Patents by Inventor Jang-Hee Lee

Jang-Hee Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11047045
    Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: June 29, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soyoung Lee, Hyunjae Lee, Ik Soo Kim, Jang-Hee Lee
  • Patent number: 11050967
    Abstract: An image display device includes an external device interface unit configured to connect the image display device with an external device; a display unit configured to display an image received from the external device; a user input interface unit configured to receive an input signal and to send a control signal corresponding to the input signal to a relay device acting a communication relay between the image display device and the external device; and a controller configured to in response to the image display device being powered on, check whether or not a connection log of the image display device includes a previous connection between the image display device and the relay device, scan for an advertisement packet from the relay device at a first scan interval when the connection log does not include the previous connection between the image display device and the relay device, and scan for the advertisement packet from the relay device at a second scan interval having a longer time duration than the firs
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: June 29, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Seon Il Yu, Jang Hee Lee, Kwangseob Jeong
  • Publication number: 20210067727
    Abstract: An image display device includes an external device interface unit configured to connect the image display device with an external device; a display unit configured to display an image received from the external device; a user input interface unit configured to receive an input signal and to send a control signal corresponding to the input signal to a relay device acting a communication relay between the image display device and the external device; and a controller configured to in response to the image display device being powered on, check whether or not a connection log of the image display device includes a previous connection between the image display device and the relay device, scan for an advertisement packet from the relay device at a first scan interval when the connection log does not include the previous connection between the image display device and the relay device, and scan for the advertisement packet from the relay device at a second scan interval having a longer time duration than the firs
    Type: Application
    Filed: July 7, 2020
    Publication date: March 4, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Seon Il YU, Jang Hee LEE, Kwangseob JEONG
  • Patent number: 10858517
    Abstract: A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; and 4) a compound capable of dissolving the photoinitiators.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: December 8, 2020
    Assignee: MOMENTIVE PERFORMANCE MATERIALS KOREA CO., LTD.
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong, Jang Hee Lee
  • Patent number: 10790147
    Abstract: A method of manufacturing a semiconductor device includes forming an etch target layer on a substrate; forming an amorphous metal layer on the etch target layer, the amorphous metal layer comprising nitrogen between 15 atomic percentage (at %) and 25 at %; forming an amorphous metal hardmask by patterning the amorphous metal layer; and etching the etch target layer by using the amorphous metal hardmask as an etching mask.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 29, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Hee Lee, Se-Ran Oh, Hyun-Su Kim, Ik-Soo Kim, Seong-Gil Park, Geun-O Jeong
  • Patent number: 10779143
    Abstract: According to an embodiment of the present disclosure, a method for operating an electronic device includes displaying a result of recognizing at least one other electronic device as at least one item, and sending a message requesting the at least one other electronic device to output an identifiable signal.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: September 15, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Tae-Young Lee, Jae-Eun Kang, Han-Su Kang, Sung-Il Park, Seong-Hee Park, Bong-Jhin Shin, Chil-Youl Yang, Myoung-Hwan Lee, Jang-Hee Lee, Chun-Ho Lee
  • Publication number: 20200246940
    Abstract: The present invention relates to a grinding disc used in a grinder for cutting a workpiece by generating a rotation power by a motor or air pressure and, more specifically, to a grinding disc with a fixing part for a one-touch holder, which includes an abrasive part which comes into contact with a workpiece, and a fixing part formed in the center of the abrasive part for attachment and detachment with respect to a grinder, wherein the fixing part is formed by injection molding so as to improve the bonding force with the abrasive part and can be attached to or detached from the grinder by a one-touch method.
