Abstract: A method of removing MEMS devices (2) from a handle substrate (1), where the MEMS devices are individually bonded to it via a thermal release adhesive (3) that reduces its adhesion when heated above a threshold temperature. The method heats the MEMS devices (2) individually with a heat source (10) to conductively heat the thermal release adhesive (11) above the threshold temperature. With the adhesive (11) directly in contact with the back side (5) of the MEMS device (2) no longer bonding it to the glass handle (1), the devices (2) can be individually removed by a die picker (6). This method quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, heating the die by conduction, will in turn conductively heat the adhesives that only that adhesive which is closely localized to the die is released. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.

Abstract: A device for removing MEMS devices (2) from a handle substrate (1), where the MEMS devices are individually bonded to it via a thermal release adhesive (3) that reduces its adhesion when heated above a threshold temperature. The MEMS devices (2) are individually heated with a heat source (10) to conductively heat the thermal release adhesive (11) above the threshold temperature. With the adhesive (11) directly in contact with the back side (5) of the MEMS device (2) no longer bonding it to the glass handle (1), the devices (2) can be individually removed by a die picker (6). This quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, by heating the die to conductively heat the adhesive, only that adhesive which is closely localized to the die is heated. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.

Abstract: A device for removing MEMS devices (2) from a handle substrate (1), where the MEMS devices are individually bonded to it via a thermal release adhesive (3) that reduces its adhesion when heated above a threshold temperature. The MEMS devices (2) are individually heated (16) to conductively heat the thermal release adhesive (11) above the threshold temperature. With the adhesive (11) directly in contact with the back side (5) of the MEMS device (2) no longer bonding it to the glass handle (1), the devices (2) can be individually removed by a die picker (6). This quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, by heating the die to conductively heat the adhesive, only that adhesive which is closely localized to the die is heated. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.