Abstract: The present invention relates to wastewater treatment facilities, and more particularly to an improved membrane bioreactor for treatment of wastewater. In one embodiment, a membrane bioreactor for treatment of wastewater includes first and second anoxic basins for anoxic treatment of such wastewater, and first and second aerobic basins for aerobic treatment of such wastewater. The bioreactor also includes a first flow path connecting the first anoxic basin and the first aerobic basin, and a second flow path connecting the second anoxic basin and the second aerobic basin, for flow of the wastewater from the respective anoxic basin into the respective aerobic basin. The bioreactor also includes a membrane chamber with a plurality of membrane tanks, the membrane chamber being arranged in series with the aerobic basins, and the membrane tanks being arranged in parallel with each other, and third and fourth flow paths connecting the membrane chamber to the first and second aerobic basins.

Abstract: The present invention relates to wastewater treatment facilities, and more particularly to an improved membrane bioreactor for treatment of wastewater. In one embodiment, a membrane bioreactor for treatment of wastewater includes first and second anoxic basins for anoxic treatment of such wastewater, and first and second aerobic basins for aerobic treatment of such wastewater. The bioreactor also includes a first flow path connecting the first anoxic basin and the first aerobic basin, and a second flow path connecting the second anoxic basin and the second aerobic basin, for flow of the wastewater from the respective anoxic basin into the respective aerobic basin. The bioreactor also includes a membrane chamber with a plurality of membrane tanks, the membrane chamber being arranged in series with the aerobic basins, and the membrane tanks being arranged in parallel with each other, and third and fourth flow paths connecting the membrane chamber to the first and second aerobic basins.

Abstract: A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: A lid for a wafer-scale package includes a body having a bond area around a cavity defined by the body, an oxide layer atop the bond area and the cavity, and a reflective layer atop the oxide layer. The cavity has an angled sidewall where a portion of the reflective layer over the angled sidewall forms a mirror for reflecting a light. The lid further includes a solder layer atop another portion of the reflective layer over the bond area, and a barrier layer atop the mirror. The barrier layer is solder non-wettable so it prevents the solder layer from wicking into the cavity and interfering with the mirror. The barrier layer is also transparent to the light and has a thickness that either does not affect the light reflection or improves the light reflection.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

Abstract: A modular system for treating wastewater is designed having different phases. In an initial phase, plural tanks are provided, including at least one reactor and digester tank. In a subsequent phase, at least one of the tanks is converted into a different type of tank, and additional new tanks are provided to accommodate larger quantities of wastewater. In one embodiment, conversion of at least one of the tanks is accomplished by removing a temporary wall from a digester tank to create another reactor tank.

Abstract: A modular system for treating wastewater is designed having different phases. In an initial phase, plural tanks are provided, including at least one reactor and digester tank. In a subsequent phase, at least one of the tanks is converted into a different type of tank, and additional new tanks are provided to accommodate larger quantities of wastewater. In one embodiment, conversion of at least one of the tanks is accomplished by removing a temporary wall from a digester tank to create another reactor tank.

Abstract: A heat bond seaming tape has a base formed of a sheet of paper or a paper-like material and an overlying strip of an open mesh material. A plurality of transversely spaced, longitudinally extending beads of a hot melt thermoplastic adhesive material is placed on a top surface of the mesh for adhering the tape to the backs of adjacent carpet edges. A strip of a polyolefin such as a semi-rigid high density polyethylene material is sandwiched between the base sheet and the strip of open mesh material and extends longitudinally along the center of the strip and extends transversely across the carpet seam to prevent seam buckling. The base sheet and reinforcing strip can be extruded as an integral one piece member of the high density polyethylene prior to being joined with the mesh and hot melt adhesive.

Abstract: A method for flip-chip bonding an integrated circuit die to a substrate. The method includes the steps of providing the integrated circuit die with at least one gold bump, forming a barrier layer on the gold bump, forming a bronzing agent on the barrier layer, and providing the substrate with at least one conductive bonding area, which is also covered with gold. The bronzing agent on the integrated circuit die is then aligned on the conductive bonding area, and a compression force is applied to the die and substrate so as to establish contact between the bronzing agent and the conductive bonding area. While maintaining position between the gold bump and conductive bonding area, the structure is alloyed such that the bronzing agent and the gold on the conductive bonding area form an intermetallic compound, thereby forming a bond between the die and the substrate. The barrier layer functions to prevent the bronzing agent from diffusing with the gold bump.

Abstract: A heat bond seaming tape has a base formed of a strip of paper or a paper-like material and an overlying strip of an open mesh material. A plurality of transversely spaced, longitudinally extending beads of a hot melt thermoplastic adhesive material is placed on a top surface of the mesh for adhering the tape to the backs of adjacent carpet edges. A strip of a rigid thermoplastic material is sandwiched between the base strip and the strip of open mesh and extends longitudinally along the center of the strip and extends transversely across the carpet seam to prevent seam buckling. The plastic strip is formed by a plurality of separate or flexibly connected hard plastic members to enable the tape to be formed into a roll for transportation and storage. The invention also relates to the method of forming the improved heat bond seaming tape.

Abstract: A bipolar transistor having an emitter, a base, and a collector includes an intrinsic base region having narrow side areas and a wider central area. The side areas are located adjacent to the extrinsic base region, while the central area is disposed underneath the emitter. The lateral doping profile of the base is tailored so that the doping concentrations in the extrinsic region and the central area are relatively high compared to the doping concentration of the narrow side areas of the intrinsic base. The combination of the narrow side areas and the lateral base doping profile constrains the depletion region within the base thereby lowering punch-through voltage of the transistor without loss of beta.