    Type: Application
    Filed: November 21, 2017
    Publication date: August 6, 2020
    Inventor: Jang Hee LEE
  • Patent number: 10735321
    Abstract: A method to transmit and receive a packet in a bridge of a communication system is provided. The method includes receiving a first packet from a first network. The method also includes converting a medium access control (MAC) layer source address of the received first packet into a MAC address of the bridge. The method further includes transmitting the address-converted first packet to a node of a second network.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: August 4, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bong-Jhin Shin, Jae-Eun Kang, Han-Su Kang, Sung-Il Park, Seong-Hee Park, Chil-Youl Yang, Myoung-Hwan Lee, Jang-Hee Lee, Chun-Ho Lee, Tae-Young Lee
  • Publication number: 20200071822
    Abstract: A semiconductor manufacturing, apparatus includes a process chamber. An insulating plate divides an interior space of the process chamber into a first space and a second space and thermally isolates the first space from the second space. A gas supplier is co figured to supply a process gas to the first space. A radiator is configured to heat the first space. A stage is disposed within the second space and the stage is configured to support a substrate.
    Type: Application
    Filed: April 1, 2019
    Publication date: March 5, 2020
    Inventors: Sung-Joo An, Jeon-Il Lee, Kaoru Yamamoto, Jang-Hee Lee, Kee-Young Jun, Geun-O Jeong
  • Publication number: 20200075324
    Abstract: In a plasma deposition method, a substrate is loaded onto a substrate stage within a chamber. A first plasma is generated at a region separated from the substrate by a first distance. A first process gas is supplied to the first plasma region to perform a pre-treatment process on the substrate. A second plasma is generated at a region separated from the substrate by a second distance different from the first distance. A second process gas is supplied to the second plasma region to perform a deposition process on the substrate.
    Type: Application
    Filed: April 16, 2019
    Publication date: March 5, 2020
    Inventors: Kaoru YAMAMOTO, Chang-Hyun KIM, Hyun-Jae SONG, Keun-Wook SHIN, Hyeon-Jin SHIN, Sung-Joo AN, Chang-Seok LEE, Kee-Young JUN, Geun-O JEONG, Jang-Hee LEE
  • Publication number: 20200062962
    Abstract: A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; and 4) a compound capable of dissolving the photoinitiators.
    Type: Application
    Filed: December 6, 2017
    Publication date: February 27, 2020
    Applicant: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Sun YU, Nan Soo KIM, Minjae JEONG, Jang Hee LEE
  • Patent number: 10542390
    Abstract: The present invention defines a share group, and enables a content generated during an activity period to be automatically shared in the share group during the activity period. According to an embodiment of the present invention, an automatic content share method comprises, in a content share method, the steps of: setting a share group to share the content, an activity and an activity period; and sharing the generated content on the basis of the share group to share the content, the activity and the activity period, wherein the share group is formed on the basis of a proximity discovery.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: January 21, 2020
    Inventors: Tae-Young Lee, Kyung-Whoon Cheun, Jae-Eun Kang, Han-Su Kang, Sung-Il Park, Seong-Hee Park, Bong-Jhin Shin, Chil-Youl Yang, Myoung-Hwan Lee, Jang-Hee Lee, Chun-Ho Lee
  • Publication number: 20190372678
    Abstract: Disclosed is a method by which a transmission device transmits data on the basis of a sound signal in a wireless communication system, the method including transmitting a sound packet corresponding to transmission data, with the sound packet including at least one sound symbol, the sound symbol including at least one sound sub-symbol, a plurality of sound symbol types are supported in the wireless communication system, and each of the plurality of sound symbol types is mapped to a preset data value.
    Type: Application
    Filed: December 23, 2016
    Publication date: December 5, 2019
    Inventors: Kwang-Hoon HAN, Myoung-Hwan LEE, Jang-Hee LEE, Hee-Su KIM, Seong-Hee PARK, Chil-Youl YANG
  • Publication number: 20190186002
    Abstract: A source gas supply unit includes a canister including a precursor accommodating space therein, and an inflow surface and an outflow surface which are open. The source gas supply unit includes a first lid configured to seal the inflow surface of the canister and having a gas inlet connected to the precursor accommodating space and a second lid configured to seal the outflow surface of the canister and having a gas outlet connected to the precursor accommodating space. The source gas supply unit includes a ring-shaped solid precursor located in the precursor accommodating space and including a gas flow path therein, which communicates with the gas inlet and the gas outlet. A cross-sectional area of the gas flow path increases from the inflow surface of the canister toward the outflow surface thereof.
