Abstract: The embodiment examples of the present invention relate to a double-sided adhesive sheet and a display device for a touch panel including the same. The double-sided adhesive sheet, according to the embodiment examples of the present invention, comprises a transparent acryl-based resin layer as a substrate, can provide a double-sided adhesive sheet which can be detached and recycled after attaching to the touch panel and a display device module, by means of the adhesive agent layers that are formed on both sides having different detaching force, can improve visibility of the display device by being coupled between the touch panel and the display device module for eliminating an air gap, and can minimize the difference in the bending rate of each layer of the double-sided adhesive sheet for eliminating visibility exhaustion as much as possible.

Abstract: The present invention relates to an adhesive composition for a touch panel, an adhesive film, and a touch panel. The adhesive composition for the touch panel of the present invention is applied to the touch panel, for example, to an electrostatic capacitance-type touch panel, for hiding the pattern of a conductive layer even when being coupled to the conductive layer formed with the pattern. Also, the adhesive composition of the present invention can prevent yellowing and whitening.

Abstract: The present invention relates to an adhesive composition for a touch panel, an adhesive film, and a touch panel. When coupled to the touch panel, for example, to a conductive layer and to a hard coating surface of an electrostatic capacitive touch panel, the present invention has superior durability, such as resistance to peeling, detaching, or air bubbles under high-temperature and high-humidity conditions, and can provide an adhesive composition or adhesive agent also having superior workability, wettability, and adhesion to various objects to be adhered.

Abstract: The present invention relates to an adhesive composition for a touch panel, and adhesive film, and to a touch panel. When the adhesive composition of the present invention is applied to the touch panel, for example, to an electrostatic capacitance-type touch panel, the present invention has superior durability under high-temperature and high-humidity conditions and superior wettability and adhesiveness to various objects to be adhered, and can provide the adhesive composition and the adhesive film having excellent durability to chemicals, such as resistance to sebum.

Abstract: The present invention relates to an adhesive film for a touch panel, and to a touch panel. The adhesive film has superior heat resistance, optical characteristics, wettability, cuttability, anti-warpage characteristics and chemical resistance, and exhibits superior durability when applied to a touch panel.

Abstract: The present invention relates to an adhesive composition for a touch panel, to an adhesive film, and to a touch panel. The adhesive composition according to the present invention provides an adhesive for a touch panel that has superior chemical resistance, superior durability under high-temperature or high-humidity conditions, and superior wettability or adhesion to a variety of adherends. In addition, the adhesive composition according to the present invention provides an adhesive which maintains superior resistant performance of a conductive layer and effectively prevents the corrosion of electrodes or the like when applied to a touch panel.

Abstract: The present invention relates to an adhesive composition, to an adhesive sheet, and to a touch panel. The present invention provides an adhesive composition, particularly an adhesive composition for a touch panel, which is prepared without using a low molecular weight polymer as an additive. The adhesive composition, the adhesive sheet, and the touch panel of the present invention exhibit superior heat resistance in a hardening process, a printed circuit board assembly process, or the like, and have superior physical properties such as optical characteristics, wettability, cuttability, workability, anti-curling properties, and durability.

Abstract: Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.

Abstract: The present invention relates to an adhesive film and to a touch panel. According to the present invention, even when the adhesive film is applied to a touch panel, for example, a capacitive touch panel, and directly attached to a conductive layer, the adhesive film effectively prevents the resistance of the conductive layer from being raised and exhibits good heat resistance. In addition, according to the present invention, an adhesive film having superior durability, optical characteristics, cuttability, workability, wettability and resistance to warping is provided.

Abstract: The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 ?m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Abstract: The present invention relates to a water-based adhesive composition, to a method for manufacturing same, and to an adhesive film. The water-based adhesive composition according to the present invention has excellent physical properties such as detachability and reworkability, and can stably prevent changes in the physical properties thereof caused by longitudinal or environmental factors. In addition, the water-based adhesive composition according to the present invention has excellent wettability with respect to various adherends. Accordingly, the water-based adhesive composition according to the present invention can be effectively applied to various industrial adhesive products such as adhesive films for advertisements.

Abstract: Disclosed herein are an adhesive sheet comprising a cured acrylic polymer, hollow polymeric microspheres dispersed and ruptured in the cured acrylic polymer, and hollow parts formed by rupturing the hollow polymeric microspheres dispersed in the cured acrylic polymer, and a preparation method thereof.

Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Abstract: The present invention provides a display apparatus comprising a display panel; a heat radiating member provided behind the display panel; and a heat conductive adhesive sheet, which is disposed between the display panel and the heat radiating member, and is capable of absorbing an electromagnetic wave and of conducting heat, a heat conductive adhesive sheet for the display apparatus, and a process for preparing the same.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of buns during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to an acrylic composition for optical elements, a protective film for optical elements, a polarizer, and a liquid crystal display (LCD). According to the present invention, by adding a proper amount of an antistatic agent to a composition including a photo-polymerizable acrylic polymer, which is cured by irradiation of radial rays such as ultraviolet rays (UVs), and a polymerization initiator at a predetermined ratio, an aging process can be skipped during curing, thereby simplifying a preparation process and providing an acrylic composition for optical elements, a protective film for optical elements, a polarizer, and an LCD, which have excellent anti-static property during peeling or use, and superior endurance reliability, workability, adhesive property, wettability, and optical characteristics.

Abstract: The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure-sensitive adhesive composition comprising a) acrylic copolymers; b) a hydrophilic plasticizer; and c) a hydrophobic plasticizer. The acrylic pressure-sensitive adhesive composition according to the present invention has no mura under moisture and heat resistant condition, and thus has an excellent stain resistance of adherends, and an excellent wettability, endurance reliability, transparency and adhesion reliability, regardless of whether surface property of the adherend is hydrophillic or hydrophobic.

Abstract: The present invention relates to an acrylic pressure sensitive adhesive composition, specifically, an acrylic pressure sensitive adhesive composition having improved anti-static properties, comprising acrylic copolymers, chelating agent which may form a bond with metal ion; and alkali metal salts, and prevent whitening appearance under high temperature and humidity condition as well as static electricity without change of the durability, transparency, and adhesion.

Abstract: The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.