Abstract: Provided is an adhesive composition comprising: a thermosetting epoxy resin formed with an epoxy copolymer containing a hydroxyl group; and a UV curable epoxy resin having an epoxy equivalence of 100 g/eq to 500 g/eq.

Abstract: Disclosed are a photothermal conversion film having good photothermal conversion effects and also good visible light penetrability, and a transfer film for an OLED using same. The photothermal conversion film according to the present invention comprises a base film and a photothermal conversion layer formed on the base film, wherein the photothermal conversion layer includes a tungsten oxide-based material and has visible light penetrability of 20% or greater.

Abstract: The present invention provides an adhesive composition for a protective film, comprising a UV curable rubber having a degree of unsaturation of 70-85%. In addition, the present invention provides a protective film formed with the adhesive composition for a protective film.

Abstract: The present invention relates to an adhesive composition comprising: an alkyl acrylic acid ester monomer having an alkyl carbon number of 2 to 14; an acrylic acid ester monomer containing a hydroxyl group; and a copolymer obtained by copolymerizing an acrylic acid ester monomer. The present invention also provides the adhesive composition and an adhesive film using the same, a touch panel, and an electronic device. The adhesive composition of the present invention has characteristics of high flexibility and good cutting properties, durability, transparency, etc.

Abstract: Provided is an adhesive composition, comprising: a copolymer in which a monomer containing 5 to 50 parts by weight of a polar functional group with respect to 100 parts by weight of a (meta) acrylic acid ester-based monomer is polymerized; and a hollow glass filler or bubbles. Also provided is a method for preparing the adhesive composition, comprising the steps of: preparing the copolymer by polymerizing 5 to 50 parts by weight of the monomer containing the polar function group, with respect to 100 parts by weight of the (meta) acrylic acid ester-based monomer; preparing a mixture by adding a surfactant, a photoinitiator, and a photocuring agent to the copolymer; and adding to the mixture the hollow glass filler or the bubbles.

Abstract: The present invention relates to an optical adhesive film which has excellent adhesive strength at room temperature and has improved efficiency in a rework process since peel strength is low at high temperatures. When attaching a touchscreen panel and an LCD by using the adhesive film of the present invention and separating the touchscreen panel and the LCD at high temperatures, the touchscreen panel and the LCD can be separated from each other without causing damage thereto. Additionally, the optical film of the present invention comprises two adhesive layers, wherein peeling occurs at the first adhesive layer having an adhesive composition such that a peeling surface can be controlled according to the convenience of a user.

Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure-sensitive adhesive composition comprising a) acrylic copolymers; b) a hydrophilic plasticizer; and c) a hydrophobic plasticizer. The acrylic pressure-sensitive adhesive composition according to the present invention has no mura under moisture and heat resistant condition, and thus has an excellent stain resistance of adherends, and an excellent wettability, endurance reliability, transparency and adhesion reliability, regardless of whether surface property of the adherend is hydrophillic or hydrophobic.

Abstract: Disclosed are a base material composition for a foam tape which has high foam stability and excellent peel strength, a foam tape prepared using the same, and a preparation method thereof. According to the present invention, the base material composition for a foam tape comprises an acrylic monomer, a radical initiator, a cross-linking agent, a porous filler, and a surfactant, wherein the surfactant comprises 60-90 wt % of a siloxane-based polymer and 10-40 wt % of a non-siloxane-based polymer. A foam tape prepared thereby is economical compared with conventional foam tapes, is free from a deteriorating adhesive force, and has excellent foam stability.

Abstract: Disclosed is a semi-hardened pressure sensitive adhesive film to be used in the semi-hardened state and having excellent printing step absorption properties. The adhesive film according to the present invention contains a radial polymer composition and a cationic polymer composition, and the radial polymer composition is primarily cross-linked to maintain the semi-hardened state. When applied onto a substrate through a printing step, the present invention has excellent step absorption properties and adhesion properties and excellent durability even under high-temperature and high-humidity conditions.

