Abstract: The present disclosure relates generally to microneedle devices and methods for fabricating microneedles from a biocompatible polymer using photolithography. More particularly, aspects of the present disclosure are directed to the fabrication of microneedle devices using a biocompatible polymer (biopolymer) by way of biocompatible, essentially biocompatible, or substantially biocompatible fabrication techniques.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a conformal lid to improve the chip package assembly from deformation. In one example, a chip package assembly is provided that includes integrated circuit (IC) dies, a packaging substrate, and a lid. The packaging substrate has a die receiving area that is defined by the laterally outermost extents of the IC dies mounted to the packaging substrate. The lid a surface that includes a first region and a second region. The first region is disposed over the first IC die while the second region of the lid extends below the second surface the first IC die and is spaced above the packaging substrate. At least a portion of the second region of the lid is overlapped with the die receiving area.

Abstract: A method for automatically managing a plurality of slides associated with a slide-deck is provided. The method may include adding the plurality of slides to a computing system. The method may also include analyzing at least one slide within the plurality of slides. The method may further include generating a list including at least one key word or at least one tag based on the analyzing. The method may include matching the at least one key word or the at least one tag against at least one key word or at least one tag saved on a presentation server. The method may also include fetching at least one slide or at least one slide-deck from the presentation server based on the matching. The method may further include displaying the at least one fetched slide or the at least one fetched slide-deck on a user interface.

Abstract: Structured data archival with reduced downtime is disclosed. One example is a system including a deployer that manages an active table (AT), and a non-active table (NAT), and creates an intermediate table (IT) to record, during data archival, changes to the data to be archived. The deployer creates triggers on the AT and the NAT to facilitate the record, by the IT, of the changes to the data to be archived. An archiver initiates the data archival by archiving the copy of the data to be archived from the NAT, merges the recorded data from the IT to the NAT upon receiving an indication that the client access to the AT is not enabled, and switches the client access from the AT to the NAT by changing a table synonym, where the client access to the NAT is enabled upon completion of the data archival.

Abstract: A method is shown for allocating a plurality of channels to a plurality of radio nodes (RNs) in a radio access network (RAN). In accordance with the method, an initial RN is selected from among the plurality of RNs. A first of the plurality of channels is assigned to the initial RN. The first channel is selected such that external interference experienced by the initial RN from sources other than the RAN on the first channel is minimized. A second RN is selected from among the plurality of RNs. A second of the plurality of channels is assigned to the second RN. The second channel is selected such that a metric reflective of an information carrying capacity of the RNs that have already been assigned one of the plurality of channels is maximized. The assigned channels are allocated to the respective RNs to which they have been assigned.

Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.

Abstract: A method for automatically managing a plurality of slides associated with a slide-deck is provided. The method may include adding the plurality of slides to a computing system. The method may also include analyzing at least one slide within the plurality of slides. The method may further include generating a list including at least one key word or at least one tag based on the analyzing. The method may include matching the at least one key word or the at least one tag against at least one key word or at least one tag saved on a presentation server. The method may also include fetching at least one slide or at least one slide-deck from the presentation server based on the matching. The method may further include displaying the at least one fetched slide or the at least one fetched slide-deck on a user interface.

Abstract: A method for automatically managing a plurality of slides associated with a slide-deck is provided. The method may include adding the plurality of slides to a computing system. The method may also include analyzing at least one slide within the plurality of slides. The method may further include generating a list including at least one key word or at least one tag based on the analyzing. The method may include matching the at least one key word or the at least one tag against at least one key word or at least one tag saved on a presentation server. The method may also include fetching at least one slide or at least one slide-deck from the presentation server based on the matching. The method may further include displaying the at least one fetched slide or the at least one fetched slide-deck on a user interface.

Abstract: A method for assessing an impact of a design choice on a system level performance metric of a radio access network (RAN) deployed in an environment includes receiving messages from a plurality of UEs over time by a plurality of RNs in the RAN. A design choice is selected for a set of operating parameters of the RAN. One or more of measurement values in each of the received messages and the selected design choice are processed to compute a set of derivatives. A system level performance metric is determined as a function of the computed set of derivatives.

