Abstract: Provided is a method for measuring the peeling stability of a release film and a release film laminate by measuring a high-speed release strength balance and a low-speed strength balance on the basis of General Formulas 1 and 2.

Abstract: The present invention provides an adhesive composition for optical use, which includes rubber and may be chemically cross-linked through an appropriate curing process, and as a result, may secure excellent long-term durability, water vapor transmission resistance, and chemical resistance, and includes an isobutylene-isoprene rubber having an acrylic acid ester-based functional group in a main chain thereof, a photoinitiator, and a tackifier in order to provide optical characteristics sufficient to be used for optical use. The present invention provides a method for preparing the adhesive composition for optical use, and it is possible to obtain the adhesive composition for optical use, which includes a chemically cross-linkable rubber by the method. Further, the present invention provides an adhesive film for optical use, and excellent long-term durability and optical characteristics may be implemented by applying the adhesive film for optical use to a wide range of electronic devices.

Abstract: Provided is an antireflection film including: a substrate layer; and a coating layer formed on at least one surface of the substrate layer, in which the coating layer includes a cured material of a composition containing a photo-curable (meth)acrylic acid ester resin; inorganic nanoparticles; a silicone-acrylate graft polymer including a polyacrylate main chain and a silicone side chain; and a solvent.

Abstract: Provided is an adhesive composition for touch panels, including: an acrylic resin; a first curing agent having one to three functional groups; and a second curing agent having four to six functional groups. Provided is an adhesive film including an adhesive layer, which is a cured product of the adhesive composition for touch panels. Provided is a touch panel including: a conductive plastic film which has a conductive layer formed on one side thereof; and an adhesive layer which is attached to the conductive layer and includes a cured product of the adhesive composition for touch panels.

Abstract: Provided is an optical film coating composition including: a UV curable acrylate resin; mixed particles including inorganic nanoparticles and carbon black; and a photoinitiator.

Abstract: Provided are: an adhesive composition for a touch panel, including an acrylic resin, a first curing agent having one to three functional groups, a second curing agent having four to six functional groups, and an ultraviolet blocking agent containing a benzotriazole group; and an adhesive film for a touch panel, including a cured product of the composition.

Abstract: Provided is a silicone-based coating composition including: a silicone-based resin; a silicone-based hardener; and a thermal initiator, in which the silicone-based coating composition further includes a silicone-based compound of Chemical Formula 1. Also, provided is a silicone-based release film including: a base layer; and a coating layer which is a cured product of the silicone-based coating composition.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Abstract: Provided is an acrylic syrup preparation method including the steps of: performing bulk photopolymerization by initiating a UV irradiation of a composition containing a photoinitiator and one or more types of acrylic monomers; stopping the UV irradiation at the time point when the temperature is increased by about 5° C. to about 40° C. from the time point when the temperature at which the UV irradiation of the composition is initiated; and purging the composition with an oxygen-containing inert gas after the UV irradiation is stopped.

Abstract: Provided is an adhesive composition including: a (meth)acrylic acid ester-based photo-curable resin; and an oxygen-free di-functional diene-based rubber hardener.

Abstract: The present invention relates to an anti-scattering film and a method for manufacturing the same, the anti-scattering film including: a transparent film; and a hard coating layer formed on top of the transparent film, in which the hard coating layer is formed of a composition which includes a UV-curable acrylate resin, first inorganic nanoparticles, second inorganic nanoparticles, a photoinitiator, and a mixed solvent comprising a ketone-based solvent and an alcohol-based solvent, and a plurality of protruding parts is formed on an upper surface of the hard coating layer.

Abstract: The present invention provides an optical adhesive sheet including a layered structure of a first adhesive layer and a second adhesive layer, in which the first adhesive layer has a glass transition temperature of ?50° C. to ?30° C. and a modulus of 0.3×105 Pa to about 0.6×105 Pa, and the second adhesive layer has a glass transition temperature of ?20° C. to ?10° C. and a modulus of 0.7×105 Pa to 1.0×105 Pa.

Abstract: The present invention relates to an adhesive composition including: a butyl-based rubber; and a tackifier having a softening point of 90° C. or more.

Abstract: The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Abstract: Provided is an adhesive composition for a heat dissipating adhesive tape, the adhesive composition comprising a (meth)acrylic acid ester based photocurable resin, a thermal conductive filler, and a benzotriazole-based compound.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: Disclosed are a base material composition for a foam tape which has high foam stability and excellent peel strength, a foam tape prepared using the same, and a preparation method thereof. According to the present invention, the base material composition for a foam tape comprises an acrylic monomer, a radical initiator, a cross-linking agent, a porous filler, and a surfactant, wherein the surfactant comprises 60-90 wt % of a siloxane-based polymer and 10-40 wt % of a non-siloxane-based polymer. A foam tape prepared thereby is economical compared with conventional foam tapes, is free from a deteriorating adhesive force, and has excellent foam stability.

Abstract: The present invention relates to an adhesive film and to a touch panel. According to the present invention, even when the adhesive film is applied to a touch panel, for example, a capacitive touch panel, and directly attached to a conductive layer, the adhesive film effectively prevents the resistance of the conductive layer from being raised and exhibits good heat resistance. In addition, according to the present invention, an adhesive film having superior durability, optical characteristics, cuttability, workability, wettability and resistance to warping is provided.

Abstract: The present invention relates to a water-based adhesive composition, to a method for manufacturing same, and to an adhesive film. The water-based adhesive composition according to the present invention has excellent physical properties such as detachability and reworkability, and can stably prevent changes in the physical properties thereof caused by longitudinal or environmental factors. In addition, the water-based adhesive composition according to the present invention has excellent wettability with respect to various adherends. Accordingly, the water-based adhesive composition according to the present invention can be effectively applied to various industrial adhesive products such as adhesive films for advertisements.