Abstract: Disclosed is an aqueous adhesive composition, the adhesive properties of which are barely degraded due to aging. The aqueous adhesive composition according to the present invention has the technical features of comprising a monomer having a hydroxyl group, and of not forming a chelate compound after polymerization. Thus, the aqueous adhesive composition has the advantages of having little reduction in adhesive properties thereof due to an increase in gel content.

Abstract: The present invention relates to an adhesive composition, to an adhesive sheet, and to a touch panel. The present invention provides an adhesive composition, particularly an adhesive composition for a touch panel, which is prepared without using a low molecular weight polymer as an additive. The adhesive composition, the adhesive sheet, and the touch panel of the present invention exhibit superior heat resistance in a hardening process, a printed circuit board assembly process, or the like, and have superior physical properties such as optical characteristics, wettability, cuttability, workability, anti-curling properties, and durability.

Abstract: The present invention relates to an adhesive film for a touch panel, and to a touch panel. The adhesive film has superior heat resistance, optical characteristics, wettability, cuttability, anti-warpage characteristics and chemical resistance, and exhibits superior durability when applied to a touch panel.

Abstract: Disclosed are a composition for a foam tape base material having high bubble stability and superior peel strength. The composition for the foam tape according to the present invention comprises an acrylic monomer, a radical initiator, a cross-linking agent, a porous filler, and a surfactant, wherein the surfactant comprises 60 to 90 wt % of a siloxane polymer and 10 to 40 wt % of a non-siloxane polymer, thereby providing the advantage of manufacturing the foam tape manufactured using the composition that is economical, does not lose adhesive force, and has superior bubble stability compared to existing foam tapes.

Abstract: The present invention relates to an adhesive film for protecting a wafer including an adhesive layer formed on one surface of a substrate film. The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer, wherein the surface film has a tensile strength of 2-10 kg/mm2 and an elongation until breakage of 50-200%, and the gel content of the adhesive layer is greater than or equal to 80%. The adhesive film for protecting the wafer maintains cutting ability and machinability, while preventing the generation of bending and wafer breaking phenomena due to the decrease of the wafer thickness. In addition, the adhesive film may not melt at high temperatures, and the yield while grinding the wafer may be increased.

Abstract: Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a material comprising a UV curable polymer resin composition or a UV transmitting polymer resin composition; and (b) a tack-free adhesive layer formed with a material comprising a UV curable polymer resin. The sealing film has excellent sealing properties and is tack-free at room temperature, and thus it is possible to minimize freezing of electrostatic particles inside a microcup sticking to the surface of a sealing material during manipulation thereof.

Abstract: The present invention provides a pressure sensitive adhesive tape comprising: an acrylic foam layer; and rubber-based adhesive layers which are formed on both sides of said acrylic foam layer, wherein the content of gel in said rubber-based adhesive layers is 40% or more. Furthermore, in order to accomplish the object of the present invention, a method for manufacturing a pressure sensitive adhesive layer is provided, and the method comprises the steps of: manufacturing an acrylic foam layer; and forming rubber-based adhesive layers on one side or both sides of said acrylic foam layer, wherein said step of forming the rubber-based adhesive layers comprises the steps of: manufacturing a styrene block copolymer; forming rubber-based adhesive layers by adding an adhesive additive and a plasticizer to said styrene block copolymer; and setting the content of gel in said rubber-based adhesive layers to 40% or more.

Abstract: The present invention relates to an adhesive composition for a wafer processing film, a wafer processing film, and a semiconductor wafer processing method. In the semiconductor wafer processing process such as a dicing process or a back grinding process, a delaminating force with respect to a wafer to be attached may be effectively reduced to improve process efficiency and prevent the wafer from being warped or cracked.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react with active hydrogen is used for increasing the reaction rate of an adhesive resin which is required for the preparation of a decorative film having a metallic effect, thereby ensuring coating stability and increasing the reaction rate. Thus, according to the present invention, an adhesive resin which has little deviation in quality (boil resistance) between and within rolls can be provided in a short time.

Abstract: The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.