Abstract: A method is shown for allocating a plurality of channels to a plurality of radio nodes (RNs) in a radio access network (RAN). In accordance with the method, an initial RN is selected from among the plurality of RNs. A first of the plurality of channels is assigned to the initial RN. The first channel is selected such that external interference experienced by the initial RN from sources other than the RAN on the first channel is minimized. A second RN is selected from among the plurality of RNs. A second of the plurality of channels is assigned to the second RN. The second channel is selected such that a metric reflective of an information carrying capacity of the RNs that have already been assigned one of the plurality of channels is maximized. The assigned channels are allocated to the respective RNs to which they have been assigned.

Abstract: An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.

Abstract: Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.

Abstract: Methods and apparatus are described for enabling copper-to-copper (Cu—Cu) bonding at reduced temperatures (e.g., at most 200° C.) by significantly reducing Cu oxide formation. These techniques provide for faster cycle time and entail no extraordinary measures (e.g., forming gas). Such techniques may also enable longer queue (Q) or staging times. One example semiconductor structure generally includes a semiconductor layer, an adhesion layer disposed above the semiconductor layer, an anodic metal layer disposed above the adhesion layer, and a cathodic metal layer disposed above the anodic metal layer. An oxidation potential of the anodic metal layer may be greater than an oxidation potential of the cathodic metal layer. Such a semiconductor structure may be utilized in fabricating IC packages implementing 2.5D or 3D integration.

Abstract: Systems and methods are disclosed that provide a closed loop power control system including adaptively adjusting the desired target SINR over time so as to ultimately achieve a feasible SINR. In one implementation, a method is provided of optimizing uplink closed loop power control in a RAN in which one or more base stations each service a plurality of mobile stations, including: determining a power level for each mobile station for its respective uplink transmissions, including measuring a current achieved SINR for each mobile station; and for each mobile station, adjusting the power level to be sufficiently high to meet desired transmission characteristics but not so high as to cause unnecessary interference with transmissions from other mobile stations, by adjusting a desired target SINR based on factors selected from the following: current and prior achieved SINRs, current and prior interference measurements, and current and prior transmission power control commands.

Abstract: Methods and systems for enabling multiple mobile devices to access an access gateway when at least one of the multiple mobile devices is unable to establish a virtual private network connection with the access gateway are described herein. For example, in some embodiments, a mobile device may configure itself as a member of a mesh network. A virtual private network connection may be established between the mobile device and the access gateway. The mesh network may include one or more other member devices that are unable to establish a virtual private network with the access gateway. After completing its configuration, the mobile device may receive, over a peer-to-peer connection of the mesh network, data that is intended for the access gateway and that is from one of the other member devices. The mobile device may transmit the data to the access gateway via the virtual private network connection.

Abstract: Identification of a power source in a multiple power source scenario and characterization of loads. Embodiments herein relate to loads being supplied by multiple power sources and more particularly to identifying the power source supplying power to the load. Embodiments herein disclose a method and system for determining a power source providing power to a load, wherein the load is connected to a plurality of power sources. Disclosed herein is a method and system for characterizing at least one load currently connected to at least one power supply.

Abstract: An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.

Abstract: A vehicle includes a side member that extends in a vehicle longitudinal direction. A rocker support extends in the vehicle longitudinal direction and is spaced outboard of the side member in the vehicle lateral direction. A C-pillar assembly is coupled to and extends upward from the rocker support. A floor cross member extends in a vehicle lateral direction that is connected to the side member. A pillar assembly to floor cross member reinforcement gusset links the C-pillar assembly and the floor cross member.

Abstract: Systems and methods are disclosed that provide a closed loop power control system including adaptively adjusting the desired target SINR over time so as to ultimately achieve a feasible SINR. In one implementation, a method is provided of optimizing uplink closed loop power control in a RAN in which one or more base stations each service a plurality of mobile stations, including: determining a power level for each mobile station for its respective uplink transmissions, including measuring a current achieved SINR for each mobile station; and for each mobile station, adjusting the power level to be sufficiently high to meet desired transmission characteristics but not so high as to cause unnecessary interference with transmissions from other mobile stations, by adjusting a desired target SINR based on factors selected from the following: current and prior achieved SINRs, current and prior interference measurements, and current and prior transmission power control commands.

Abstract: Projects may be recalled by a system based on a selection of a screenshot associated with the project. A request to access a project, by a selection of a screenshot from a group of screenshots may be received. The screenshot may be mapped to a particular workspace location, and it may be associated with trace data stored in a file. The associated trace data may be identified by the system, and the trace data can be read. Using the trace data, the system can access the project associated with the screenshot and launch the workspace and the project.