Patents by Inventor Jan Waszczuk

Jan Waszczuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060152557
    Abstract: A laminated film for mounting a MST device to a support structure for sealed fluid communication therebetween, the laminated film comprising: a polymer carrier web between two thermosetting adhesive layers; and, an opening formed in the film for establishing fluid communication between a first fluid conduit in the MST device and a second fluid conduit in the support member. Using a laminated film with thermosetting adhesive one each side provides a far more reliable seal than heated thermoplastic film. The bond between the thermoplastic film and the MST device surface is prone to thermal fatigue and leakage or outright failure. A laminate with a central carrier web and thermosetting adhesive can be drilled by a UV laser and later heated to a known curing temperature so that the adhesive sets and forms a strong bond to the MST device surface.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 13, 2006
    Inventors: Kia Silverbrook, David Psaila, Garry Jackson, Akira Nakazawa, Jonathan Bulman, Jan Waszczuk
  • Publication number: 20060151086
    Abstract: A method of sealing an attachment face of a MST device to a mounting surface on a support member, the attachment face having an aperture connected to a first fluid conduit, the attachment face having a second aperture connected to a second conduit, the method comprising the steps of: applying a thermosetting adhesive to the mounting surface; aligning the first aperture with at least part of the second aperture; pressing the MST device and the mounting surface together; and, curing the thermosetting adhesive; wherein, the thermosetting adhesive has a viscosity of between 100 centiPoise and 10,000,000 centiPoise. Using a thermosetting adhesive instead of a thermoplastic adhesive provides a far more reliable seal. The bond between the thermoplastic adhesive and the MST device surface is prone to thermal fatigue and leakage or outright failure.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 13, 2006
    Inventors: Kia Silverbrook, David Psaila, Garry Jackson, Akira Nakazawa, Jonathan Bulman, Jan Waszczuk
  • Publication number: 20060151102
    Abstract: A method of attaching a MST device to a support member with an adhesive film, the MST device having an attachment face and a first fluid conduit connected to a first aperture in the attachment face; the support member having a mounting face and a second fluid conduit connected to a second aperture in the mounting face; and, the polymer film has an opening for fluid communication between the first aperture and the second aperture, the method comprising the steps of: forming the opening in the polymer film; aligning the opening with at least part of the second aperture; applying heat and pressure to attach the polymer film to the mounting face; and, positioning the MST device such that the opening is aligned with at east part of the first aperture. By pre-drilling the holes in the film, the attachment process is quicker and the resulting fluidic seal in more reliable.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 13, 2006
    Inventors: Kia Silverbrook, David Psaila, Garry Jackson, Akira Nakazawa, Jonathan Bulman, Jan Waszczuk
  • Publication number: 20060152545
    Abstract: A MST device for attachment to an adhesive surface, the MST device comprising: an attachment surface for abutting the adhesive surface; a first fluid conduit connected to a first aperture in the attachment surface; and, a recess in the attachment surface adjacent the first aperture to hold adhesive displaced from between the attachment surface and the adhesive surface when the MST device is attached such that displaced adhesive does not block fluid flow in the first conduit. By profiling the attachment surface so there is a recess next to the first aperture, there is less risk that adhesive will be squeezed into the conduit and impair fluid flow.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 13, 2006
    Inventors: Kia Silverbrook, David Psaila, Garry Jackson, Akira Nakazawa, Jonathan Bulman, Jan Waszczuk