Abstract: An imaging system for generating an image of an object is provided. The imaging system comprises an X-ray source disposed in a spatial relationship to the object configured to transmit X-ray radiation through the object. The system further comprises at least one X-ray detecting media configured to convert the X-ray radiation transmitted through the object to optical signals. In addition, the system comprises an optical transmission conduit comprising a first end and a second end and an optical detector configured to convert optical signals to corresponding electrical signals. The first end of the optical transmission conduit is coupled to the X-ray detection device and the second end coupled to the optical detector.

Abstract: A detector module for a CT imaging system is provided. The detector module includes a sensor element to convert x-rays to electrical signals. The sensor element is coupled to a data acquisition system (DAS) via an interconnect system, the DAS comprised of an electronic substrate and an integrated circuit. The interconnect system couples the sensor element, electronic substrate, and integrated circuit by way of a contact pad interconnect together with a wire bond interconnect or an additional contact pad interconnect.

Abstract: An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

Abstract: A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connectors disposed on the backside of the substrate where the connectors are electrically coupled to the transducer elements. Further, a stacked transducer array comprising an electronic device disposed in a first layer, a substrate including a front side and a backside, an electrical interconnect layer disposed on the substrate and a plurality of transducers disposed in a third layer where the transducers are electrically coupled to the electronic device disposed in the first layer.

Abstract: An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package mounted on the sensor array. The package provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package supportingly adjoins the sensor array and provides a plurality of interfaces for interconnecting to at least one integrated circuit in the package a plurality of signals from the sensor array having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.

Abstract: A detector assembly is presented. The detector assembly includes a first detector layer having a top side and a bottom side, where the first detector layer includes a plurality of first coupling gaps. Additionally, the detector assembly includes a first interconnect structure operationally coupled to the first detector layer and configured to facilitate transfer of a first set of image data from the first detector layer to backplane electronics. The detector assembly also includes a second detector layer having a top side and a bottom side and disposed adjacent the bottom side of the first detector layer, where the second detector layer includes a plurality of second coupling gaps configured to facilitate passage of the first interconnect structure from the first detector layer to the backplane electronics.

Abstract: An interface circuit for a sensor array is provided. The interface circuit may be made up of an integrated circuit package that provides a first region and a second region. The first region may be spaced apart and opposite to the second region of the package. The first region of the package may provide a plurality of interfaces for interconnecting to an integrated circuit in the package a plurality of signals from the sensor array and having a first electrical characteristic, such as analog and test signals. The second region of the package may provide a plurality of interfaces for interconnecting to the integrated circuit a plurality of signals having at least one electrical characteristic different than the first characteristic, such as power and operational digital signals.

Abstract: An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.

Abstract: Active optical alignment of plastic chip-scale-package (450) laser and photo detecting diode devices (420) is provided by use of an active probe (120) to make alignment structures (300), such as précising holes, that are used to align the optical device (420) into a transmit/receive module. An optical connector (140), such as an optical fiber, transmits light to, or receives light from, the optical device (420). Using an electrical contact (115, 120), laser diode devices are lighted or photo detecting diode devices are electrically interfaced. The optical connector (140) steps to, locates and contacts each optical device on a fabricated frame of multiple devices. The optical connector (140) is manipulated to an optimal coupling position where the best signal, either optical or electrical, is obtained. An optimal position for making the précising holes, e.g., using a machining laser, is determined as an offset from the optimal position of the optical connector.

Abstract: A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect is disposed around an outer surface of the substrate piece.

Abstract: A detector array kit that includes at least one sensor array. The sensor array has an active side at least one sensor on the flat active side configured to detect a particular form of energy. The sensor array active side has a positioning structure on the active side that is essentially transparent to the particular form of energy. The positioning structure includes a plurality of spaced compressible posts or tubes configured to compressively and frictionally engage with a complementary mounting structure. The detector kit further includes a complementary mounting structure essentially transparent to the particular form of energy.

Abstract: An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter defining at least one etch stop opening; a cured adhesive on a portion of the dielectric layer, the adhesive not present in an area aligned with the at least one etch stop; and at least one electrical device being attached to the dielectric layer by the adhesive such that an active area of the at least one electrical device is aligned with the etch stop perimeter. The active area of the at least one electrical device may further be aligned with at least one predetermined area defined by an optional additional portion of cured adhesive, the additional portion of the cured adhesive being adhesively attached to the dielectric layer and not adhesively attached to the at least one electrical device.

