Patents by Inventor Jason Mark Thelander

Jason Mark Thelander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210078329
    Abstract: A printhead module includes: an ink manifold defining a plurality of ink supply channels, the ink manifold having first and second opposite faces; a plurality of print chips mounted on the first face, each print chip receiving ink from a respective ink supply channel via a set of ink outlets defined in the first face; first PCBs mounted on the first face of the ink manifold, each print chip being electrically connected to a respective first PCB; and second PCBs mounted on the second face of the ink manifold. The first and second PCBs are connected via electrical connectors extending through longitudinal slots defined in the substrate.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Jason Mark Thelander, David Oliver Burke
  • Publication number: 20210078327
    Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row, each printhead module having at least four rows of print chips configured for printing at least four different inks, each print chip having multiple nozzle rows for redundant printing of a respective ink. A print zone of the printhead has a width of less than 100 mm in a media direction.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Jason Mark Thelander, David Oliver Burke
  • Publication number: 20210078328
    Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of longitudinal ink supply channels; a plurality of print chips mounted on a first face of the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger having an ink port extending away from a second face of the substrate opposite the first face, each ink port being in fluid communication with a respective ink supply channel Each ink supply channel is connected to a respective pair of ink ports at opposite ends of each printhead module and the fingers of neighboring printhead modules are interdigitated such that the ink ports of neighboring printhead modules overlap.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Jason Mark Thelander, David Oliver Burke
  • Publication number: 20210078326
    Abstract: A printhead module includes a monolithic substrate having a plurality of rows of print chips mounted thereon. Each row of print chips receives power and data through a respective longitudinal slot defined through a thickness of the substrate, each longitudinal slot extending parallel with and offset from the rows of print chips.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Jason Mark Thelander, David Oliver Burke
  • Publication number: 20210078325
    Abstract: A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of ink supply channels; a plurality of print chips mounted on the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger comprising at least a portion of a respective print chip. The fingers of neighboring printhead modules are interdigitated such that print chips of neighboring printhead modules overlap and the portion of the print chip contained in a respective finger is positioned towards one lateral edge of the finger.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Jason Mark Thelander, David Oliver Burke
  • Publication number: 20210078322
    Abstract: A modular inkjet printhead includes: a plurality of printhead modules arranged end on end in a row; an elongate support structure extending a length of the printhead for holding the printhead modules; and an ink carrier extending alongside the support structure and laterally spaced from the printhead modules, the ink carrier being fluidically connected to each of the printhead modules via a plurality of ink connectors extending laterally therefrom; and a pair of elongate busbars extending longitudinally along a roof of the ink carrier, each busbar being electrically connected to each of the printhead modules via a pair of respective connector straps extending transversely therefrom, the busbars supplying power to each of the printhead modules.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventors: Jason Mark Thelander, David Oliver Burke
  • Publication number: 20200338901
    Abstract: An ink delivery system for an inkjet printer includes: (a) an ink delivery module for supplying and receiving ink in a circulating fluidic loop having positive and negative pressure ink lines; (b) print modules interconnected between the positive pressure ink line and the negative pressure ink line. The ink delivery module has regulator pumps for gross control of ink pressure in the print modules; and each print module has a respective pressure control system for dynamic fine control of ink pressure in each individual print module.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 29, 2020
    Inventors: Craig MEYER, Jason Mark THELANDER, Mark PROFACA, Stuart WHEATLEY
  • Patent number: 8701276
    Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: April 22, 2014
    Assignee: Zamtec Ltd
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, Peter John Morley Sobey, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell
  • Patent number: 8689612
    Abstract: A pressure-based tester for testing an integrity of a printhead integrated circuit (IC) carrier includes a housing assembly; a cradle assembly coupled to the housing assembly and adapted to receive the printhead IC carrier, the cradle assembly further defining spouts adapted to engage with the printhead IC carrier; a regulated gas supply arranged in the housing assembly; a first gas supply line in fluid communication with the regulated gas supply; a pneumatic retaining mechanism in fluid communication with the gas supply via the first gas supply line, the pneumatic retaining mechanism for retaining the carrier in fluid communication with the spouts during testing of the platform assembly; a second gas supply line in fluid communication with the regulated gas supply, the second gas supply line being separated from the first gas supply line by a pressure regulator, the second gas supply line for supplying gas to the spouts; a pressure sensor for measuring a gas pressure at each spout and generating a signal ind
    Type: Grant
    Filed: June 5, 2011
    Date of Patent: April 8, 2014
    Assignee: Zamtec Ltd
    Inventors: Stephen John Sleijpen, Joseph Tharion, Jan Waszczuk, Eric Patrick O'Donnell, William Granger, David Bernardi, Stephen Richard O'Farrell, Jason Mark Thelander
  • Patent number: 8454106
