Patents by Inventor Jae Min Kim

Jae Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11123388
    Abstract: Provided is a pharmaceutical composition for preventing or treating inflammatory bowel disease (IBD) comprising a mixed extract of at least two of Aucklandia lappa Decne, Terminalia chebula Retzius, and Zingiber officinale Rosc. as an active ingredient and a method thereof, and more specifically, to a pharmaceutical composition having an inhibitory effect on monocyte adhesion in intestinal epithelial cells, an effect of inhibiting the production of inflammatory cytokines, an effect of ameliorating colitis in an animal model of dextran sodium sulfate (DSS)-induced colitis, and an effect of ameliorating Crohn's disease in an animal model of 2,4,6-trinitrobenzenesulfonic acid (TNBS)-induced Crohn's disease.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: September 21, 2021
    Assignee: GENUONE SCIENCES INC.
    Inventors: Yong-baik Cho, Seul-ki Kim, Sang-Back Kim, Jae-hyuck Shin, Young-ran Um, So-youn Mok, Ju-ri Jung, Soon-min Lim, Chae Shin Seo, Hong Koo Cho, Bon Am Koo, Hyo Jin Jeon, Han-Seok Choi, Ye Jin Kim
  • Publication number: 20210286589
    Abstract: An electronic device is provided. The electronic device includes a housing, a touchscreen display exposed through a first portion of the housing, a microphone disposed at a second portion of the housing, a speaker disposed at a third portion of the housing, a memory disposed inside the housing, a processor disposed inside the housing, and electrically connected to the display, the microphone, the speaker, and the memory. The memory is configured to store a plurality of application programs, each of which includes a graphic user interface (GUI).
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Inventors: In Jong RHEE, Ji Min LEE, Sang Ki KANG, Han Jun KU, Sung Pa PARK, Jang Seok SEO, In Wook SONG, Won Ick AHN, Kyoung Gu WOO, Ji Soo YI, Chang Kyun JEON, Ho Jun JAYGARL, Il Hwan CHOI, Yoo Jin HONG, Ji Hyun KIM, Jae Yung YEO
  • Patent number: 11118021
    Abstract: The present disclosure relates to a fiber-reinforced polypropylene composite resin composition with reduced odor for interior parts of vehicles which includes an inorganic deodorant with excellent effects of reducing odors so as to improve indoor air quality, and includes a mixture of a polypropylene polymer, a thermoplastic elastomer, a fiber-shaped filler, a coupling agent, a slip agent and a UV stabilizer. Interior parts of vehicles molded from the fiber-reinforced polypropylene composite resin composition according to the present disclosure deodorize unpleasant gas generated during the production process and have excellent mechanical properties, thus providing pleasant environments for drivers.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 14, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Han Ki Lee, Ju Seong Park, Jae Min Kim, Byung Soo Kim, Byung Wook Kang
  • Publication number: 20210278113
    Abstract: The present invention relates to an air conditioner for a vehicle which includes an integrated heat pump system having an electronic part waste heat recovery device to enhance heating performance and which can cool a battery of an electric vehicle using refrigerant in a cooling mode. The air conditioner for a vehicle includes a refrigerant circulation system for performing cooling or heating of the interior of the vehicle by circulating refrigerant. The air conditioner further includes a first refrigerant pipe exchanging heat with a battery system of the vehicle in sequence to selectively exchange heat between refrigerant of the refrigerant circulation system and a coolant of the first coolant pipe.
    Type: Application
    Filed: March 29, 2018
    Publication date: September 9, 2021
    Inventors: Jae Chun RYU, Dae Bok Keon, Yun Jin Kim, Se Min Lee
  • Patent number: 11114850
    Abstract: An electrostatic discharge protection circuit includes a first internal circuit formed between a first power line and a first ground line, and configured to operate in a range between a first power and a first ground; a second internal circuit formed between a second power line and a second ground line, and configured to operate in a range between a second power having a level higher than the first power and a second ground; a signal line connecting an output terminal of the first internal circuit and an input terminal of the second internal circuit; and a protection circuit configured to form a bypass path for bypassing a stress due to electrostatic discharge when the electrostatic discharge occurs, between the signal line and the second ground line, to protect a semiconductor device of the second internal circuit from the electrostatic discharge.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 7, 2021
    Assignee: Silicon Works Co., Ltd.
    Inventors: Jae Min Kim, Jae Hyun Lee, Yong Nam Choi
  • Patent number: 11110460
    Abstract: Provided is a microfluidic chip having an inlet/outlet structure optimized for sealing an inlet/outlet of a microfluidic chip using a UV curable sealing material, a microfluidic chip having the inlet/outlet structure, and a method of sealing the inlet/outlet of the microfluidic chip using a UV curable sealing material. It is possible to provide a semi-permanent seal with less contamination from a fluid sample or a harmful reagent, and the inlet/outlet of the microfluidic chip can be firmly sealed using simple equipment and without high-temperature/high-pressure conditions.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: September 7, 2021
    Assignee: NANOBIOSYS INC.
