Abstract: A micro-electro mechanical system includes a flexure, wherein the flexure is made of an amorphous material. Similarly, a method for forming a micro-electro mechanical system includes forming a substrate, and forming an amorphous flexure, the amorphous flexure being coupled to the substrate.

Abstract: A micro-electro mechanical light modulator device includes a movable reflective plate, a fixed partial reflective plate, an optical gap defined between the reflective plate and the fixed plate, and an actuator configured to move the reflective plate through an operating range wherein a neutral state position of the reflective plate approximately corresponds to a black state value of the optical gap.

Abstract: A micro-electromechancial system has a moveable element supported by a flexure, the flexure being formed of a substitutionally alloyed intermetallic compound. The substitutionally alloyed intermetallic compound includes a base intermetallic compound having a major component and a minor component; and at least one of a first substituent and a second substituent. The first and second substituents are substituted coherently for the major and minor components of the base intermetallic compound, respectively, in amounts sufficient to reduce creep in the resulting substitutionally alloyed intermetallic compound without substantially modifying the crystalline structure of the base intermetallic compound.

Abstract: A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.

Abstract: A micro-electro mechanical system includes a flexure, wherein the flexure is made of an amorphous material. Similarly, a method for forming a micro-electro mechanical system includes forming a substrate, and forming an amorphous flexure, the amorphous flexure being coupled to the substrate.

Abstract: A storage device having a read/write mechanism including a cantilever portion. The cantilever portion includes a non-single-crystal silicon body portion and a single crystal silicon tip.

Abstract: A light modulator includes a first enclosed portion that includes a first electrode within a light path, a first electrode outside the light path, and a first colorant in communication with the first electrode within the light path and the first electrode outside the light path. The first inner electrode, the first outer electrode and the first colorant is within the first enclosed portion and includes a device for moving the first colorant between a position within the light path and outside the light path.

Abstract: A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate contact with the induction micro-heaters. An alternating magnetic field is generated to induce a current in the induction micro-heaters, to form one or more bonds between the first substrate and the second substrate.

Abstract: A display device includes a base and light valve components formed over the base. The base includes electrical circuitry. Each of the light valve components includes a chamber that defines an optical path, particles within the chamber, and a mechanism for transversely repositioning the particles in relation to the optical path in response to voltages provided by the electrical circuitry.

Abstract: An electronic device for at least partially displaying a pixel of an image, the device comprising first and second reflectors defining an optical cavity therebetween, the optical cavity being selective of an electromagnetic wavelength at an intensity by optical interference, the device having a concentric control structure comprising at least an inner and an outermost electrode, the optical cavity being controlled only by the inner electrode.

Abstract: A structured material is transferred to a substrate. A release film is applied to a carrier. A material is deposited on a surface of the release film. The material is processed to form the structured material. The structured material is coupled to the substrate. The release film is exposed to reduce adhesion strength between the release film and the carrier, and the carrier and the release film are removed from the structured material.

Abstract: An electronic device, including first and second conductive pads, and a first plurality of electrically conductive beams substantially parallel to each other. Each beam has a mesial region having a beam resistance, and first and second end regions extending from the mesial region to the respective first and second conductive pads. Each end region includes an end resistance less than the beam resistance.

Abstract: A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.

Abstract: A device including a substrate, a getter structure coupled to the substrate, and a photomask disposed over the getter structure. The photomask has a substantially transmissive and a substantially non-transmissive region. The substantially transmissive region substantially aligns with the getter structure.

Abstract: A method of activating a getter structure, including illuminating a photomask having a transmissive region substantially aligned with the getter structure, transmitting a portion of the photons through, the transmissive region. In addition the method includes absorbing the photons, transmitted through the transmissive region, in the getter structure and heating the getter structure with the absorbed photons.