Abstract: Provided is a method for laminating a carrier for printhead integrated circuits. The carrier includes a plurality of fiducials. The method includes the steps of receiving the carrier in a cradle platform, aligning each said fiducial with respective fiducials in a lamina having a series of such holes therein, and bonding the aligned lamina to the carrier, so that a printing fluid is able to pass through the laminated apertures after such bonding.

Abstract: The invention provides for a die picker for picking printhead integrated circuitry from a wafer. The picker includes a wafer platform having a displacement actuator to displace said platform which operatively receives the wafer, and a picker head having a vacuum mechanism to lift a dice of the circuitry from said wafer. The picker also includes an alignment sensor configured to detect a position of the dice on the wafer, and a controller arranged in control signal communication with the displacement actuator, the picker head and the sensor to facilitate aligning the wafer with the picker head, and to pick the dice from the wafer with the head for transport to a transfer apparatus.

Abstract: A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined.

Abstract: A method for testing integrated circuits mounted on a carrier includes the step of securing the carrier. The carrier is displaced into an operative position in which the integrated circuits are in physical and electrical communication with a diagnostic probe. Test signals are generated in test circuitry in electrical communication with the diagnostic probe and communicated to the integrated circuits with the diagnostic probe. The test signals are received at the test circuitry via the diagnostic probe. The test signals are made available to a controller via a communications link and an automated server and displayed with the controller.

Abstract: The invention relates to a method for testing an alignment of a carrier with respect to a plurality of integrated circuits on the carrier. The carrier has optically discernible carrier references and each integrated circuit has optically discernible circuit references.

Abstract: Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner.

Abstract: The invention provides for a dice pick and lift head for an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The dice pick and lift head includes a first translation stage mounted to the die picking assembly, said first translation stage operatively displaceable along a vertical axis relative to the support assembly. The dice pick and lift head also includes a second translation stage mounted to the first translation stage, said second translation stage operatively displaceable along a horizontal axis relative to the support assembly.

Abstract: The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly.

Abstract: The invention provides for a wafer positioning assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The wafer positioning assembly, in turn, includes a displacement assembly having a base plate with first and second stages mounted thereon, and a wafer support plate assembly rotatably mounted on the second stage. The support plate assembly is configured to receive the wafer and has a motor under control of the control system to rotate the support plate assembly underneath the die picking assembly.

Abstract: Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base.

Abstract: A cradle assembly for a pressure decay leak tester is provided. The assembly operatively receives a printhead integrated circuit carrier having a plurality of printing fluid paths defined therein, respective fluid inlets in fluid communication with respective fluid paths and a locating formation to facilitate correct location of the carrier on the tester. The assembly includes at least one complementary locating formation for engaging the locating formation of the carrier, and at least one fluid outlet for charging the carrier with fluid via a respective fluid inlet of the carrier. Also included is a clamping device for clamping the carrier to the fluid outlet, so that the integrity of the fluid paths is observable via pressure decay testing, and a control system operatively connected to the clamping device for controlling operation of the clamping device.

Abstract: The invention provides for a clamp assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The clamp assembly includes an elongate clamp body, the body shaped and configured to be received by the die placement assembly, and a pair of elongate retaining plates mounted on top of the body. The clamp also includes an insert shaped and dimensioned to be received in the body below the plates, the insert operatively receiving said carrier, as well as a diaphragm positioned in the body, the diaphragm pneumatically displaceable to operatively urge the insert against the retaining plates.

Abstract: The invention provides for a safety system for a measuring apparatus for measuring positions of integrated circuits on an integrated circuit carrier positioned, in use, in a working enclosure of the apparatus. The safety system includes a sensor arrangement for sensing an operational status of the measuring apparatus, and an emergency cut-off configured to deactivate the measuring apparatus automatically when an undesired operational status is sensed by the sensor arrangement. A control system is connected to the sensor arrangement and the emergency cut-off to activate the emergency cut-off on receipt of a predetermined signal from the sensor arrangement.

Abstract: The invention relates to an assembler for assembling printhead integrated circuitry on a carrier. The assembler includes a support assembly, a wafer positioning assembly arranged on the support assembly and configured to retain and position a wafer defining a plurality of die to be picked from the wafer; and a die picking assembly arranged on the support assembly and configured to pick a pre-selected dice from the wafer. The assembler also includes a die placement assembly arranged on the support assembly and configured to receive the pre-selected dice and to place the dice on the carrier, and a die conveyance mechanism arranged on the support assembly and configured to convey the dice from the die picking assembly to the die placement assembly. Further included is a control system operatively engaged with the wafer positioning, die picking, die placement and die conveyance assemblies to control operation thereof.

Abstract: The invention provides for a system for testing integrated circuitry. The system includes a local computational device, a communications link connected to the computational device, and testing circuitry operatively connected to the computational device via the communications link and configured to generate integrated circuitry test signals. The system also includes adaptor circuitry connected to the testing circuitry and configured to provide an electrical and physical interface with the integrated circuits, as well as routing circuitry interposed between the testing and adaptor circuitry to rout the test signals to respective dies of the integrated circuits. Also included is a handling mechanism for retaining and manipulating a carrier on which the integrated circuits are positioned, and a controller operatively connected to the handling mechanism for controlling operation thereof and connected to the communications device for supervision by the computational device.

Abstract: The invention provides for an imaging apparatus for imaging integrated circuits and a respective integrated circuit carrier. This enables positional analysis to be carried out on the integrated circuits and respective carrier. The imaging apparatus includes a support structure, and a bed mounted on the support structure and displaceable along an operatively horizontal axis, the bed being configured to support a nest assembly that operatively retains the integrated circuit carrier and respective integrated circuits. Also included is a support assembly operatively mountable with respect to a bed on which the integrated circuit carrier and integrated circuits are supported, in use. The apparatus further includes an image recordal device mounted on the support assembly and configured to record an image representing the integrated circuit carrier and integrated circuits, the support assembly including an adjustment mechanism to enable adjustment of a position of the image recordal device relative to the bed.

Abstract: The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: The invention provides for a diagnostic probe assembly for a tester which is used to diagnose printhead integrated circuits. The probe assembly includes a support assembly and a controller board mounted on the support assembly and having a processor configured to generate test signals for testing a printhead integrated circuit. A routing board is in operative signal communication with the controller board and is configured to multiplex the generated test signals for respective dies of the printhead integrated circuits. The probe assembly also includes a probe interface in signal communication with the routing board and configured for relaying the multiplexed test signals to and from the respective dies.

Abstract: The invention relates to a laminating apparatus for laminating a printhead integrated circuit (IC) carrier sub-assembly and a lamination film. The apparatus includes a lamination support for receiving the carrier, a lamina supply for supplying a lamina defining said lamination film, and an alignment mechanism configured to align the lamination film with the IC carrier sub-assembly. Also included is a bonding apparatus configured to bond the lamination film to the IC carrier sub-assembly, and a control system to control operation of the lamina supply, alignment mechanism and bonding apparatus to facilitate automatic bonding of the lamination film to the surface of the carrier.