    Inventors: Sung Woo Kim, Seung Min Jeong, Jae Young Byun
  • Publication number: 20210268440
    Abstract: A direct water purifier comprises: a first filter for filtering water flowing in through a first flow path; a second filter receiving, through a second flow path, and filtering the water filtered by the first filter; a first valve, provided on the second flow path; a pump, provided on the second flow path, for supplying, to the second filter, water at a water pressure equal to or greater than a preset water pressure; a third filter receiving, through a third flow path, and filtering the water filtered by the second filter; a second valve, provided on the third flow path, for decreasing a pressure in the flow path; a third valve, provided at a rear end of the second valve, for preventing a backflow of the water; and a heating unit receiving the water filtered by the third filter and heating the water to a preset temperature.
    Type: Application
    Filed: July 10, 2019
    Publication date: September 2, 2021
    Applicant: WOONGJIN COWAY Co., Ltd.
    Inventors: Hyoung-Min MOON, Chul-Ho KIM, Hyun-Seok MOON, Hyun-Soo SHIN, Byung-Sun MO, Byoung-Phil LEE, Min-Chul YONG, Jae-Man KIM, Sung-Kon CHO
  • Publication number: 20210269533
    Abstract: An anti-c-Met antibody or antibody fragment and pharmaceutical composition comprising same, as well as a method for preventing and treating cancer by administering the antibody to a subject are provided.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 2, 2021
    Inventors: Seung Hyun LEE, Geun Woong KIM, Kyung Ah KIM, Hye Won PARK, Ho Yeong SONG, Young Mi OH, Saet Byoul LEE, Ji Min LEE, Kwang Ho CHEONG, Yun Ju JEONG, Mi Young CHO, Jae Hyun CHOI, Yun Jeong SONG, Yoon Aa CHOI
  • Publication number: 20210274001
    Abstract: An electronic device is provided. The electronic device includes housing, a touch screen display, a microphone, a wireless communication circuit, a processor, and a memory. The memory stores a software program including a user interface supporting the control of at least one external device based on a user account, and the memory stores at least one instruction that, when executed, causes the processor to receive a first user input for connecting the electronic device to a first external device, to receive a second user input corresponding to a request for performing at least part of a task by using the first external device, to receive a first response including a sequence of states from the second external device to perform, by the first external device, the at least part of the task depending on the sequence.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Inventors: Seong Min JE, Sun Key LEE, Kyung Tae KIM, Joo Hwan KIM, Jae Yung YEO, Kyoung Gu WOO, Jeong Hyeon YUN, Dong Sun LIM
  • Patent number: 11107743
    Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Tae Hwang, Jae-Choon Kim, Kyung-Suk Oh, Woon-Bae Kim, Jae-Min Jung
  • Patent number: 11105788
    Abstract: An apparatus for detecting internal defects in a transformer is provided. The apparatus detecting internal defects that arise in the interior by integrating an electrode for electrically detecting defects and a sensor for detecting internal gas into a single body and inserting same into the interior. The apparatus for detecting internal defects in a transformer according to the present invention comprises: a metal member of a set length; a plurality of electrodes, disposed around the metal member, for detecting electrical signals generated due to internal defects of the transformer; an insulating member formed so as to contain the metal member and plurality of electrodes; and a gas sensor, installed at the end of the metal member, for detecting gas inside the transformer.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: August 31, 2021
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: Jae Ryong Jung, Young Min Kim, Sung Wook Kim, Hyang Eun Jo
  • Publication number: 20210260281
    Abstract: The present disclosure provides an infusion flow regulator, including: a main body (10) having an inlet through which fluid is introduced and an outlet through which the fluid is discharged; and a rotary dial (30) rotatably coupled to the main body, with a sealing member (20) interposed therebetween, so as to regulate the flow rate of the fluid, in which the rotary dial includes a regulating flow path (31) having a shape of a recessed groove in cross section with a first width and a first height, and the regulating flow path (31) includes a first region in which the width is constant and the height is decreased, and a second region in which both the width and height are decreased. By the configuration described above, the device for regulating infusion solution according to the present disclosure has an effect of accurately regulating the flow rate even in a region where the flow rate of the infusion solution is a very small.
    Type: Application
    Filed: May 27, 2019
    Publication date: August 26, 2021
    Applicant: KOREA AEROSPACE RESEARCH INSTITUTE
    Inventors: Poo Min PARK, Hyung Mo KIM, Tae Choon PARK, Young Seok KANG, Jae Sung HUH, Doo Yong LEE
  • Publication number: 20210196685
    Abstract: The present invention relates to a composition for eradicating Helicobacter pylori and a use thereof. The composition of the present invention maintains an intragastric pH at a certain level or more for a certain period of time or longer, thereby maximizing an action of amoxicillin and clarithromycin to show an excellent effect on eradicating Helicobacter pylori.