Abstract: A two-stage valve for controlling the flow of fluid from a pressurized fluid supply with an upper main body including a cavity with a contoured inner surface; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A first valve opens and closes the flow of gas from the pressurized gas supply to the cavity. A second valve allows the pressure in the cavity to exhaust to the environment. Raising and lowering of the pressure in the cavity causes the pre-stressed diaphragm to open and close the flow of gas from the pressurized gas supply through the primary flow path of the two-stage valve. The design is suitable as a microvalve using Micro-Electro-Mechanical Systems (MEMS) concepts.

Abstract: Active optical alignment of plastic chip-scale-package (450) laser and photo detecting diode devices (420) is provided by use of an active probe (120) to make alignment structures (300), such as précising holes, that are used to align the optical device (420) into a transmit/receive module. An optical connector (140), such as an optical fiber, transmits light to, or receives light from, the optical device (420). Using an electrical contact (115, 120), laser diode devices are lighted or photo detecting diode devices are electrically interfaced. The optical connector (140) steps to, locates and contacts each optical device on a fabricated frame of multiple devices. The optical connector (140) is manipulated to an optimal coupling position where the best signal, either optical or electrical, is obtained. An optimal position for making the précising holes, e.g., using a machining laser, is determined as an offset from the optimal position of the optical connector.

Abstract: A method and process sequence for accurately aligning (die to interconnect metal on flex substrate such as polyimide flex is described. A mask for via formation is first patterned in a metal layer on the bottom surface of the flex substrate. Die attach means such as die attach adhesive is then applied to the top side of flex substrate. The bond pads on die are locally, adaptively aligned to the patterned metal via mask on the flex with high accuracy. Vias down to the die bond pads are then created by either plasma etching or excimer laser ablation through the existing aligned metal mask on the flex substrate, and interconnect metal is then deposited, patterned and etched. As a result of this process, the flex metal interconnect artwork does not have to be customized for each die misplacement using “adaptive lithography”. Lower cost commercially available lithography equipment can be used for processing, reducing capital equipment and processing cost.

Abstract: An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter defining at least one etch stop opening; a cured adhesive on a portion of the dielectric layer, the adhesive not present in an area aligned with the at least one etch stop; and at least one electrical device being attached to the dielectric layer by the adhesive such that an active area of the at least one electrical device is aligned with the etch stop perimeter. The active area of the at least one electrical device may further be aligned with at least one predetermined area defined by an optional additional portion of cured adhesive, the additional portion of the cured adhesive being adhesively attached to the dielectric layer and not adhesively attached to the at least one electrical device.

Abstract: A chip-on-flex HDI module is fabricated by dispensing encapsulant material onto the components of a populated dielectric film or sheet in an interrupted pattern which leaves the backsides of selected components free of encapsulant. The dispensing is accomplished by relative motion of the dispenser tip and the populated film, with the dispenser tip at a height slightly above the desired liquid fill height during dispensing. At the locations of the components which are to be free of encapsulant, the dispensing stops, and the tip may be raised to prevent residual viscous matter on the dispenser tip from contacting the backside of the exposed component.

Abstract: A method for fabricating a substantially transparent polymer substrate for an anti-scatter x-ray grid for medical diagnostic radiography includes positioning a phase mask between the substrate and a high power laser; providing a laser beam from the laser; conditioning the laser beam; ablating a first portion the substrate through the phase mask with the conditioned laser beam; and moving the substrate; and ablating a second portion of the substrate through the phase mask with the conditioned laser beam.

Abstract: A system and method for the direct inspection of an optical module. The system includes an optical receiver and/or an optical transmitter, an alignment means precisely dimensioned to interface with a predetermined optical coupling device, and electrical connection means operative to energize an optical coupling device or to receive an electrical output from an optical coupling device. These components may be integrated into a testing probe head. To inspect, the optical module is optically interfaced using precisely dimensioned alignment means, electrically interfacing the optical coupling device to energize the optical coupling device and/or to receive an electrical output from said predetermined optical coupling device. Further, the optical module is either electrically energized and the optical output measures, or optically energized and the electrical output measured. The measured optical or electrical output is compared to the expected output based on the electrical or optical energy applied.

Abstract: UV reflectors incorporated in UV LED-based light sources reduce the amount of UV radiation emission into the surroundings and increase the efficiency of such light sources. UV reflectors are made of nanometer-sized particles having a mean particle diameter less than about one-tenth of the wavelength of the UV light emitted by the UV LED, dispersed in a molding or casting material surrounding the LED. Other UV reflectors are series of layers of materials having alternating high and low refractive indices; each layer has a physical thickness of one quarter of the wavelength divided by the refractive index of the material. Nanometer-sized textures formed on a surface of the multilayered reflector further reduce the emission of UV radiation into the surroundings. UV LED-based light sources include such a multilayered reflector disposed on an encapsulating structure of a transparent material around a UV LED, particles of a UV-excitable phosphor dispersed in the transparent material.