Abstract: A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.

Abstract: A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.

Abstract: A sensor for detecting a physical variable, including: —a sensor element for outputting an electrical signal dependent on the physical variable, —a substrate carrying the sensor element, —a printed circuit board, conducting the electrical signal, on the substrate, and —an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, —wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.

Abstract: A component for a sensor having a sensor element and having an output interface for the outputting of an electrical signal, which is dependent on a physical variable, from the sensor element to the output interface, including—a circuit with at least one first signal path for receiving the electrical signal from the sensor element and for conducting the electrical signal to the output interface, and a second signal path, which differs from the first signal path, for conducting the electrical signal to the output interface,—wherein an activity of the first signal path or of the second signal path is dependent on a position of the component in the sensor.

Abstract: A sensor for outputting an electrical signal on the basis of a detected physical variable, including: a measuring circuit accommodated in a circuit housing and capable of contacting an external circuit by an electric signal connection; and a protective body consisting of a protective compound with an opening, the compound surrounding the circuit housing and the opening exposing part of the circuit housing. The surface of the circuit housing has a moulded element which is surrounded by the protective compound.

Abstract: The invention relates to a circuit for conducting an electric current, by an electrical component, between a vehicle battery and an electrical network component that can be connected to the vehicle battery. The circuit includes a first electrical line segment and a second line segment that is separated from the first line segment by a spacer. The line segments are connected to one another by the electrical component.

Abstract: A method for producing a sensor which is equipped to detect a physical field as a function of a dimension to be measured using a measuring sensor and to emit an electrical output signal based on the detected physical field via a data cable, including:—placing the measuring sensor and the data cable on a mould defining the position of the measuring sensor and the data cable,—Coating the measuring sensor and the data cable positioned in the mould with a first material,—Removing the measuring sensor and data cable coated with the first material from the mould, and—Coating the measuring sensor and data cable removed from the mould and coated with the first material with a second material.

Abstract: Production method for an electronic module, comprising a housing and at least one electronic assembly, wherein the electronic assembly is arranged, in particular at least partially, in an interior chamber of the housing, wherein, however, electrical contacts are guided through the housing wall, out of the interior chamber of the housing, to an outer face of the housing, wherein the interior chamber of the housing is filled with a casting compound at least in such a way that the casting compound covers passage points in the housing wall at which the electrical contacts are guided through the housing wall, wherein a layer of the at least one assembly is removed at least in the region of the passage points in the housing wall.

Abstract: A method for producing a sensor includes a circuit carrier which includes an assembly island which supports a sensor circuit for emitting a sensor signal dependent on a physical transmitting field, and an interface which is electrically connected to the assembly island and which transmits the sensor signal to a superordinate signal processing device. The method includes: Enveloping one part of the circuit carrier containing the assembly island and the sensor circuit in a first protective compound; connecting a signal transmission element to the interface; enveloping at least one part of the first protective compound and the interface to at least one part of the signal transmission element connected thereto in a second protective compound.

Abstract: A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Abstract: A wiring device for wiring an electronic apparatus including an interface, a conductor track and a component fitting island that is connected to the interface via the conductor track that is set up to carry an electronic component and to make electrical contact with the interface via the electrical conductor track, wherein the component fitting island is free of a web element that is set up to hold the component fitting island on a support element during a housing process housing the component fitting island.

Abstract: A sensor having at least one sensor element (1), at least one signal processing element (2), and a housing (7) which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means (4) on which the at least one sensor element (1) and the signal processing element (2) are arranged and are electrically connected to the carrier means. The carrier means (4) is also at least electrically connected to the electrical interface.

Abstract: An electronic chip is disclosed, including at least one electronic circuit and two or more contact-making pins, wherein the chip additionally has at least one fixing pin. A sensor arrangement is also disclosed for detecting at least one physical or chemical variable relating to a carrier. The sensor arrangement has at least one sensor element which is directly or indirectly coupled to the carrier, and also has an electronic interface arrangement with at least one leadframe, at least one electronic circuit connected to the leadframe, and also at least one electrically insulating housing part which is embodied in such a way that it performs at least one of the functions of (i) at least partly enclosing the at least one electronic circuit, and (ii) mechanically supporting at least parts of the leadframe to one another.

Abstract: The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.

Abstract: An electronic device including: an electronic unit accommodated in a circuit housing and a molded body which surrounds the circuit housing. The molding compound has a cut-out that exposes the circuit housing, in which cut-out an identification that characterizes the electronic circuit is arranged.

Abstract: A circuit board (4) for connecting a deformation sensor (16, 18), which is provided on a radial outer side of a rolling bearing outer ring (6), to a signal-processing circuit (28), the circuit board including—a cylindrical support plate (20) having a cylinder opening in which the rolling bearing outer ring (6) can be accommodated concentrically to said cylindrical support plate (20), —an electrical contact pad (22) on the cylindrical support plate (20) for electrical contacting with the deformation sensor (16, 18) and—an electrical strip conductor (26) which is electrically connected to the electrical contact pad (22) and is designed to receive signals from the deformation sensor (16, 18) and convey them to the signal-processing circuit (28).

Abstract: A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: An electronic device including: an electronic circuit accommodated in a circuit housing having a first thermal expansion coefficient, and a moulded body which surrounds the circuit housing, the body having a second thermal expansion coefficient that differs from the first thermal expansion coefficient. The moulded body is fixed to the circuit housing at least at two different mutually spaced fixing points on the circuit housing.

Abstract: A circuit board (4) for connecting a deformation sensor (16, 18), which is provided on a radial outer side of a rolling bearing outer ring (6), to a signal-processing circuit (28), the circuit board including—a cylindrical support plate (20) having a cylinder opening in which the rolling bearing outer ring (6) can be accommodated concentrically to said cylindrical support plate (20), —an electrical contact pad (22) on the cylindrical support plate (20) for electrical contacting with the deformation sensor (16, 18) and—an electrical strip conductor (26) which is electrically connected to the electrical contact pad (22) and is designed to receive signals from the deformation sensor (16, 18) and convey them to the signal-processing circuit (28).