Patents by Inventor Jan Waszczuk

Jan Waszczuk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100047962
    Abstract: The invention relates to an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes a support assembly, a wafer positioning assembly arranged on the support assembly and configured to retain and position a wafer defining a plurality of die to be picked from the wafer; and a die picking assembly arranged on the support assembly and configured to pick a pre-selected dice from the wafer. The assembler also includes a die placement assembly arranged on the support assembly and configured to receive the pre-selected dice and to place the dice on the carrier, and a die conveyance mechanism arranged on the support assembly and configured to convey the dice from the die picking assembly to the die placement assembly. Further included is a control system operatively engaged with the wafer positioning, die picking, die placement and die conveyance assemblies to control operation thereof.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, Peter John Morley Sobey, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell
  • Publication number: 20100045741
    Abstract: The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Inventors: Stephen Richard O'Farrell, Jan Waszczuk, David Bernardi, Toby Desmond Oste, Mark Janos, William Granger
  • Publication number: 20100047043
    Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell, Peter John Morley Sobey
  • Publication number: 20090303267
    Abstract: A method of supplying ink to ink ejection nozzles on a printhead for an inkjet printer with a print engine controller for controlling the printhead operation involving the provision a printhead IC having an array of the ink ejection nozzles formed on a substrate, the provision of circuitry for electrical connection to the print engine controller, the provision of a support member for supporting the printhead integrated circuit and the circuitry within the printer, the provision of a thermoplastic polymer sealing film, and securing the polymer film to a mounting surface of the support member by applying heat and pressure for a predetermined time, mounting the printhead integrated circuit and the circuitry to the support member via the polymer film and, electrically connecting the circuitry to the printhead integrated circuit. The mounting surface has ink feed channels formed in it and the polymer film is attached to the mounting surface between the ink feed channels and the printhead integrated circuits.
    Type: Application
    Filed: July 19, 2009
    Publication date: December 10, 2009
    Inventors: Kia Silverbrook, David Charles Psaila, Garry Raymond Jackson, Akira Nakazawa, Johnathan Mark Bulman, Jan Waszczuk
  • Patent number: 7571541
    Abstract: A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b) depositing sacrificial material so as fill the trenches and form a scaffold on the substrate; (c) defining openings in the sacrificial material; (d) depositing roof material over the sacrificial material to form nozzle chambers and filter structures simultaneously; (e) etching nozzle apertures through the roof material; and (f) removing the sacrificial material.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: August 11, 2009
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, David Charles Psaila, Garry Raymond Jackson, Akira Nakazawa, Jonathan Mark Bulman, Jan Waszczuk
  • Publication number: 20090102882
    Abstract: A micro-systems technology (MST) device for attachment to a surface with adhesive is provided. The MST device has a body, an array of fluid inlet apertures in the body, and an array of recesses interspersed with the array of inlet apertures to hold adhesive displaced from between the body and the surface when the MST device is attached with the adhesive such that the displaced adhesive does not block fluid flow within the inlet apertures.
    Type: Application
    Filed: November 18, 2008
    Publication date: April 23, 2009
    Inventors: Kia Silverbrook, Garry Raymond Jackson, Akira Nakazawa, Jan Waszczuk
  • Patent number: 7469987
    Abstract: A micro-systems technology (MST) device for attachment to an adhesive surface. The MST device has an attachment surface for abutting the adhesive surfaces, a first fluid conduit connected to a first aperture in the attachment surface and, a recess in the attachment surface adjacent the first aperture to hold adhesive displaced from between the attachment surface and the adhesive surface when the MST device is attached such that displaced adhesive does not block fluid flow in the first conduit. By profiling the attachment surface so there is a recess next to the first aperture, there is less risk that adhesive will be squeezed into the conduit and impair fluid flow.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: December 30, 2008
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, David Charles Psaila, Garry Raymond Jackson, Akira Nakazawa, Jonathan Mark Bulman, Jan Waszczuk
  • Publication number: 20080266351
    Abstract: Provided is a printhead arrangement for an inkjet printer. The arrangement has a maintenance assembly operatively positioned adjacent a printhead. The maintenance assembly includes a maintenance chassis and a lower maintenance molding having air vents to facilitate ventilation of the printhead. The assembly also includes a retainer insert provided to fit within the chassis to provide added rigidity to the maintenance assembly, and an upper maintenance molding to enclose absorbent material within the retainer insert.
    Type: Application
    Filed: July 9, 2008
    Publication date: October 30, 2008
    Inventors: Kia Silverbrook, Garry Raymond Jackson, Akira Nakazawa, Jan Waszczuk
  • Patent number: 7416629
    Abstract: A method of attaching MST devices to a support member via an adhesive film, the MST devices each having an attachment face with a first aperture and the support member having a mounting surface with second apertures corresponding to each of the first apertures respectively and a fiducial marker for each of the MST devices respectively, and the adhesive film having a plurality of openings. The method involving positioning the adhesive film using the fiducial marker and the corresponding opening such that the openings register with at least part of the second apertures in the mounting surface, applying the adhesive film to the mounting surface, positioning each of the MST devices relative to the respective openings, and, attaching the MST devices with heat and pressure such that the openings establish the respective first and second apertures.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: August 26, 2008
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, David Charles Psaila, Garry Raymond Jackson, Akira Nakazawa, Jonathan Mark Bulman, Jan Waszczuk
  • Publication number: 20080107468
    Abstract: A spool for a printer comprising: a spindle for receiving an outer shaft supporting a roll of print media, wherein the spindle includes a first end and a second end; resiliently deformable first and second gripping rings circumferentially mounted about the first and second ends of the spindle respectively; a first member which is releasably engagable with a first end of the spindle; a second member located at the second end of the spindle and operably connected to the second gripping ring. Releasable engagement of the first member with the spindle axially compresses the first gripping ring whilst urging the outer shaft against the second member thereby axially compressing the second gripping ring. Axial compression of the first and second gripping rings causes radial expansion thereof, thereby urging the first and second gripping ring into gripping engagement with the outer shaft received on the spindle.
