Abstract: Interconnect structures suitable for use in connecting anode-illuminated detector modules to downstream circuitry are disclosed. In certain embodiments, the interconnect structures are based on or include low atomic number or polymeric features and/or are formed at a density or thickness so as to minimize or reduce radiation attenuation by the interconnect structures.

Abstract: A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.

Abstract: A detector module for an imaging system, such as a CT system, and a method for fabricating the same are presented. The detector module includes an array of direct conversion sensors, the direct conversion sensors having a first side and a second side. The first side of the direct conversion sensors includes a segmented electrode side forming an array of pixels that receive radiation and convert the received radiation into corresponding charge signals, whereas the second side includes a common electrode side. The detector module also includes a readout electronic circuitry coupled to one or more of the direct conversion sensors where the readout electronic circuitry is configured to be shielded from the radiation. In addition, the detector module includes a bias voltage circuitry coupled to the one or more direct conversion sensors on the second side.

Abstract: A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array.

Abstract: An electronic assembly is provided. The assembly comprises a substrate having a plurality of conductive contacts disposed on a surface of the substrate. The substrate comprises a dielectric material. The assembly comprises a detector having a plurality of conductive contacts disposed on a surface of the detector which is adjacent to the surface of the substrate. At least one compliant interconnect is disposed between the substrate and the detector. The conductive contacts of the substrate and the conductive contacts of the detector are in electrical communication with the compliant interconnect via a conductive epoxy. The compliant interconnect comprises a polymer core having an electrically conductive outer surface. In certain embodiments, the assembly comprises an interposer. In certain embodiments, an under-fill is disposed between the surface of the substrate and the surface of the detector.

Abstract: A scintillator array and method for making the same are provided. The array comprises a bi-layer reflector further comprising a conformal smoothing layer and a mirror layer. The bi-layer reflector does not comprise an intervening reducing agent or adhesion layer and/or comprises aluminum. Further, the mirror layer may be deposited via gas phase metallization, allowing application to tightly confined spaces. A detector array comprising the scintillator array is also provided.

Abstract: A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board.

Abstract: An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.

Abstract: A CT detector includes a direct conversion material configured to generate electrical charge upon reception of x-rays, a plurality of metallized anodes configured to collect electrical charges generated in the direct conversion material, at least one readout device, and a redistribution layer having a plurality of electrical pathways configured to route the electrical charges from the plurality of metallized anodes to the at least one readout device. A plurality of switches is coupled to the plurality of electrical pathways between the plurality of metallized anodes and the at least one readout device, wherein each of the plurality of switches includes an input line electrically coupled to one of the plurality of metallized anodes, a first output node electrically coupled to the at least one readout device, and a second output node electrically coupled to at least one other switch of the plurality of switches.

Abstract: Methods of fabricating a tiled transducer array are disclosed. Embodiments of the methods include fabricating a wafer comprising a plurality of transducers, dicing the wafer to form individual transducers, testing the individual transducers to identify a plurality of known good transducers, preparing a substrate having a front side and a backside wherein the backside of the substrate comprises a plurality of connectors, positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array, and electrically coupling the connectors on the substrate to the plurality of known good transducers, wherein the connectors are arranged such that each of the plurality of known good transducers may be electrically coupled to an electronic device disposed on the backside of the substrate, through a respective one or more of the plurality of connectors.

Abstract: A CT detector includes a first detector configured to convert radiographic energy to electrical signals representative of energy sensitive radiographic data and a second detector configured to convert radiographic energy to electrical signals representative of energy sensitive radiographic data and positioned to receive x-rays that pass through the first detector. A logic controller is electrically connected to the first detector and the second detector and is configured to receive a logic output signal from the second detector indicative of an amount of a saturation level of the first detector, compare the logic output signal to a threshold value, and output, based on the comparison, electrical signals from the first detector, the second detector, or a combination thereof to an image chain.

Abstract: A detector module for a CT imaging system is provided. The detector module includes a sensor element to convert x-rays to electrical signals. The sensor element is coupled to a data acquisition system (DAS) via an interconnect system, the DAS comprised of an electronic substrate and an integrated circuit. The interconnect system couples the sensor element, electronic substrate, and integrated circuit by way of a contact pad interconnect together with a wire bond interconnect or an additional contact pad interconnect.

Abstract: An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

Abstract: A method for making an interconnect is provided. The method includes depositing a conductive layer on a substrate, depositing a protective layer on the conductive layer, patterning the protective layer to form openings to the conductive layer, depositing contact pads on the conductive layer through the openings in the protective layer, the contact pads comprising a conductive material, and patterning the conductive layer and the protective layer to form electrical traces on the substrate.

Abstract: A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a first electronic device disposed on the front side of the first substrate. In addition, the stacked electronics module comprises a second layer including a second substrate having a front side and a backside, a second electrical interconnect layer disposed on the second substrate and a second electronic device disposed on the front side of the second substrate.

Abstract: A CT detector includes a direct conversion material configured to generate electrical charge upon reception of x-rays, a plurality of metallized anodes configured to collect electrical charges generated in the direct conversion material, at least one readout device, and a redistribution layer having a plurality of electrical pathways configured to route the electrical charges from the plurality of metallized anodes to the at least one readout device. A plurality of switches is coupled to the plurality of electrical pathways between the plurality of metallized anodes and the at least one readout device, wherein each of the plurality of switches includes an input line electrically coupled to one of the plurality of metallized anodes, a first output node electrically coupled to the at least one readout device, and a second output node electrically coupled to at least one other switch of the plurality of switches.

Abstract: An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.

Abstract: A detector assembly is presented. The detector assembly includes a first detector layer having a top side and a bottom side, where the first detector layer includes a plurality of first coupling gaps. Additionally, the detector assembly includes a first interconnect structure operationally coupled to the first detector layer and configured to facilitate transfer of a first set of image data from the first detector layer to backplane electronics. The detector assembly also includes a second detector layer having a top side and a bottom side and disposed adjacent the bottom side of the first detector layer, where the second detector layer includes a plurality of second coupling gaps configured to facilitate passage of the first interconnect structure from the first detector layer to the backplane electronics.

Abstract: Methods of fabricating a tiled transducer array are disclosed. Embodiments of the methods include fabricating a wafer comprising a plurality of transducers, dicing the wafer to form individual transducers, testing the individual transducers to identify a plurality of known good transducers, preparing a substrate having a front side and a backside wherein the backside of the substrate comprises a plurality of connectors, positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array, and electrically coupling the connectors on the substrate to the plurality of known good transducers, wherein the connectors are arranged such that each of the plurality of known good transducers may be electrically coupled to an electronic device disposed on the backside of the substrate, through a respective one or more of the plurality of connectors.

Abstract: A spirally-wound inductor having a tapered conductor. The height of the conductor increases from a smaller height near the center of the inductor to a greater height at the outer edge of the inductor. A spherically-shaped inductor and methods for manufacturing the spherically-shaped inductor. The spherically-shaped inductor has a series of coils that increase in diameter from each end toward the middle.