is provided. One such apparatus includes a comparator configured to receive the sense current and to receive the reference current. The comparator includes a sense current buffer configured to buffer the sense current and the comparator is further configured to provide an output signal having a logic level indicative of a result of the comparison.

Abstract: Apparatuses and methods for performing concurrent memory access operations for different memory planes are disclosed herein. An example apparatus may include a memory array having a plurality of memory planes. Each of the plurality of memory planes comprises a plurality of memory cells. The apparatus may further include a controller configured to receive a group of memory command and address pairs. Each memory command and address pair of the group of memory command and address pairs may be associated with a respective memory plane of the plurality of memory planes. The internal controller may be configured to concurrently perform memory access operations associated with each memory command and address pair of the group of memory command and address pairs of the group of memory command and address pairs regardless of page types associated with the pairs of the group (e.g., even if two or more of the memory command and address pairs may be associated with different page types).

Abstract: Methods of analyzing photolithography processes are provided. The methods may include obtaining an image from a pattern formed on a wafer and obtaining dimensions of the image. The methods may further include converting the dimensions into a profile graph and then dividing the profile graph into a low-frequency band profile graph and a high-frequency band profile graph.

Abstract: A method of fabricating an integrated circuit device includes forming first and second mask structures on respective first and second regions of a feature layer. Each of the first and second mask structures includes a dual mask pattern and an etch mask pattern thereon having an etch selectivity relative to the dual mask pattern. The etch mask patterns of the first and second mask structures are etched to partially remove the etch mask pattern from the second mask structure. Spacers are formed on opposing sidewalls of the first and second mask structures. The first mask structure is selectively removed from between the spacers in the first region to define a first mask pattern including the opposing sidewall spacers with a void therebetween in the first region, and a second mask pattern including the opposing sidewall spacers with the second mask structure therebetween in the second region.

Abstract: Memories, pre-charge circuits, and methods for pre-charging memory are described. One such method includes providing a voltage to a data line and adjusting the voltage provided to the data line based at least in part on a voltage difference between a target voltage and a voltage of the data line being pre-charged. An example pre-charge circuit includes a voltage generator configured to generate an output voltage having a magnitude based at least in part on a reference voltage and a feedback signal, first and second drivers, and a voltage detector. The voltage detector is configured to determine a voltage difference between the reference voltage and a sample voltage of a data line coupled to the second driver and generate the feedback signal based at least in part on the difference.

Abstract: Apparatuses and methods for providing a program voltage responsive to a voltage determination are described. An example apparatus includes a memory array comprising a plurality of access lines. The example apparatus further includes a memory access circuit coupled to the memory array. The memory access circuit is configured to, during a memory program operation, provide an inhibit voltage to the plurality of access lines. The memory access circuit is further configured to, during the memory program operation, provide a program voltage to a target access line of the plurality of access lines responsive to a determination that an access line of the plurality of access lines has a voltage equal to or greater than a threshold voltage. The threshold voltage is less than the inhibit voltage.

Abstract: In a method of forming a semiconductor device, a feature layer is provided on a substrate and a mask layer is provided on the feature layer. A portion of the mask layer is removed in a first region of the semiconductor device where fine features of the feature layer are to be located, the mask layer remaining in a second region of the semiconductor device where broad features of the feature layer are to be located. A mold mask pattern is provided on the feature layer in the first region and on the mask layer in the second region. A spacer layer is provided on the mold mask pattern in the first region and in the second region. An etching process is performed to etch the spacer layer so that spacers remain at sidewalls of pattern features of the mold mask pattern, and to etch the mask layer in the second region to provide mask layer patterns in the second region.

Abstract: Memories, pre-charge circuits, and methods for pre-charging memory are described. One such method includes providing a voltage to a data line and adjusting the voltage provided to the data line based at least in part on a voltage difference between a target voltage and a voltage of the data line being pre-charged. An example pre-charge circuit includes a voltage generator configured to generate an output voltage having a magnitude based at least in part on a reference voltage and a feedback signal, first and second drivers, and a voltage detector. The voltage detector is configured to determine a voltage difference between the reference voltage and a sample voltage of a data line coupled to the second driver and generate the feedback signal based at least in part on the difference.

Abstract: Apparatuses and methods for comparing a sense current representative of a number of failing memory cells of a group of memory cells and a reference current representative of a reference number of failing memory cells is provided. One such apparatus includes a comparator configured to receive the sense current and to receive the reference current. The comparator includes a sense current butler configured to buffer the sense current and the comparator is further configured to provide an output signal having a logic level indicative of a result of the comparison.

Abstract: A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction.

Abstract: A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction.