Abstract: A substrate for supporting a semiconductor chip has area array connectors on at least two surfaces to provide a large number of connectors to the chip. At least one contact on one surface is not connected to a contact on the other surface through the substrate. Carriers, such as printed circuit boards are mounted to the two surfaces.

Abstract: A thermal hinge (20) designed for use in a hinged mobile computing device (22) having a base (24) and a display unit (26). The thermal hinge includes a first block (120) and a second block (122), both made from copper or other metal of equal or higher thermal conductivity. The blocks are mounted in the base and display unit, respectively, adjacent the rotational axis (30) of the hinge assembly (28) that permits the display unit to move between open and closed positions relative to the base. The first block is connected to a first heat pipe (102) which is attached to a heat-generating device (32), and the second block is connected to a second heat pipe (104) which is connected to a heat dissipating device (34). At least one, and preferably a plurality of, braided wire(s) (160) are connected to the first and second blocks and conduct heat therebetween.

Abstract: An apparatus and method are provided that remove sufficient heat from both SOI and non-SOI semiconductor devices to prevent the devices from overheating during operation. A plurality of thermally conductive pads such as electrically conductive studs are coupled to a first side of a semiconductor device having circuit elements formed thereon. The thermally conductive pads also are coupled to a substrate comprising an apparatus for extracting heat from the thermally conductive pads. The apparatus for extracting heat from the thermally conductive pads preferably comprises one or more metallic planes. A module cover having a thermally conductive path formed therein also may be coupled between the apparatus for extracting heat and a heat sink to further aid in heat removal from the semiconductor device. Thermally conductive pads may be coupled between the semiconductor device and I/O pins of the substrate to improve heat dissipation via the I/O pins.

Abstract: An apparatus and method controlling power consumption in portable personal computers by dynamically allocating power to the system logic. Expected total power consumption is calculated and compared to an optimum power efficiency value. The expected power consumption values for each execution unit are stored in a look-up table in actual or compressed form. If the expected total power consumption value exceeds the power efficiency value, selected execution units are made inactive. Conversely, if the power efficiency value exceeds the expected total power consumption value, execution unit functions are added in order to maintain a level current demand on the battery.

Abstract: A heatsink mounted to an electronic device having an area substantially greater than that of the device includes a heatpipe in the heatsink for transferring heat within the heatsink to reduce thermal gradients therein.