Patents by Inventor Jae Yeong Kim
Jae Yeong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210036407Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: ApplicationFiled: March 24, 2020Publication date: February 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Sung Yong AN, Ji Hyung JUNG, Jae Yeong KIM, Ju Hyoung PARK, Sung Nam CHO
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Publication number: 20200335870Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: February 27, 2020Publication date: October 22, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
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Publication number: 20200328530Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.Type: ApplicationFiled: January 10, 2020Publication date: October 15, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Sung Yong AN, Myeong Woo HAN, Sung Nam CHO, Jae Yeong KIM
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Publication number: 20200313279Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: January 2, 2020Publication date: October 1, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Publication number: 20200259269Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: ApplicationFiled: December 23, 2019Publication date: August 13, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
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Publication number: 20200259267Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: ApplicationFiled: October 31, 2019Publication date: August 13, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
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Publication number: 20200243976Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 ?m to 500 ?m.Type: ApplicationFiled: March 25, 2020Publication date: July 30, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Yong AN
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Patent number: 10644403Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 ?m to 500 ?m.Type: GrantFiled: May 30, 2018Date of Patent: May 5, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Yong An
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Patent number: 10604687Abstract: There is further provided a transparent adhesive composition including a silicon acrylate monomer; a silanol compound; an alkoxy silane compound; and an optical initiator.Type: GrantFiled: December 19, 2016Date of Patent: March 31, 2020Assignee: LG Display Co., Ltd.Inventors: Jae-Yeong Kim, Eun-Ju Park, Won-Bong Jang, Jun-Ha Hwang, Tae-Soo Jo
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Publication number: 20200083593Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.Type: ApplicationFiled: June 28, 2019Publication date: March 12, 2020Applicant: Samsung Electro-Mechanics.,Co., Ltd.Inventors: Seong Hee CHOI, Sang Jong LEE, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
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Patent number: 10446816Abstract: Disclosed is a battery module. The battery module includes: a battery cell stack in which a plurality of battery cells are stacked; a plurality of end plates at least partially surrounding the battery cell stack; and a support member coupled to the plurality of end plates and supporting the plurality of end plates.Type: GrantFiled: September 22, 2017Date of Patent: October 15, 2019Assignee: LG CHEM, LTD.Inventors: Young-Ho Lee, Jae-Yeong Kim, Hyuk An, Young-Sop Eom
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Patent number: 10439164Abstract: A display device comprises a cover window including a first area of a curved shape and a second area of a flat shape and having a first end connected to the first area, wherein the first area has a plurality of first concave patterns at its inner surface; a display panel under the cover window; and an adhesive layer between the cover window and the display panel.Type: GrantFiled: August 27, 2018Date of Patent: October 8, 2019Assignee: LG Display Co., Ltd.Inventors: Kelly Soo-Yeun Song, Mi-Hyung Chin, Jun-Ha Hwang, Jae-Yeong Kim, Won-Bong Jang
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Publication number: 20190237861Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.Type: ApplicationFiled: November 9, 2018Publication date: August 1, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Yong AN, Sang Jong LEE, Seong Hee CHOI, Kyu Bum HAN, Jeong Ki RYOO, Byeong Cheol MOON, Chang Hak CHOI
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Publication number: 20190190120Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.Type: ApplicationFiled: October 2, 2018Publication date: June 20, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Yong AN, Chang Hak CHOI
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Publication number: 20190067820Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 ?m to 500 ?m.Type: ApplicationFiled: May 30, 2018Publication date: February 28, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Yong AN
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Publication number: 20190067633Abstract: A display device comprises a cover window including a first area of a curved shape and a second area of a flat shape and having a first end connected to the first area, wherein the first area has a plurality of first concave patterns at its inner surface; a display panel under the cover window; and an adhesive layer between the cover window and the display panel.Type: ApplicationFiled: August 27, 2018Publication date: February 28, 2019Inventors: Kelly Soo-Yeun SONG, Mi-Hyung CHIN, Jun-Ha HWANG, Jae-Yeong KIM, Won-Bong JANG
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Publication number: 20180375078Abstract: Disclosed is a battery module. The battery module includes: a battery cell stack in which a plurality of battery cells are stacked; a plurality of end plates at least partially surrounding the battery cell stack; and a support member coupled to the plurality of end plates and supporting the plurality of end plates.Type: ApplicationFiled: September 22, 2017Publication date: December 27, 2018Applicant: LG CHEM, LTD.Inventors: Young-Ho LEE, Jae-Yeong KIM, Hyuk AN, Young-Sop EOM
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Patent number: 9984821Abstract: A multilayer ceramic capacitor includes an active region including a plurality of dielectric layers, and first and second internal electrodes alternately disposed with each of the dielectric layers interposed therebetween; and upper and lower cover regions including at least one ferromagnetic layer and disposed on and below the active region, respectively.Type: GrantFiled: February 24, 2016Date of Patent: May 29, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Yong An, Kang Ryong Choi, Jae Yeong Kim, Yong Hui Li, Byeong Cheol Moon, Jeong Gu Yeo
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Publication number: 20170190942Abstract: There is further provided a transparent adhesive composition including a silicon acrylate monomer; a silanol compound; an alkoxy silane compound; and an optical initiator.Type: ApplicationFiled: December 19, 2016Publication date: July 6, 2017Applicant: LG Display Co., Ltd.Inventors: Jae-Yeong KIM, Eun-Ju PARK, Won-Bong JANG, Jun-Ha HWANG, Tae-Soo JO
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Publication number: 20170084392Abstract: A multilayer ceramic capacitor includes an active region including a plurality of dielectric layers, and first and second internal electrodes alternately disposed with each of the dielectric layers interposed therebetween; and upper and lower cover regions including at least one ferromagnetic layer and disposed on and below the active region, respectively.Type: ApplicationFiled: February 24, 2016Publication date: March 23, 2017Inventors: Sung Yong AN, Kang Ryong CHOI, Jae Yeong KIM, Yong Hui LI, Byeong Cheol MOON, Jeong Gu YEO