Abstract: The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract: A method for connecting a flexible printed circuit board (PCB) to a printhead assembly that includes a printhead carrier and an ink ejection printhead carried by the carrier.

Abstract: The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier.

Abstract: The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: A pagewidth printhead assembly includes a plurality of printhead integrated circuits linked end to end across a width of the pagewidth printhead assembly; a support molding to which the plurality of printhead integrated circuits are sealed, the support molding defining a plurality of ink channels; a plurality of etched channels provided on an underside of each printhead integrated circuit, each etched channel defining along a length thereof a plurality of ink inlets for receiving ink from one of the plurality of ink channels; and a polymer sealing film for sealing the printhead integrated circuits to the support molding, the polymer sealing film defining therethrough a plurality of openings. Each of the plurality of etched channels is divided into two or more separate channel sections separated by respective channel wall structures. Each opening of the polymer film is in fluid communication with ink inlets of two separate channel sections.

Abstract: Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base.

Abstract: This invention provides for a test stage for a printhead integrated circuit tester for testing operation of printhead integrated circuits mounted on a carrier. The test stage includes a support structure. A fixture is arranged on the support structure and is configured to receive and locate the carrier. A clamping mechanism is arranged on the fixture. The clamping mechanism has at least one clamp assembly for clamping the carrier to the test stage. A controller controls operation of the clamping mechanism.

Abstract: A method of sealing an attachment face of a MST device to a mounting surface on a support member, the attachment face having an aperture connected to a first fluid conduit, the attachment face having a second aperture connected to a second conduit, the method comprising the steps of: applying a thermosetting adhesive to the mounting surface; aligning the first aperture with at least part of the second aperture; pressing the MST device and the mounting surface together; and, curing the thermosetting adhesive; wherein, the thermosetting adhesive has a viscosity of between 100 centiPoise and 10,000,000 centiPoise. Using a thermosetting adhesive instead of a thermoplastic adhesive provides a far more reliable seal. The bond between the thermoplastic adhesive and the MST device surface is prone to thermal fatigue and leakage or outright failure.

Abstract: A printer is provided having a printhead assembly having a carrier frame, a pagewidth printhead with a corresponding pagewidth print zone defined by a plane adjacent the printhead assembly mounted at a base of the carrier frame, an approach guide mounted to the carrier frame on a first side of the printhead and an exit guide mounted to the carrier frame on a second side of the printhead, and a feed mechanism for continuously feeding a web of print media through the print zone. The web is unsupported in the print zone and is guided therethrough by the guides. The approach guide curves about the carrier frame base to terminate upstream with a leading angular edge abutting with the web such that the natural path of the web is deflected downwards and around the approach guide, and the exit guide curves about the carrier frame base to terminate downstream.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract: A method of attaching a MST device to a support member with an adhesive film, the MST device having an attachment face and a first fluid conduit connected to a first aperture in the attachment face; the support member having a mounting face and a second fluid conduit connected to a second aperture in the mounting face; and, the polymer film has an opening for fluid communication between the first aperture and the second aperture, the method comprising the steps of: forming the opening in the polymer film; aligning the opening with at least part of the second aperture; applying heat and pressure to attach the polymer film to the mounting face; and, positioning the MST device such that the opening is aligned with at east part of the first aperture. By pre-drilling the holes in the film, the attachment process is quicker and the resulting fluidic seal in more reliable.

Abstract: Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together.

Abstract: A feed mechanism for a wide format printer is provided having a supply spool for supplying media web to a printhead, a take-up spool for receiving the web after printing, a take-up motor connected to the take-up spool, a take-up control system for controlling the take-up motor torque, a drive roller system positioned between the supply and take-up spools, a drive motor connected to the drive roller system, and a braking motor connected to the supply spool for generating tension in the web between the supply spool and the drive roller system. The take-up, drive and braking motors are separate motors and are separately connected to the take-up spool, drive roller system and supply spool, respectively. The web fed from the drive roller system to the take-up spool is maintained under substantially constant tension by regulating the torque of the take-up motor using the take-up control system.

Abstract: A wide format printer having an alternative print zone arrangement is provided. The printer comprises a printhead having a corresponding print zone, the print zone being defined by a plane adjacent the printhead, and a feed mechanism for continuously feeding a web of print media through the print zone. The printer is characterized in that the web is unsupported in the print zone, which obviates the need for a platen and advantageously maintains a constant distance between the printhead and the web.

Abstract: The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path.

Abstract: A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined.

Abstract: The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.