    Type: Application
    Filed: June 27, 2018
    Publication date: June 20, 2019
    Inventors: Hasan Musarrat, So Young Lee, Ik Soo Kim, Jang Hee Lee
  • Publication number: 20190080908
    Abstract: A method of manufacturing a semiconductor device includes forming an etch target layer on a substrate; forming an amorphous metal layer on the etch target layer, the amorphous metal layer comprising nitrogen between 15 atomic percentage (at %) and 25 at %; forming an amorphous metal hardmask by patterning the amorphous metal layer; and etching the etch target layer by using the amorphous metal hardmask as an etching mask.
    Type: Application
    Filed: April 24, 2018
    Publication date: March 14, 2019
    Inventors: JANG-HEE LEE, SE-RAN OH, HYUN-SU KIM, IK-SOO KIM, SEONG-GIL PARK, GEUN-O JEONG
  • Publication number: 20190055649
    Abstract: Provided are a precursor supply unit, a substrate processing system, and a method of fabricating a semiconductor device using the same. The precursor supply unit may include an outer container, an inner container provided in the outer container and used to store a precursor source, a gas injection line having an injection port, which is provided below the inner container and in the outer container and is used to provide a carrier gas into the outer container, and a gas exhaust line having an exhaust port, which is provided below the inner container and in the outer container and is used to exhaust the carrier gas in the outer container and a precursor produced from the precursor source.
    Type: Application
    Filed: July 9, 2018
    Publication date: February 21, 2019
    Inventors: Soyoung Lee, Hyunjae LEE, lk Soo KIM, Jang-Hee LEE
  • Patent number: 10184178
    Abstract: A deposition apparatus includes a chuck in a process chamber, the chuck having a top surface on which a substrate is loaded, a showerhead disposed over the chuck, and a fence extension disposed in the process chamber. Plasma is generated in a space between the showerhead and the loaded substrate during a deposition process. The fence extension at least partially confines the plasma in the space during the deposition process, thereby enabling improved thickness uniformity and reliability of a layer deposited on the loaded substrate during the deposition process.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: January 22, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Minjong Kim, Jung-soo Yoon, Jang-Hee Lee, Jongwon Hong
  • Patent number: 10129690
    Abstract: The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic device, a method of an electronic device, and a method of a terminal apparatus are provided.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: November 13, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Young Lee, Jae-Eun Kang, Han-Su Kang, Sung-Il Park, Seong-Hee Park, Bong-Jhin Shin, Chil-Youl Yang, Myoung-Hwan Lee, Jang-Hee Lee, Chun-Ho Lee
  • Publication number: 20180278524
    Abstract: A method to transmit and receive a packet in a bridge of a communication system is provided. The method includes receiving a first packet from a first network. The method also includes converting a medium access control (MAC) layer source address of the received first packet into a MAC address of the bridge.
    Type: Application
    Filed: June 1, 2018
    Publication date: September 27, 2018
    Inventors: Bong-Jhin Shin, Jae-Eun Kang, Han-Su Kang, Sung-Il Park, Seong-Hee Park, Chil-Youl Yang, Myoung-Hwan Lee, Jang-Hee Lee, Chun-Ho Lee, Tae-Young Lee
  • Patent number: 10009268
    Abstract: A method to transmit and receive a packet in a bridge of a communication system is provided. The method includes receiving a first packet from a first network. The method also includes converting a medium access control (MAC) layer source address of the received first packet into a MAC address of the bridge. The method further includes transmitting the address-converted first packet to a node of a second network.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: June 26, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bong-Jhin Shin, Jae-Eun Kang, Han-Su Kang, Sung-Il Park, Seong-Hee Park, Chil-Youl Yang, Myoung-Hwan Lee, Jang-Hee Lee, Chun-Ho Lee, Tae-Young Lee