Abstract: The present invention relates to a battery module simulation system and method for easily implementing pressure and temperature conditions in a battery module by easily changing the pressure and temperature applied to a battery cell in a pressure measurement test of the battery cell.

Abstract: An antenna device is provided. The antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed between the first dielectric layer and the second dielectric layer; a feed via configured to penetrate the first dielectric layer; a first feed pattern disposed between the first dielectric layer and the third dielectric layer; a second feed pattern disposed between the second dielectric layer and the third dielectric layer and configured to overlap the first feed pattern; and a patch antenna pattern disposed on the second dielectric layer and configured to overlap the first feed pattern and the second feed pattern, wherein a dielectric constant of the third dielectric layer is less than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer.

Abstract: A battery pack includes a battery module including a battery cell stack in which a plurality of battery cells are stacked in a stacking direction; a pack housing that accommodates the battery module therein; a cross beam arranged on the bottom of the pack housing; and a tube arranged inside the cross beam. The cross beam is located on one side surface of the battery module, and extends along a direction perpendicular to the stacking direction of the battery cells. A fluid flows into the inside of the tube.

Abstract: An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

Abstract: A battery module of the present disclosure includes: a cell stack including a plurality of battery cells; a first end plate and a second end plate respectively covering a top surface and a bottom surface of the cell stack; a first upper reinforcing plate and a second upper reinforcing plate located on the first end plate and respectively extending from a side and the other side of the first end plate in a longitudinal direction of the first end plate toward a central portion; a first lower reinforcing plate and a second lower reinforcing plate located on the second end plate and respectively extending from a side and the other side of the second end plate in a longitudinal direction of the second end plate toward a central portion; a first fastening bolt located on a side of the cell stack in a longitudinal direction of the cell stack, and passing through the first upper reinforcing plate, the first end plate, the second end plate, and the first lower reinforcing plate; and a second fastening bolt located on

Abstract: A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.

Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: An antenna includes a first insulating layer; a second insulating layer disposed on the first insulating layer in a height direction; a third insulating layer disposed between the first and second insulating layers, a feed via including a first portion passing through the first insulating layer, a second portion passing through the second insulating layer, and a third portion passing through the third insulating layer and connected to the first and second portions; and an antenna patch disposed on the first insulating layer and fed from the feed via, wherein a permittivity of the third insulating layer is lower than permittivities of the first and second insulating layers, and in a direction perpendicular to the height direction, a width of the third portion is wider than a width of the first portion and/or a width of the second portion.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: The present disclosure relates to an apparatus and method for evaluating durability of a battery module frame for a vehicle. According to the present disclosure, it is possible to easily evaluate the durability or a similar quality of the welded portion of the battery module frame by providing constraints similar to a situation in which a swelling phenomenon occurs in a battery cell in the battery module frame.

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

Abstract: The present invention relates to a battery module simulation system and method for easily implementing pressure and temperature conditions in a battery module by easily changing the pressure and temperature applied to a battery cell in a pressure measurement test of the battery cell.

Abstract: A chip patch antenna includes an upper dielectric layer including a first dielectric material and a second dielectric material having different dielectric constants from each other and bonded to each other in a planar direction, a first patch antenna electrode and a second patch antenna electrode respectively disposed on one side of each of the first dielectric material and the second dielectric material, a lower dielectric layer spaced from the first dielectric material and the second dielectric material in a thickness direction, and a third patch antenna electrode and a fourth patch antenna electrode disposed on one side of the lower dielectric layer.

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

Abstract: An antenna device is provided. The antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed between the first dielectric layer and the second dielectric layer; a feed via configured to penetrate the first dielectric layer; a first feed pattern disposed between the first dielectric layer and the third dielectric layer; a second feed pattern disposed between the second dielectric layer and the third dielectric layer and configured to overlap the first feed pattern; and a patch antenna pattern disposed on the second dielectric layer and configured to overlap the first feed pattern and the second feed pattern, wherein a dielectric constant of the third dielectric layer is less than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer.

Abstract: A battery module and a battery pack including same, have improved fastening of a cooling plate through the use of the combination of a reinforcement beam and welding in the fastening of the cooling plate, and thus detachment of the cooling plate due to swelling of a battery cell or due to external shocks is effectively prevented.

Abstract: An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.

Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.