    Type: Application
    Filed: August 28, 2019
    Publication date: July 1, 2021
    Applicant: HK INNO.N CORPORATION
    Inventors: Bong Tae KIM, Dongkyu KIM, Eun Ji KIM, Ji Won LEE, Kyeongmin OH, Ahrong KIM, Geun Seog SONG, Shin-Young RYU, Eun Kyung KIM, Naree SHIN, Hyun Ji KANG, Jae Min KIM, Yu-Gyeong PARK, Haneul JEONG
  • Patent number: 11049741
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 29, 2021
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20210130954
    Abstract: Disclosed is a method of forming a thin film using a surface protection material, the method comprising supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate, discharging the unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber, supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate, discharging the unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber, and supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film.
    Type: Application
    Filed: July 24, 2020
    Publication date: May 6, 2021
    Applicant: EUGENETECH MATERIALS CO., LTD.
    Inventors: Geun Su LEE, Jae Min KIM, Ha Na KIM, Woong Jin CHOI, Eun Ae JUNG, Dong Hyun LEE, Myung Soo LEE, Ji Won MOON, Dong Hak JANG, Hyun Sik NOH
  • Publication number: 20210091040
    Abstract: A semiconductor package may include: a chip stack including first to Nth semiconductor chips stacked with an offset to one side such that edges thereof on the other side are exposed, and having first to Nth chip pads disposed at the other-side edges, respectively; a bridge unit disposed adjacent to the other side of the chip stack and spaced apart from the chip stack; kth to Nth wires extended in a vertical direction while one ends thereof are connected to the kth to Nth chip pads among the first to Nth chip pads; first to (k?1)th wires having one ends connected to the first to (k?1)th chip pads among the first to Nth chip pads; and an additional wire electrically coupled to the first to (k?1)th wires, and extended in the vertical direction while one end thereof is connected to the bridge unit.
    Type: Application
    Filed: May 12, 2020
    Publication date: March 25, 2021
    Applicant: SK hynix Inc.
    Inventor: Jae-Min KIM
  • Publication number: 20210057379
    Abstract: A semiconductor package may include: a chip stack including first to Nth semiconductor chips having first to Nth chip pads formed in active surfaces thereof, respectively, and sequentially stacked in a vertical direction such that the first to Nth chip pads are exposed, wherein N is a natural number equal to or more than 2; first to Nth vertical wires having first ends connected to the first to Nth chip pads, respectively, and extended in the vertical direction; a coating layer surrounding portions of the first to kth vertical wires, extended from the first ends, among the first to Nth vertical wires, and connection portions between the first ends of the first to kth vertical wires and the first to kth chip pads; and a molding layer covering the chip stack, surrounding the vertical wires, and covering the coating layer.
    Type: Application
    Filed: February 7, 2020
    Publication date: February 25, 2021
    Applicant: SK hynix Inc.
    Inventor: Jae-Min KIM
  • Publication number: 20210034138
    Abstract: A system on chip (SoC) includes a first core and a second core, first and second power gating switches, and a first power switch. The first power gating switch is arranged between the first core and a first power rail that receives a first voltage, and is selectively turned on in response to a first power gating signal. The second power gating switch is arranged between the second core and a second power rail that receives a second voltage, and is selectively turned on in response to a second power gating signal. The first power switch is arranged between the first power rail and the second power rail, and is selectively turned on in response to a first power control signal to connect the first power gating switch or the second power gating switch both the first power rail and the second power rail.
    Type: Application
    Filed: April 10, 2020
    Publication date: February 4, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byungchul Jeon, Jae Min Kim, Hyunseok Kim, Junho Huh
  • Publication number: 20200377947
    Abstract: A diagnostic method according to an embodiment of the present invention is to determine prognosis, such as recurrence and death, which commonly occurs after acute coronary syndrome. A method of determining long-term prognosis of acute coronary syndrome includes analyzing anxiety and serotonin transporter gene polymorphism associated therewith. The method is capable of determining the risk of incidence of major adverse cardiac events including recurrence and/or death after acute coronary syndrome.
    Type: Application
    Filed: August 23, 2018
    Publication date: December 3, 2020
    Inventor: Jae Min KIM
  • Publication number: 20200273799
    Abstract: A system-in-package includes a redistributed line (RDL) structure, a first semiconductor chip, a second semiconductor chip, a second sub-package, a first bridge die, and a second bridge die. The RDL structure includes a first RDL pattern to which a first chip pad of the first semiconductor chip is electrically connected. The second semiconductor is stacked on the first semiconductor chip such that the second semiconductor chip protrudes past a side surface of the first semiconductor chip, wherein a second chip pad disposed on the protrusion of the second semiconductor chip is electrically connected to the first RDL pattern through the first bridge die. The second bridge die is disposed to electrically connect the second sub-package to the first semiconductor chip.
    Type: Application
    Filed: October 28, 2019
    Publication date: August 27, 2020
    Applicant: SK hynix Inc.
    Inventors: Ki Jun SUNG, Jong Hoon KIM, Jae Min KIM