    Type: Application
    Filed: December 12, 2007
    Publication date: May 8, 2008
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Patent number: 7322761
    Abstract: A spool, such as supply for a wide-format printer, is provided. The spool comprises a spindle for slidingly receiving an outer shaft, which is typically the core of a roll of print media. A first resiliently deformable gripping ring is circumferentially mounted about the spindle, and a compression mechanism is provided for axially compressing the gripping ring. The axial compression causes radial expansion of the gripping ring, thereby urging the gripping ring into gripping engagement with the outer shaft received on the spindle.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: January 29, 2008
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059081
    Abstract: A spool, such as supply for a wide-format printer, is provided. The spool comprises a spindle for slidingly receiving an outer shaft, which is typically the core of a roll of print media. A first resiliently deformable gripping ring is circumferentially mounted about the spindle, and a compression mechanism is provided for axially compressing the gripping ring. The axial compression causes radial expansion of the gripping ring, thereby urging the gripping ring into gripping engagement with the outer shaft received on the spindle.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059077
    Abstract: A wide format printer having a web path adapted for high speed printing is provided. The printer comprises a printhead assembly, the printhead assembly comprising a printhead mounted at the base of a printhead carrier, and a feed mechanism for continuously feeding a web of print media past the printhead. The printhead assembly is positioned in the path of the web such that, in use, the web is tensioned around the printhead assembly. This arrangement is advantageous for achieving high speed pagewidth printing, whilst controlling the distance between the printhead and the web using surface features on the printhead assembly.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059082
    Abstract: A printhead assembly for a wide format printer is provided. The printhead assembly comprises a printhead carrier, a printhead mounted on the carrier, and a guide. The printhead has an associated print zone defined by a plane adjacent the printhead and the guide is configured to guide a web through the print zone. The printhead assembly advantageously obviates the need for a platen in a wide format printer and is adapted to maintain a constant predetermined distance between the printhead and the web. A wide format printer comprising the printhead assembly is also provided.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059078
    Abstract: A feed mechanism for feeding a web of print media past a printhead is provided. The feed mechanism comprises a supply spool, a take-up spool, a take-up motor operatively connected to the take-up spool, a take-up control system for controlling the torque of the take-up motor, a drive roller system positioned between the supply spool and the take-up spool and a drive motor operatively connected to the drive roller system. In use, a web fed from the drive roller system to the take-up spool is maintained under substantially constant tension by regulating the torque of the take-up motor using the take-up control system. A wide format printer comprising the feed mechanism is also provided.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059079
    Abstract: A method of printing is provided. The method comprises the steps of: (i) feeding a web of print media from a supply spool to a radially expanded take-up spool, whilst simultaneously printing onto the print media, thereby providing a printed roll of print media wound onto the radially expanded take-up spool; (ii) radially contracting the take-up spool once printing is completed; and (iii) removing the printed roll of print media from the radially contracted take-up spool.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059080
    Abstract: A take-up spool for a wide format printer is provided. The spool comprises a radially expandable shaft and at least one expander releasably engageable with the shaft. Engagement of the expander with the shaft radially expands at least part of the shaft. Expansion and contraction of the shaft facilitates removal of a web of print media wound onto the shaft.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20070059083
    Abstract: A wide format printer having an alternative print zone arrangement is provided. The printer comprises a printhead having a corresponding print zone, the print zone being defined by a plane adjacent the printhead, and a feed mechanism for continuously feeding a web of print media through the print zone. The printer is characterized in that the web is unsupported in the print zone, which obviates the need for a platen and advantageously maintains a constant distance between the printhead and the web.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventors: Kia Silverbrook, Nagesh Ramachandra, Jan Waszczuk
  • Publication number: 20060165118
    Abstract: A method of attaching MST devices to a support member via an adhesive film, the MST devices each having an attachment face with a first aperture and the support member having a mounting surface with second apertures corresponding to each of the first apertures respectively and a fiducial marker for each of the MST devices respectively, and the adhesive film having a plurality of openings, the method comprising the steps of: positioning the adhesive film using the fiducial marker and the corresponding opening such that the openings register with at least part of the second apertures in the mounting surface; applying the adhesive film to the mounting surface; positioning each of the MST devices relative to the respective openings; and, attaching the MST devices with heat and pressure such that the openings establish the respective first and second apertures. Instead of putting fiducial markers on both the film and the support member for alignment, the vision system use the fluid openings themselves.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 27, 2006
    Inventors: Kia Silverbrook, David Psaila, Garry Jackson, Akira Nakazawa, Jonathan Bulman, Jan Waszczuk
  • Publication number: 20060150407
    Abstract: A method of producing a printhead for an inkjet printer with a print engine controller for controlling the printhead operation, the method comprising the steps of: providing a printhead IC having an array of ink ejection nozzles formed on a substrate; providing circuitry for electrical connection to the print engine controller; providing a support member for supporting the printhead IC and the circuitry within the printer; providing a polymer film; securing the polymer film to a surface of the support member by applying heat and pressure for a predetermined time; mounting the printhead IC and the circuitry to the support member via the polymer film; and, electrically connecting the circuitry to the printhead IC.
    Type: Application
    Filed: December 19, 2005
    Publication date: July 13, 2006
    Inventors: Kia Silverbrook, David Psaila, Garry Jackson, Akira Nakazawa, Jonathan Bulman, Jan Waszczuk