Abstract: In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module.

Abstract: A semiconductor memory device includes a memory cell array, sub word-line drivers and power selection switches. The memory cell array includes memory cell rows coupled to word lines. The sub word line drivers are coupled to the word lines. The power selection switches are coupled to the sub word-line drivers. Each power selection switch controls a deactivation voltage level of a first word-line activated from the word-lines and an off-voltage level of a second word line adjacent to the first word line so that the deactivation voltage level and the off-voltage level have at least one of a ground voltage, a first negative voltage and a second negative voltage. The ground voltage, the first negative voltage and the second negative voltage have different voltage levels from each other.

Abstract: A memory controller includes a controller input/output circuit configured to output a first command to read first data, and output a second command to read an error corrected portion of the first data. A memory device includes: an error detector, a data storage circuit and an error correction circuit. The error detector is configured to detect a number of error bits in data read from a memory cell in response to a first command. The data storage circuit is configured to store the read data if the detected number of error bits is greater than or equal to a first threshold value. The error correction circuit is configured to correct the stored data.

Abstract: A memory core of a resistive type memory device includes at least a first resistive type memory cell coupled to a bit-line, a first resistance to voltage converter and a bit-line sense amplifier. The first resistance to voltage converter is coupled to the bit-line at a first node. The first resistance to voltage converter converts a resistance of the first resistive type memory cell to a corresponding voltage based on a read column selection signal. The bit-line sense amplifier is coupled to the bit-line at the first node and is coupled to a complementary bit-line at a second node. The bit-line sense amplifier senses and amplifies a voltage difference of the bit-line and the complementary bit-line in response to a sensing control signal.

Abstract: A semiconductor memory device includes a control logic and a memory cell array in which a plurality of memory cells are arranged. The memory cell array includes a plurality of bank arrays, and each of the plurality of bank arrays includes a plurality of sub-arrays. The control logic controls an access to the memory cell array based on a command and an address signal. The control logic dynamically sets a keep-away zone that includes a plurality of memory cell rows which are deactivated based on a first word-line when the first word-line is enabled. The first word-line is coupled to a first memory cell row of a first sub-array of the plurality of sub-arrays. Therefore, increased timing parameters may be compensated, and parallelism may be increased.

Abstract: A semiconductor memory device includes a memory cell array and a refresh control circuit. The refresh circuit is configured to: perform a second burst refresh operation on the memory cell rows after the memory cell rows exit from a self refresh operation, and not perform the second burst refresh operation on the memory cell rows after the memory cell rows exit from a self refresh operation. Whether the refresh control circuit performs or does not perform the second burst refresh operation is based on a comparison between an entering time for the self refresh operation of the memory cell rows and a reference time.

Abstract: A memory device includes a memory cell array, an intensively accessed row detection circuit, and a refresh control circuit. The memory cell array includes a plurality of memory cell rows. The intensively accessed row detection circuit generates an intensively accessed row address indicating an intensively accessed memory cell row among the plurality of memory cell rows based on an accumulated access time for each of the plurality of memory cell rows. The refresh control unit preferentially refreshes neighboring memory cell rows adjacent to the intensively accessed memory cell row indicated by the intensively accessed row address when receiving the intensively accessed row address from the intensively accessed row detection unit. The memory device effectively reduces a rate of data loss.

Abstract: Provided is a refresh method of a volatile memory device. The method includes: detecting a number of disturbances that affect a second memory area as the number of accesses to a first memory area is increased; outputting an alert signal from the volatile memory device to an outside of the volatile memory device when the detected number of disturbances reach a reference value; and performing a refresh operation on the second memory area in response to the alert signal.

Abstract: A semiconductor memory device and a self-refresh method of the semiconductor memory device. The semiconductor memory device includes: a memory cell array including one or more memory cells; a sense amplifier connected to a sensing line and a complementary sensing line and sensing/amplifying data stored in the one or more memory cells; and a sense amplifier control circuit sequentially supplying a first voltage and a second voltage having different levels to the sense amplifier through the sensing line during a refresh operation.

Abstract: A semiconductor memory device includes a memory cell array and a control logic. The memory cell array includes first and second sub arrays, the first sub array includes a first set of bank arrays, and the second sub array includes a second set of bank arrays. Each of the upper and lower bank arrays includes first and second portions having different timing parameters with respect to each other. The control logic controls access to the first and second portions such that read/write operation is performed on the first and second portions.

Abstract: The semiconductor memory device includes a memory cell array and an error correction code (ECC) circuit. The memory cell array is divided into a first memory region and a second memory region. Each of the first and second memory regions includes a plurality of pages each page including a plurality of memory cells connected to a word line. The ECC circuit corrects single-bit errors of the first memory region using parity bits. The first memory region provides a consecutive address space to an external device by correcting the single-bit errors using the ECC circuit and the second memory region is reserved for repairing at least one of a first failed page of the first memory region or a second failed page of the second memory region.

Abstract: In one embodiment, the memory device includes at least one memory bank including first and second subbanks, and control logic configured to control storing data into the memory bank. The control logic is configured to activate the first subbank and to precharge the second subbank in response to a first activate command for the first subbank.

Abstract: Provided is a refresh method of a volatile memory device. The method includes: detecting a number of disturbances that affect a second memory area as the number of accesses to a first memory area is increased; outputting an alert signal from the volatile memory device to an outside of the volatile memory device when the detected number of disturbances reach a reference value; and performing a refresh operation on the second memory area in response to the alert signal.

Abstract: Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.

Abstract: A memory system includes a memory controller to control a first memory device and a second memory device. The first and second memory devices are different in terms of at least one of physical distance from the memory controller, a manner of connection to the memory controller, error correction capability, or memory supply voltage. The first and second memory devices also have different latencies.

Abstract: A semiconductor memory device may include a plurality of data input/output DQ pads and a plurality of first and second memory cell arrays. Each path of a first set of data paths from each of the plurality of first memory cell arrays to a corresponding DQ pad is physically shorter than each path of a second set of data paths from each of the plurality of second memory cell arrays to the corresponding DQ pad. Each of the plurality of first memory cell arrays is a designated first-speed access cell array and each of the plurality of second memory cell arrays is a designated second-speed access cell array, the second-speed being slower than the first-speed. A size of the each of the plurality of first memory cell arrays is smaller than a size of the each of the plurality of second memory cell arrays.

Abstract: A memory controller includes a controller input/output circuit configured to output a first command to read first data, and output a second command to read an error corrected portion of the first data. A memory device includes: an error detector, a data storage circuit and an error correction circuit. The error detector is configured to detect a number of error bits in data read from a memory cell in response to a first command. The data storage circuit is configured to store the read data if the detected number of error bits is greater than or equal to a first threshold value. The error correction circuit is configured to correct the stored data.

Abstract: In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module.

Abstract: A semiconductor memory device includes at least one sense amplifier, a controller and a sense amplifier driver. The sense amplifier includes a PMOS sense amplifier and an NMOS sense amplifier configured to be respectively activated in response to a first supply voltage and a second supply voltage, and to sense and amplify a voltage difference between a corresponding bit line pair. The controller is configured to set an operating mode in response to an external command, to control activation timing of a PMOS drive activation signal and an NMOS drive activation signal according to the set operating mode, and to output the PMOS drive activation signal and the NMOS drive activation signal. The sense amplifier driver is configured to apply the first and second supply voltages to the PMOS and NMOS sense amplifiers, respectively, in response to the PMOS drive activation signal and the NMOS drive activation signal.

Abstract: Multi-bank semiconductor memory devices are provided having optimized memory block layouts and data line routing to enable chip size reduction and increase operating memory access speed.