Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A die-stacked hybrid memory device implements a first set of one or more memory dies implementing first memory cell circuitry of a first memory architecture type and a second set of one or more memory dies implementing second memory cell circuitry of a second memory architecture type different than the first memory architecture type. The die-stacked hybrid memory device further includes a set of one or more logic dies electrically coupled to the first and second sets of one or more memory dies, the set of one or more logic dies comprising a memory interface and a page migration manager, the memory interface coupleable to a device external to the die-stacked hybrid memory device, and the page migration manager to transfer memory pages between the first set of one or more memory dies and the second set of one or more memory dies.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A system and method are disclosed for managing memory interleaving patterns in a system with multiple memory devices. The system includes a processor configured to access multiple memory devices. The method includes receiving a first plurality of data blocks, and then storing the first plurality of data blocks using an interleaving pattern in which successive blocks of the first plurality of data blocks are stored in each of the memory devices. The method also includes receiving a second plurality of data blocks, and then storing successive blocks of the second plurality of data blocks in a first memory device of the multiple memory devices.

Abstract: An integrated circuit (IC) package includes a stacked-die memory device. The stacked-die memory device includes a set of one or more stacked memory dies implementing memory cell circuitry. The stacked-die memory device further includes a set of one or more logic dies electrically coupled to the memory cell circuitry. The set of one or more logic dies includes a query controller and a memory controller. The memory controller is coupleable to at least one device external to the stacked-die memory device. The query controller is to perform a query operation on data stored in the memory cell circuitry responsive to a query command received from the external device.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: Some die-stacked memories will contain a logic layer in addition to one or more layers of DRAM (or other memory technology). This logic layer may be a discrete logic die or logic on a silicon interposer associated with a stack of memory dies. Additional circuitry/functionality is placed on the logic layer to implement functionality to perform various computation operations. This functionality would be desired where performing the operations locally near the memory devices would allow increased performance and/or power efficiency by avoiding transmission of data across the interface to the host processor.

Abstract: A base station (103) assigns a set of mobile stations (101) to a group wherein the group will share a set of radio resources (770). A shared control channel information element (501) is sent to the group of mobile stations (101) and provides a bitmap having fields for group ordering (511), resource allocations (530), continuation resources (540) for HARQ, and an ordering pattern (513). If a mobile station requires retransmission it will access the resources indicated by the continuation resources field (54) in order to receive data. The HARQ blocks may be assigned to a mobile station based upon an index (601) which may correspond to the mobile station vocoder rate. Further, HARQ subgroups may be defined to associate subgroups of mobile stations with specific HARQ transmission opportunities on the super-frame and allocated by a rotating bitmap.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: The described embodiments comprise a selection mechanism that selects a resource from a set of resources in a computing device for performing an operation. In some embodiments, the selection mechanism performs a lookup in a table selected from a set of tables to identify a resource from the set of resources. When the resource is not available for performing the operation and until another resource is selected for performing the operation, the selection mechanism identifies a next resource in the table and selects the next resource for performing the operation when the next resource is available for performing the operation.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A method of way prediction for a data cache having a plurality of ways is provided. Responsive to an instruction to access a stack data block, the method accesses identifying information associated with a plurality of most recently accessed ways of a data cache to determine whether the stack data block resides in one of the plurality of most recently accessed ways of the data cache, wherein the identifying information is accessed from a subset of an array of identifying information corresponding to the plurality of most recently accessed ways; and when the stack data block resides in one of the plurality of most recently accessed ways of the data cache, the method accesses the stack data block from the data cache.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A processing system comprises one or more processor devices and other system components coupled to a stacked memory device having a set of stacked memory layers and a set of one or more logic layers. The set of logic layers implements a metadata manager that offloads metadata management from the other system components. The set of logic layers also includes a memory interface coupled to memory cell circuitry implemented in the set of stacked memory layers and coupleable to the devices external to the stacked memory device. The memory interface operates to perform memory accesses for the external devices and for the metadata manager. By virtue of the metadata manager's tight integration with the stacked memory layers, the metadata manager may perform certain memory-intensive metadata management operations more efficiently than could be performed by the external devices.

Abstract: A method and device for reducing power during an instruction lane divergence includes idling an inactive execution lane during the lane divergence.

Abstract: A die-stacked hybrid memory device implements a first set of one or more memory dies implementing first memory cell circuitry of a first memory architecture type and a second set of one or more memory dies implementing second memory cell circuitry of a second memory architecture type different than the first memory architecture type. The die-stacked hybrid memory device further includes a set of one or more logic dies electrically coupled to the first and second sets of one or more memory dies, the set of one or more logic dies comprising a memory interface and a page migration manager, the memory interface coupleable to a device external to the die-stacked hybrid memory device, and the page migration manager to transfer memory pages between the first set of one or more memory dies and the second set of one or more memory dies.

Abstract: A facility for automated modelling of the cutting process for a particular material to be cut by a beam cutting tool, such as a waterjet cutting system, from empirical data to predict aspects of the waterjet's effect on the workpiece across a range of material thicknesses, across a range of cutting geometries, and across a range of cutting quality levels, all of which may be broader than, and independent of the actual requirements for a target workpiece, is described.

Abstract: A waterjet system in accordance with a particular embodiment includes a pressurizing device configured to pressurize a fluid, a cutting head downstream from the pressurizing device, and a catcher positioned to collect a jet from the cutting head. The system can further include a treatment assembly configured to treat a feed fluid to the pressurizing device and/or a byproduct fluid from the catcher, such as by removing submicron colloidal particles from the feed fluid and/or from the byproduct fluid. For example, the treatment assembly can include a coagulation unit, such as a chemical coagulation unit or an electrocoagulation unit, configured to coagulate the submicron colloidal particles. The pressurizing device, the cutting head, and the treatment assembly can be at different respective portions of a fluid-recycling loop.