Patents by Inventor Jae Yeong Kim
Jae Yeong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230129302Abstract: The present disclosure relates to an apparatus and method for evaluating durability of a battery module frame for a vehicle. According to the present disclosure, it is possible to easily evaluate the durability or a similar quality of the welded portion of the battery module frame by providing constraints similar to a situation in which a swelling phenomenon occurs in a battery cell in the battery module frame.Type: ApplicationFiled: September 13, 2021Publication date: April 27, 2023Applicant: LG ENERGY SOLUTION, LTD.Inventors: Su Hang LEE, Yong Il KIM, Jae Yeong KIM
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Patent number: 11637362Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.Type: GrantFiled: February 17, 2021Date of Patent: April 25, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Yong An, Chang Hak Choi
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Publication number: 20230120644Abstract: The present invention relates to a battery module simulation system and method for easily implementing pressure and temperature conditions in a battery module by easily changing the pressure and temperature applied to a battery cell in a pressure measurement test of the battery cell.Type: ApplicationFiled: July 21, 2021Publication date: April 20, 2023Applicant: LG ENERGY SOLUTION, LTD.Inventors: Dong Wook KIM, Jae Yeong KIM, Yong Il KIM
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Publication number: 20230112892Abstract: A chip patch antenna includes an upper dielectric layer including a first dielectric material and a second dielectric material having different dielectric constants from each other and bonded to each other in a planar direction, a first patch antenna electrode and a second patch antenna electrode respectively disposed on one side of each of the first dielectric material and the second dielectric material, a lower dielectric layer spaced from the first dielectric material and the second dielectric material in a thickness direction, and a third patch antenna electrode and a fourth patch antenna electrode disposed on one side of the lower dielectric layer.Type: ApplicationFiled: July 11, 2022Publication date: April 13, 2023Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Youngjo CHOI, Chin Mo KIM, Jae Yeong KIM, Eun Ju OH
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Patent number: 11621491Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: GrantFiled: September 1, 2021Date of Patent: April 4, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
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Publication number: 20230049220Abstract: An antenna device is provided. The antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed between the first dielectric layer and the second dielectric layer; a feed via configured to penetrate the first dielectric layer; a first feed pattern disposed between the first dielectric layer and the third dielectric layer; a second feed pattern disposed between the second dielectric layer and the third dielectric layer and configured to overlap the first feed pattern; and a patch antenna pattern disposed on the second dielectric layer and configured to overlap the first feed pattern and the second feed pattern, wherein a dielectric constant of the third dielectric layer is less than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer.Type: ApplicationFiled: July 12, 2022Publication date: February 16, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Juhyoung PARK, Daeki LIM, Jeongki RYOO, Sungyong AN, Jae Yeong KIM
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Publication number: 20220393269Abstract: A battery module and a battery pack including same, have improved fastening of a cooling plate through the use of the combination of a reinforcement beam and welding in the fastening of the cooling plate, and thus detachment of the cooling plate due to swelling of a battery cell or due to external shocks is effectively prevented.Type: ApplicationFiled: June 23, 2021Publication date: December 8, 2022Applicant: LG ENERGY SOLUTION, LTD.Inventors: Gi Young CHOI, Su Hang LEE, Jae Yeong KIM, YONG IL KIM, Dong Wook KIM
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Patent number: 11462832Abstract: An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.Type: GrantFiled: January 15, 2021Date of Patent: October 4, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Juhyoung Park, Daeki Lim, Youngsik Hur, Sungyong An, Jae Yeong Kim, Chin Mo Kim
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Patent number: 11431107Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.Type: GrantFiled: January 10, 2020Date of Patent: August 30, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Sung Yong An, Myeong Woo Han, Sung Nam Cho, Jae Yeong Kim
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Publication number: 20220231430Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: ApplicationFiled: April 5, 2022Publication date: July 21, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Ji Hyung JUNG, Chin Mo KIM, Sung Nam CHO, Sung Yong AN
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Publication number: 20220216586Abstract: A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.Type: ApplicationFiled: June 9, 2021Publication date: July 7, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Sungyong AN, Jae Yeong KIM
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Patent number: 11322856Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: GrantFiled: January 2, 2020Date of Patent: May 3, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Ji Hyung Jung, Chin Mo Kim, Sung Nam Cho, Sung Yong An
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Patent number: 11316250Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.Type: GrantFiled: September 16, 2020Date of Patent: April 26, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Yong An, Joong Jin Nam, Jae Yeong Kim
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Publication number: 20220102872Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: ApplicationFiled: December 10, 2021Publication date: March 31, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
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Publication number: 20220085510Abstract: An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.Type: ApplicationFiled: January 15, 2021Publication date: March 17, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Juhyoung PARK, Daeki LIM, Youngsik HUR, Sungyong AN, Jae Yeong KIM, Chin Mo KIM
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Patent number: 11264703Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: GrantFiled: January 19, 2021Date of Patent: March 1, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
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Patent number: 11251518Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: GrantFiled: March 24, 2020Date of Patent: February 15, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Sung Yong An, Ji Hyung Jung, Jae Yeong Kim, Ju Hyoung Park, Sung Nam Cho
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Publication number: 20220029274Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Patent number: 11233336Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: GrantFiled: October 31, 2019Date of Patent: January 25, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Kyu Bum Han, Jae Yeong Kim, Jeong Ki Ryoo, Sung Nam Cho, Sung Yong An
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Publication number: 20220021103Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.Type: ApplicationFiled: September 29, 2021Publication date: January 20, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Myeong Woo HAN, Jae Yeong KIM, Young Sik HUR, Sung Yong AN, Dae Ki LIM