    Abstract: A continuous web printer that has an inlet for receiving a web of media from a media web roll unwinder, an outlet for delivery to a media web roll winder, a media feed path extending from the inlet to the outlet, a plurality of pagewidth inkjet printhead assemblies positioned adjacent the media feed path for printing on both sides of the web and a central processor for inputting print data to the pagewidth inkjet printhead assemblies such that during a print run, the pagewidth inkjet printhead assemblies print many copies of a document The central processor is configured to selectively alter one or more of the copies to be non-identical to the remainder of the copies without interruption to the print run.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: June 4, 2013
    Assignee: Zamtec Ltd
    Inventors: Kia Silverbrook, Mark Profaca, Craig Donald Strudwicke, Jason Mark Thelander
  • Patent number: 8398231
    Abstract: A continuous web printer that has an inlet for receiving a web of media from a media web roll unwinder, an outlet for delivery to a media web roll winder, a media feed path extending from the inlet to the outlet and a plurality of pagewidth printhead assemblies for printing on both sides of the web. The media feed path has an upper print zone positioned above a lower print zone. The upper print zone is a section of the media feed path in which one side of the web is printed and the lower print zone being a section of the media feed path in which the other side of the web is printed.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: March 19, 2013
    Assignee: Zamtec Ltd
    Inventors: Kia Silverbrook, Mark Profaca, Craig Donald Strudwicke, Jason Mark Thelander
  • Patent number: 8393729
    Abstract: A continuous web printer that has an inlet for receiving a web of media from a media web roll unwinder, an outlet for delivery to a media web roll winder, an air platen frame for generating an air cushion at least partially defining a media feed path and a plurality of pagewidth inkjet printheads positioned adjacent the media feed path for printing on both sides of the web.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: March 12, 2013
    Assignee: Zamtec Ltd
    Inventors: Kia Silverbrook, Mark Profaca, Craig Donald Strudwicke, Jason Mark Thelander
  • Patent number: 8393730
    Abstract: A continuous web printer that has an inlet for receiving a web of media from a media web roll unwinder, an outlet for delivery to a media web roll winder, a plurality of pagewidth inkjet printhead assemblies for printing on both sides of the web; and a media feed path extending from the inlet to the outlet. The media feed path has a first print zone where one side of the web is printed and a second print zone where the other side of the web is printed. The first print zone and the second print zone are flat, and the first print zone is upstream from the second print zone with respect to a media feed direction.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: March 12, 2013
    Assignee: Zamtec Ltd
    Inventors: Kia Silverbrook, Mark Profaca, Craig Donald Strudwicke, Jason Mark Thelander
  • Patent number: 8296937
    Abstract: The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: October 30, 2012
    Assignee: Silverbrook Research Pty Ltd
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, Peter John Morley Sobey, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell
  • Patent number: 8092625
    Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: January 10, 2012
    Assignee: Silverbrook Research Pty Ltd
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell, Peter John Morley Sobey
  • Publication number: 20110232371
    Abstract: A pressure-based tester for testing an integrity of a printhead integrated circuit (IC) carrier includes a housing assembly; a cradle assembly coupled to the housing assembly and adapted to receive the printhead IC carrier, the cradle assembly further defining spouts adapted to engage with the printhead IC carrier; a regulated gas supply arranged in the housing assembly; a first gas supply line in fluid communication with the regulated gas supply; a pneumatic retaining mechanism in fluid communication with the gas supply via the first gas supply line, the pneumatic retaining mechanism for retaining the carrier in fluid communication with the spouts during testing of the platform assembly; a second gas supply line in fluid communication with the regulated gas supply, the second gas supply line being separated from the first gas supply line by a pressure regulator, the second gas supply line for supplying gas to the spouts; a pressure sensor for measuring a gas pressure at each spout and generating a signal ind
    Type: Application
    Filed: June 5, 2011
    Publication date: September 29, 2011
    Inventors: Stephen John Sleijpen, Joseph Tharion, Jan Waszczuk, Eric Patrick O'Donnell, William Granger, David Bernardi, Stephen Richard O'Farrell, Jason Mark Thelander
  • Patent number: 8006967
    Abstract: A cradle assembly for a pressure decay leak tester is provided. The assembly operatively receives a printhead integrated circuit carrier having a plurality of printing fluid paths defined therein, respective fluid inlets in fluid communication with respective fluid paths and a locating formation to facilitate correct location of the carrier on the tester. The assembly includes at least one complementary locating formation for engaging the locating formation of the carrier, and at least one fluid outlet for charging the carrier with fluid via a respective fluid inlet of the carrier. Also included is a clamping device for clamping the carrier to the fluid outlet, so that the integrity of the fluid paths is observable via pressure decay testing, and a control system operatively connected to the clamping device for controlling operation of the clamping device.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: August 30, 2011
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Stephen John Sleijpen, Joseph Tharion, Jan Waszczuk, Eric Patrick O'Donnell, William Granger, David Bernardi, Stephen Richard O'Farrell, Jason Mark Thelander
  • Patent number: 7987699
    Abstract: A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: August 2, 2011
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Stephen John Sleijpen, Joseph Tharion, Jan Waszczuk, Eric Patrick O'Donnell, William Granger, David Bernardi, Stephen Richard O'Farrell, Jason Mark Thelander
  • Patent number: 7984640
    Abstract: The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: July 26, 2011
    Assignee: Silverbrook Research Pty Ltd.
    Inventors: Stephen John Sleijpen, Joseph Tharion, Jan Waszczuk, Eric Patrick O'Donnell, William Granger, David Bernardi, Stephen Richard O'Farrell, Jason Mark Thelander
  • Patent number: 7979979
    Abstract: The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: July 19, 2011
    Assignee: Silverbrook Research Pty Ltd
    Inventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, Peter John Morley Sobey, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell